Patents by Inventor Dae J. Lim

Dae J. Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for silicon electrode assembly etch rate and etch uniformity recovery
    Patent number: 7442114
    Abstract: Methods for cleaning an electrode assembly, which can be used for etching a dielectric material in a plasma etching chamber after the cleaning, comprise polishing a silicon surface of the electrode assembly, preferably to remove black silicon contamination therefrom.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: October 28, 2008
    Assignee: Lam Research Corporation
    Inventors: Tuochuan Huang, Daxing Ren, Hong Shih, Catherine Zhou, Chun Yan, Enrico Magni, Bi Ming Yen, Jerome Hubacek, Dae J. Lim, Dougyong Sung
  • Relative lateral motion in linear CMP
    Patent number: 6899594
    Abstract: Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a wafer. A belt polish module comprises a linear CMP belt forming a loop around an idle roller and a drive roller, first and second pistons engaging, respectively, first and second ends of the idle roller, and a controller configured to vary the forces applied by the first and second pistons to the ends of the idle roller in order to laterally translate the linear CMP belt. A method for linear CMP comprises rotating a wafer about a vertical axis, contacting the rotating wafer against a linear CMP belt moving in a longitudinal direction, and causing a relative lateral motion between the rotating wafer and the linear CMP belt.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: May 31, 2005
    Assignee: Lam Research Corporation
    Inventors: Robert Charatan, Dae J. Lim, Peter Norton