Patents by Inventor Dae Hwan Kim

Dae Hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200375919
    Abstract: The present disclosure relates to a bone graft material grafted with 4-hexylresorcinol affecting bone formation, the bone graft material which not only can rapidly promote bone formation by mixing hydrous ethanol having low concentration 4-hexylresorcinol dissolved therein and a base material for release control with distilled water or a salt-dissolved aqueous solution to obtain a mixed solution and precipitating a bone graft material into the mixed solution, thereby injecting 4-hexylresorcinol into the bone graft material, but also can have a consistent treatment effect by adjusting elution amount of 4-hexylresorcinol through the base material for release control, thereby allowing 4-hexylresorcinol to be slowly released during a treatment period.
    Type: Application
    Filed: May 27, 2020
    Publication date: December 3, 2020
    Applicants: MANTIZ LOGITECH CO., LTD., BONEGENE.co.,Ltd.
    Inventors: Dae Chul CHO, Je Yong CHOI, Seong Hwan KIM, Ki Young KIM
  • Publication number: 20200378876
    Abstract: The clarity method for biotissue using a biotissue clearing agent including CHAPS of the present invention enables fast tissue clarity without denaturation.
    Type: Application
    Filed: February 23, 2018
    Publication date: December 3, 2020
    Applicant: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Sun Hyun Park, Ki-Suk Kim, Dae-hwan Nam
  • Patent number: 10856144
    Abstract: The present disclosure is related to technology for a sensor network, machine to machine (M2M) communication, machine type communication (MTC), and Internet of Things (IoT). Provided is a method, performed by a server, of transmitting and receiving data, in which, as a transmission authority request is received from at least one terminal from among a plurality of terminals connected to the server, a number of transmitting terminals previously determined by the server is compared with a maximum number of transmitting terminals allowable by the server, in response to the transmission authority request, and a transmission authority of the at least one terminal is determined based on a result of the comparing. The present disclosure are applicable to intelligent services based on the technology (e.g., smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security, and safety-related service).
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: December 1, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jong-hyuk Jang, Mun-hwan Choi, Dae-hyung Kwon, Yong-tae Kim
  • Patent number: 10853503
    Abstract: An operation method for an electronic device is disclosed. The operation method for an electronic device according to an embodiment may comprise the steps of: configuring a block layer for virtualizing a storage on a volatile memory as a block device; storing a file in the configured block layer in units of blocks; selectively encoding, in a unit of at least one block, the file which has been stored in units of blocks; and storing at least one of an encoded block and a non-encoded block in the storage.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: December 1, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-Joong Lee, Yeong-Jin Gil, Sung-Hwan Yun, Ki-Tae Lee, Dae-Ho Jeong, Min-Jung Kim
  • Publication number: 20200367747
    Abstract: The present disclosure relates to a retina imaging method in which a light from a light source into two lights is dispersed, at least one eyeground image of the eyeball at a first magnification is obtained by adjusting the paths of the two lights incident on the eyeball, and a plurality of DIC images are obtained at a second magnification higher than the first magnification with respect to the retina of the entirety of the obtained at least one eyeground image by adjusting the paths of the two lights incident on the eyeball.
    Type: Application
    Filed: February 26, 2020
    Publication date: November 26, 2020
    Inventors: Jae Hun Kim, Dae Yu Kim, Seok Hwan Kim, Youngho Cho, Byeongho Park, Hyo-suk Kim, Subeen Park, Kyoung Min Lee
  • Patent number: 10843173
    Abstract: A ferrite catalyst for oxidative dehydrogenation and a method of preparing the same. The ferrite catalyst is prepared using an epoxide-based sol-gel method, wherein a step of burning includes a first burning step, in which burning is performed at a temperature of 70 to 200° C.; and a second burning step, in which burning is performed after the temperature is raised from a temperature in the range of greater than 200° C. to 250° C. to a temperature in the range of 600 to 900° C.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: November 24, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Sun Hwan Hwang, Dong Hyun Ko, Jun Han Kang, Kyong Yong Cha, Joo Hyuck Lee, Hyun Seok Nam, Dae Heung Choi, Myung Ji Suh, Ye Seul Hwang, Jun Kyu Han, Sang Jin Han, Seong Min Kim
  • Patent number: 10847808
    Abstract: A method for manufacturing a fuel cell electrode includes forming a first mixture by mixing a first cation exchange resin, a metal catalyst, and a first solvent, powderizing the first mixture to produce a first catalyst powder comprising the metal catalyst coated with the first cation exchange resin, forming a second mixture by mixing the first catalyst powder, a second cation exchange resin, and a second solvent, powderizing the second mixture to produce a catalyst powder having a core and two or more layers of shells and being coated with the second cation exchange resin, mixing the catalyst powder having the core and two or more layers of shells with a third solvent to produce a catalyst slurry, and coating, using the catalyst slurry, to produce an electrode.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: November 24, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Yoon Hwan Cho, Su Won Seol, Ji Hoon Yang, Young Taek Kim, Dae Yong Son
  • Patent number: 10843170
    Abstract: A superabsorbent polymer having high centrifuge retention capacity and absorption rate prepared by using a particular foam stabilizer and a polymerization initiator. The foam stabilizer includes a sucrose ester and a polyalkylene oxide, and polymerization initiator includes a photoinitiator and a cationic azo-based initiator.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 24, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Yeon Woo Hong, Seong Beom Heo, Hyung Ki Yoon, Dae Woo Nam, Tae Hwan Jang, Jun Kyu Kim, Bo Hyun Seong, Su Jin Kim, Seon Jung Jung, Ji Yoon Jeong
  • Patent number: 10845986
    Abstract: Provided is a method of controlling an electronic device by using a remote control device comprising a touch screen, the method including selecting one of a plurality of functions supported by the electronic device via the touch screen, sequentially displaying a plurality of user interfaces, usable for controlling the function selected with an input detected by the touch screen, one-by-one, and controlling the electronic device by using one of the plurality of user interfaces that are sequentially displayed.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae-Hyun Kim, Seung-dong Yu, Woo-yong Chang, Eun-hee Park, Chang-hwan Hwang
  • Publication number: 20200365815
    Abstract: The organic electric element comprising a compound represented by Formula 1 as material of an emission-auxiliary layer and an electronic device thereof are disclosed, and by comprising the compound represented by Formula 1 in an emission-auxiliary layer, the driving voltage of the organic electric element can be lowered, and the luminous efficiency and life time of the organic electric element can be improved.
    Type: Application
    Filed: October 12, 2018
    Publication date: November 19, 2020
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Dae Hwan OH, Dae Sung KIM, Moo Jin PARK, Jeong Seok KIM, Sun Hee LEE
  • Patent number: 10840374
    Abstract: A method of forming a semiconductor device can be provided by forming an opening that exposes a surface of an elevated source/drain region. The size of the opening can be reduced and a pre-amorphization implant (PAI) can be performed into the elevated source/drain region, through the opening, to form an amorphized portion of the elevated source/drain region. A metal-silicide can be formed from a metal and the amorphized portion.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 17, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chung-Hwan Shin, Sang-Bom Kang, Dae-Yong Kim, Jeong-Ik Kim, Chul-Sung Kim, Je-Hyung Ryu, Sang-Woo Lee, Hyo-Seok Choi
  • Publication number: 20200353940
    Abstract: A method for protecting a person left in a vehicle includes determining whether the person present on a rear seat is an infant, by using a waveform of a reflected wave generated by a radar sensor after an ignition of the vehicle is turned off, determining a risk level when the person on the rear seat is determined to be the infant, and taking a first step measure that corresponds to a risk factor, when the risk level indicates a possibility of danger to the person.
    Type: Application
    Filed: October 29, 2019
    Publication date: November 12, 2020
    Inventors: Gyun Ha Kim, Dae Yun An, Eung Hwan Kim, Eun Young Choi, Seul Ki Jeon
  • Publication number: 20200356170
    Abstract: A convenient device control apparatus for a vehicle and a method thereof are provided. The convenient device control apparatus includes a light source that emits light at a specified frequency and an electroencephalogram (EEG) sensor that measures an EEG signal of a user. An EEG analyzer analyzes a frequency of the EEG signal measured by the EEG sensor and a controller operates a convenient device in the vehicle based on the frequency of the EEG signal analyzed by the EEG analyzer.
    Type: Application
    Filed: August 28, 2019
    Publication date: November 12, 2020
    Inventors: Dae Yun An, Eung Hwan Kim, Gyun Ha Kim, Seul Ki Jeon
  • Publication number: 20200348741
    Abstract: A semiconductor device and a power-off method of the semiconductor device, the semiconductor device including a first power source group including first and second power sources, a second power source group including a third power source and a power sequence controller. The power sequence controller performs power-on operations and power-off operations of the first to third power sources. The power sequence controller starts a power-off operation of the first power source group at a first time, and starts a power-off operation of the second power source group when the power voltage of the first power source group becomes a first voltage or when a first reference time has passed from the first time.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Inventors: HO-YEON JEON, DAE HWAN KIM, YOUNG HOON LEE
  • Publication number: 20200348557
    Abstract: An optical film for a display device includes: a base layer; a pattern layer disposed on the base layer and having a repeating pattern of valleys and peaks; a plurality of first elongated scattering members disposed on upper surfaces of the valleys; and a cover layer having a shape that is complementary to and coupled with the repeating pattern of valleys and peaks, with the elongated scattering members being disposed between the pattern layer and the cover layer.
    Type: Application
    Filed: April 1, 2020
    Publication date: November 5, 2020
    Inventors: Dae Won KIM, Yukihiro MIYAZAWA, Seung Hee LEE, Kyung Hwan JEON
  • Patent number: 10824224
    Abstract: A VR motion simulator allowing a user to experience a vertical motion in VR environment by analyzing a pressure distribution of a sole of the user and estimating a posture of the user, and a method of implementing a vertical motion action of a user in VR. The simulator includes a pressure distribution image generating module generating a pressure distribution image of a sole of a user at a time of a vertical motion of the user; a sole position tracking module analyzing the pressure distribution image to detect the sole of the user, and track a position of the sole on the basis of movement of the detected sole to output sole position tracking information; and a posture estimating module estimating a posture of the user on the basis of the sole position tracking information to output posture estimation information.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: November 3, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dae Hwan Kim, Su Ran Park, Ki Hong Kim
  • Publication number: 20200339769
    Abstract: Disclosed herein are a polyamide-imide film which is transparent and exhibits superior mechanical properties such as surface hardness, etc. and a method of preparing the same. The polyamide-imide film a copolymer of an aromatic diamine, an aromatic dianhydride, and an aromatic dicarbonyl compound, wherein the aromatic diamine and the aromatic dianhydride forms an imide unit; the aromatic diamine and the aromatic dicarbonyl compound forms an amide unit; and the amide unit accounts for 50-70 mol % of 100 mol % of the units of the copolymer, thereby exhibiting transparency and superior mechanical properties including surface hardness.
    Type: Application
    Filed: April 11, 2017
    Publication date: October 29, 2020
    Inventors: Jin Woo LEE, Dong Jin LIM, Jae In AHN, Jong Ho LEE, Sang Il KIM, Sun Hwan KIM, Dae Sung OH, Dawoo JEONG
  • Publication number: 20200343163
    Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.
    Type: Application
    Filed: July 10, 2020
    Publication date: October 29, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Patent number: 10818621
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member; and an under-bump metal layer including an external connection pad formed on the passivation layer and a plurality of vias connecting the external connection pad and the redistribution layer of the second interconnection member to each other, wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chi
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Hwan Lee, Hyoung Joon Kim, Dae Jung Byun
  • Patent number: 10811341
    Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: October 20, 2020
    Assignee: Amkor Technology Singapore Holding Pte Ltd.
    Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho