Abstract: Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided.

Abstract: Featured is a refrigerant injection device which is particularly suitable for use in a refrigerant destruction facility using an incinerator. Such an injection device includes a storage device which stores the refrigerant and a decompressor fluidly coupled to the storage device. The injection device further includes two flow meters and a cutoff-valve that are fluidly coupled to the decompressor. The cutoff valve is configured to cut off the injection of refrigerant. The injection device further includes bypass flow members that are fluidly coupled to the two flow meters. The bypass flow members and flow meters are configured and arranged to selectively measure the flow rate and to perform flow meter calibration without stopping the feeding of refrigerant to the injection device.

Abstract: A method of manufacturing a carbon nano-tube (CNT) emitter includes the steps of: (a) dispersing a CNT powder, an organic binder, a photosensitive material, a monomer, and a nano-sized metal particle in a solvent to manufacture a CNT paste; (b) coating the CNT paste onto an electrode formed over a substrate; (c) exposing the CNT paste coated on the electrode to thereby perform fine-patterning; (d) plasticizing the finely patterned CNT paste; and (e) processing a surface of the CNT paste such that the surface of the plasticized CNT paste is activated, wherein step (d) includes a first plasticizing step performed in an air atmosphere; and a second plasticizing step performed in a vacuum or inactive gas atmosphere. Improved uniformity of electron emissions in a field emission device is achieved and a plurality of CNT emitter regions are formed within a single pixel.

Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Abstract: A discretely addressable large-area X-ray system is provided. The large-area X-ray system can output a uniform flux of X-rays over a large area using discrete addressing operation of transistors connected to cathodes of electron emitters. Thus, when applied to a medical device, the system can minimize damage inflicted upon the human body because it enables effective imaging of only a desired specific portion of the body. Furthermore, the large-area X-ray system can be simply implemented by current switching using transistors. Thus, the system can be very easily applied to other applications.

Abstract: Provided is a field emission device (FED) capable of fine local dimming. In the FED, a cathode substrate is comprised of a plurality of cathode layers, and a plurality of interconnections are disposed on each of the cathode layers, so that fine local dimming is enabled using a plurality of cathode blocks without limiting the number of the cathode blocks. Also, since RC delays of the respective cathode blocks can be synchronized according to the design of the interconnections, current control signals can be simultaneously transmitted to the respective cathode blocks, thereby improving the characteristics of the FED.

Abstract: Provided is a field emission device, and more particularly, a field emission back light unit which makes an interconnection connected with an external electrode simple and capable of local dimming. To this end, a cathode structure for the field emission back light unit includes a plurality of data electrodes formed on a cathode substrate and spaced apart from one another, an insulating layer formed on the data electrodes, and having exposure regions exposing the predetermined data electrodes, cathode electrodes formed on the insulating layer and electrically connected with the data electrodes through the exposure regions, and at least one field emitter formed on the cathode electrodes, wherein a cathode block is defined based on the cathode electrodes electrically isolated from one another, and brightness of each cathode block can be controlled according to current supplied through the data electrode.

Abstract: Provided is a micro stage comprising: a body having a vertically perforated through-hole passing through a central portion thereof; a bobbin including a tip portion with an electron emission tip embedded in the center thereof, and passing through the through-hole of the body to be moved in the through-hole along a first axis perpendicular to a vertical direction; a first piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in one direction along the first axis; a second piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in the other direction along the first axis; and an upper cover that is coupled to an upper portion of the body and has a through-hole, through which the bobbin passes and communicates with the through-hole of the body, wherein the bobbin can be positioned as desired along the first axis by adjusting the voltages applied to the first piezoelectric element and the second piezoel

Abstract: This invention relates to a method of manufacturing an electrode for a secondary battery, which enables cost savings and the manufacture of products having various sizes and shapes. The method includes (A) preparing an electrode plate, (B) cutting the electrode plate to conform to the width of the electrode, thus providing a unit electrode plate, and (C) removing at least one of the corner regions of the unit electrode plate.

Abstract: Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.

Abstract: Provided is a wafer-level package including a wafer-level semiconductor chip having a plurality of integrated circuits (ICs) and pads formed on the top surface thereof; a molding material of which the outer portion is supported by the top surface of the semiconductor chip such that a cavity is provided on the semiconductor chip; and a conducive member filled in a plurality of vias which are formed in arbitrary positions of the molding material so as to pass through the molding material, the conductive member being connected to the pads.

Abstract: Disclosed is a field emission device. The field emission device includes: an anode substrate including an anode electrode formed on a surface thereof and a fluorescent layer formed on the anode electrode; a cathode substrate disposed opposite to and spaced apart from the anode substrate, and including at least one cathode electrode formed toward the anode substrate and a field emitter formed on each cathode electrode; and a gate substrate having one surface in contact with the cathode substrate, wherein the gate substrate include gate insulators surrounding the field emitters and having a plurality of openings exposing the field emitters, and a plurality of gate electrodes formed on the gate insulators around the openings and electrically isolated from one another.

Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Abstract: Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer.

Abstract: The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus.

Abstract: There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.

Abstract: Provided is a wafer level package of an image sensor capable of simply and easily packaging an image sensor in a packaging process, and a method for manufacturing the same. The wafer level package of an image sensor includes a lower substrate including an image sensor, a conductive pattern coupled to the image sensor, and a plurality of vias coupled to the conductive pattern; a micro lens array film having a plurality of micro lenses corresponding to the image sensor, the micro lenses being formed on the lower substrate; and a sealing line surrounding the image sensor while being spaced apart from the image sensor and being in contact with an upper substrate.

Abstract: Provided are methods of manufacturing carbon nanotube (CNT) paste, to which a nano-sized particle is added, and a CNT emitter with high reliability for a field emission display (FED). The method includes the steps of: (i) dispersing CNT powder in a solvent; (ii) adding an organic binder to the solution in which the CNT powder is dispersed; and (iii) performing a milling process to adjust viscosity of the dispersion solution to which the organic binder is added, wherein a nano-sized metal particle is added in step (i) or (iii). Accordingly, the nano-sized metal particle is added as a metal filler of the CNT paste, and thus a metal may be melted at a low temperature at which CNTs do not deteriorate. Thus, adhesion between the CNT paste and a cathode may be improved, and resistance between the cathode and the CNT or between CNTs may be reduced.

Abstract: Provided is a field emission display (FED) capable of driving on the basis of current and preventing leakage current caused by thin film transistors (TFTs). The FED includes: a plurality of unit pixels including an emission element in which cathode luminescence of a phosphor occurs and a TFT for driving the emission element; a current source for applying a scan signal to each unit pixel; and a voltage source for applying a data signal to each unit pixel. Here, the on-current of the current source is high enough to take care of the load resistance and capacitance of a scan row within a given writing time, and the off-current of the current source is so low that the electron emission of each pixel can be ignored. In addition, the pulse amplitude or pulse width of the data signal applied from the voltage source is changed, and thereby the gray scale of the display is represented.

Abstract: Provided is a field emission display (FED) in which field emission devices are applied to a flat panel display. The FED includes: a cathode plate including a substrate, first and second thin film transistors (TFTs) that are serially connected on the substrate, a field emitter disposed on a drain electrode of the second TFT, a gate insulating layer having a gate hole surrounding the field emitter, and field emission gate electrodes disposed on the gate insulating layer; and an anode plate including a substrate, and red, green, and blue phosphors disposed on the substrate, wherein the cathode plate and the anode plate are vacuum-packaged parallel and opposite to each other. According to the present invention, uniformity of the FED panel can be significantly improved, and an inherent source-drain leakage current of the TFT can be significantly reduced, so that a contrast ratio of the FED can be significantly enhanced.