Abstract: A data center includes: a server including a control plane; a data plane that is configured to receive network connection information from the control plane; and a storage group including a plurality of first storage devices. The data plane may be configured to set connections between the server and the plurality of first storage devices based on the network connection information corresponding to each first storage device of the plurality of first storage devices.

Abstract: A data center includes: a server including a control plane; a data plane that is configured to receive network connection information from the control plane; and a storage group including a plurality of first storage devices. The data plane may be configured to set connections between the server and the plurality of first storage devices based on the network connection information corresponding to each first storage device of the plurality of first storage devices.

Abstract: A method of fabricating a semiconductor device includes providing a semiconductor substrate including a first landing plug and a second landing plug. A bit line is formed over the semiconductor substrate. The bit line is electrically coupled to the first landing plug. A stacked structure of an etch stop film and an interlayer insulating film is deposited over the semiconductor substrate including the bit line. The stacked structure is selectively etched using a contact mask to form a contact hole having an upper part that is wider than a lower part of the contact hole. The contact hole exposes the second landing plug. A contact plug is formed over the contact hole. The contact plug is electrically coupled to the second landing plug.

Abstract: A method of fabricating a semiconductor device includes providing a semiconductor substrate including a first landing plug and a second landing plug. A bit line is formed over the semiconductor substrate. The bit line is electrically coupled to the first landing plug. A stacked structure of an etch stop film and an interlayer insulating film is deposited over the semiconductor substrate including the bit line. The stacked structure is selectively etched using a contact mask to form a contact hole having an upper part that is wider than a lower part of the contact hole. The contact hole exposes the second landing plug. A contact plug is formed over the contact hole. The contact plug is electrically coupled to the second landing plug.