Patents by Inventor Dae-hyun RYU

Dae-hyun RYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220074172
    Abstract: Proposed is a combined structure, and the combined structure includes a coupling target object having a coupling space that comprises a first space and a second space communicating with each other, a damper structure accommodated in the first space and including a flexible portion having a hollow therein and a hard portion coupled to the flexible portion and having one surface exposed to an outside, and a coupling unit accommodated in the second space, a portion of which is in contact with one surface of the hard portion. The hollow is closed from the outside in the damper structure. In response to rotation of the coupling unit in the second space, another portion different from the portion of the coupling unit comes into contact with the hard portion.
    Type: Application
    Filed: August 6, 2021
    Publication date: March 10, 2022
    Inventors: Keun Chul SONG, Dae Hyun RYU, Hyun Soo LEE
  • Patent number: 10954656
    Abstract: A tooth for a bucket of an excavator includes a point body having a hollow insertion recess and having a pair of coupling holes provided at positions facing each other on the opposite sides, and a pair of connection units respectively inserted into the pair of coupling holes and having a unit body and a protrusion protruding from the unit body, wherein the point body includes: a guide portion positioned in each of the coupling holes and guiding a rotational operation of the protrusion, a fixing portion fixing a position of each of the inserted connection unit, a buffer portion positioned between the fixing portion and an inner surface of the point body and surrounding the fixing portion, and a support where the fixing portion and the buffer portion are positioned.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: March 23, 2021
    Assignee: SUNGBO INDUSTRIAL CO., LTD.
    Inventors: Keun Chul Song, Dae Hyun Ryu, Chang Woo Lim, Hwa Yong Shin, Ryun Han Lee
  • Patent number: 10461778
    Abstract: An apparatus and method for interleaving and puncturing are provided. The apparatus includes: an interleaver formed of a plurality of columns and rows, configured to perform interleaving by writing bits input to the interleaver in the plurality of columns and reading the bits from each row of the plurality of columns in which the bits are written; and a puncturer configured to puncture a predetermined number of bits among the bits read from the interleaver.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: October 29, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hong-sil Jeong, Sang-hyo Kim, Kyung-joong Kim, Se-ho Myung, Jong-hwan Kim, Dae-hyun Ryu, Min Jang
  • Publication number: 20190203445
    Abstract: A tooth for a bucket of an excavator includes a point body having a hollow insertion recess and having a pair of coupling holes provided at positions facing each other on the opposite sides, and a pair of connection units respectively inserted into the pair of coupling holes and having a unit body and a protrusion protruding from the unit body, wherein the point body includes: a guide portion positioned in each of the coupling holes and guiding a rotational operation of the protrusion, a fixing portion fixing a position of each of the inserted connection unit, a buffer portion positioned between the fixing portion and an inner surface of the point body and surrounding the fixing portion, and a support where the fixing portion and the buffer portion are positioned.
    Type: Application
    Filed: October 11, 2018
    Publication date: July 4, 2019
    Inventors: Keun Chul SONG, Dae Hyun RYU, Chang Woo LIM, Hwa Yong SHIN, Ryun Han LEE
  • Patent number: 10329742
    Abstract: Provided is a bucket tooth of an excavator which is capable of raising a fastening force between a tooth adapter and a tooth point, and facilitating assembling and disassembling operations. The bucket tooth of an excavator, includes: a tooth adapter including an adapter body having an insert integrally protruding from a front end thereof and a mounting part formed at a rear end thereof, the mounting part being mounted on a bucket of the excavator; and a tooth point including an excavation part integrally protruding from a front end of a point body and used for excavating a ground surface, the point body having an insert groove into which the insert of the tooth adapter is inserted.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: June 25, 2019
    Assignee: SUNGBO INDUSTRIAL CO., LTD.
    Inventors: Dae Hyun Ryu, Chang Woo Lim
  • Publication number: 20190048561
    Abstract: Provided is a bucket tooth of an excavator which is capable of raising a fastening force between a tooth adapter and a tooth point, and facilitating assembling and disassembling operations. The bucket tooth of an excavator, includes: a tooth adapter including an adapter body having an insert integrally protruding from a front end thereof and a mounting part formed at a rear end thereof, the mounting part being mounted on a bucket of the excavator; and a tooth point including an excavation part integrally protruding from a front end of a point body and used for excavating a ground surface, the point body having an insert groove into which the insert of the tooth adapter is inserted.
    Type: Application
    Filed: December 6, 2017
    Publication date: February 14, 2019
    Inventors: Dae Hyun Ryu, Chang Woo Lim
  • Publication number: 20170230063
    Abstract: An apparatus and method for interleaving and puncturing are provided. The apparatus includes: an interleaver formed of a plurality of columns and rows, configured to perform interleaving by writing bits input to the interleaver in the plurality of columns and reading the bits from each row of the plurality of columns in which the bits are written; and a puncturer configured to puncture a predetermined number of bits among the bits read from the interleaver.
    Type: Application
    Filed: April 28, 2017
    Publication date: August 10, 2017
    Applicants: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVER SITY
    Inventors: Hong-sil JEONG, Sang-hyo KIM, Kyung-joong KIM, Se-ho MYUNG, Jong-hwan KIM, Dae-hyun RYU, Min JANG
  • Patent number: 9660669
    Abstract: An encoding apparatus which performs encoding such as Low Density Parity Check (LDPC) encoding is provided. The encoding apparatus includes: an encoder encoding input bits using a parity check matrix including a plurality of blocks, each being formed of a first information word sub-matrix and a first parity sub-matrix arranged next to each other, and a second information sub-matrix and a second parity sub-matrix arranged next to each other; a bit determiner determining a value of a last sub-parity bit among sub-parity bits generated by encoding the input bits with respect to a first block among the plurality of blocks; and a bit modifier reversing values of bits generated by encoding the input bits with respect to a second block next to the first block based on the value of the last parity bit among the sub-parity bits generated by the encoding with respect to the first block.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: May 23, 2017
    Assignees: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hong-sil Jeong, Sang-hyo Kim, Kyung-joong Kim, Se-ho Myung, Jong-hwan Kim, Dae-hyun Ryu, Min Jang
  • Patent number: 9641198
    Abstract: An apparatus and method for interleaving and puncturing are provided. The apparatus includes: an interleaver formed of a plurality of columns and rows, configured to perform interleaving by writing bits input to the interleaver in the plurality of columns and reading the bits from each row of the plurality of columns in which the bits are written; and a puncturer configured to puncture a predetermined number of bits among the bits read from the interleaver.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: May 2, 2017
    Assignees: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hong-sil Jeong, Sang-hyo Kim, Kyung-joong Kim, Se-ho Myung, Jong-hwan Kim, Dae-hyun Ryu, Min Jang
  • Publication number: 20150333769
    Abstract: An apparatus and method for interleaving and puncturing are provided. The apparatus includes: an interleaver formed of a plurality of columns and rows, configured to perform interleaving by writing bits input to the interleaver in the plurality of columns and reading the bits from each row of the plurality of columns in which the bits are written; and a puncturer configured to puncture a predetermined number of bits among the bits read from the interleaver.
    Type: Application
    Filed: January 23, 2015
    Publication date: November 19, 2015
    Applicants: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hong-sil JEONG, Sang-hyo KIM, Kyung-joong KIM, Se-ho MYUNG, Jong-hwan KIM, Dae-hyun RYU, Min JANG
  • Publication number: 20150333767
    Abstract: An encoding apparatus which performs encoding such as Low Density Parity Check (LDPC) encoding is provided. The encoding apparatus includes: an encoder encoding input bits using a parity check matrix including a plurality of blocks, each being formed of a first information word sub-matrix and a first parity sub-matrix arranged next to each other, and a second information sub-matrix and a second parity sub-matrix arranged next to each other; a bit determiner determining a value of a last sub-parity bit among sub-parity bits generated by encoding the input bits with respect to a first block among the plurality of blocks; and a bit modifier reversing values of bits generated by encoding the input bits with respect to a second block next to the first block based on the value of the last parity bit among the sub-parity bits generated by the encoding with respect to the first block.
    Type: Application
    Filed: December 23, 2014
    Publication date: November 19, 2015
    Applicants: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hong-sil JEONG, Sang-hyo KIM, Kyung-joong KIM, Se-ho MYUNG, Jong-hwan KIM, Dae-hyun RYU, Min JANG