Patents by Inventor Dae-Kyoo Kim

Dae-Kyoo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160098023
    Abstract: The present invention relates to an UML unification model system, in particular to a system for metamodeling transformation to guarantee interoperability between an UML model of IEC 61850 and an UML model of IEC 61970. According to the invention, all IEC 61970 smart grid application using IEC 61850 data source easily obtains interoperability between applications and actively react to change of international standard because application developers use data by referring to a single UML IEC 61850/61970 unified model and refer to a single UML model reflecting flexibly constant modification of IEC standard, if any.
    Type: Application
    Filed: February 24, 2014
    Publication date: April 7, 2016
    Applicant: MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COOPERATION FOUNDATION
    Inventors: Hyuk Soo JANG, Hyo Sik YANG, Seok Yeol YUN, Dae Kyoo Kim, Herbert FALK, Dae-Seung HONG, Sangsig KIM, Byunghun LEE
  • Publication number: 20160092604
    Abstract: The present invention relates to a method for metamodeling unification, in particular to a method for metamodeling unification to guarantee interoperability between an UML model of IEC 61850 and an UML model of IEC 61970. According to the invention, all IEC 61970 smart grid application using IEC 61850 data source easily obtains interoperability between applications and actively react to change of international standard because application developers use data by referring to a single UML IEC 61850/61970 unified model and refer to a single UML model reflecting flexibly constant modification of IEC standard, if any.
    Type: Application
    Filed: February 24, 2014
    Publication date: March 31, 2016
    Applicant: MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COOPERATION FOUNDATION
    Inventors: Hyuk Soo JANG, Hyo Sik YANG, Seok Yeol YUN, Dae Kyoo KIM, Herbert FALK, Dae-Seung HONG, Sangsig KIM, Byunghun LEE
  • Publication number: 20150317127
    Abstract: The present invention relates to a metamodeling unification system, in particular to a system for metamodeling unification to guarantee interoperability between an UML model of IEC 61850 and an UML model of IEC 61970. According to the invention, all IEC 61970 smart grid application using IEC 61850 data source easily obtains interoperability between applications and actively react to change of international standard because application developers use data by referring to a single UML IEC 61850/61970 unified model and refer to a single UML model reflecting flexibly constant modification of IEC standard, if any.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 5, 2015
    Applicant: MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COORPERATION FOUNDATION
    Inventors: Hyuk Soo JANG, Hyo Sik YANG, Seok Yeol YUN, Dae Kyoo KIM, Herbert FALK, Dae-Seung HONG, Sangsig KIM, Byunghun LEE
  • Patent number: 9092203
    Abstract: An apparatus and method for recommending software process improvement are disclosed. The method includes generating improvement packages from correlated findings by analyzing correlations between findings identified from different processes, refining the improvement packages by performing an additional correlation analysis on the improvement packages, and providing an action plan for process improvement by building recommendations from the refined improvement packages.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: July 28, 2015
    Assignee: Sogang University Research Foundation
    Inventors: Soo Yong Park, Su Jin Choi, Dae-Kyoo Kim
  • Publication number: 20140359553
    Abstract: An apparatus and method for recommending software process improvement are disclosed. The method includes generating improvement packages from correlated findings by analyzing correlations between findings identified from different processes, refining the improvement packages by performing an additional correlation analysis on the improvement packages, and providing an action plan for process improvement by building recommendations from the refined improvement packages.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 4, 2014
    Inventors: Soo Yong Park, Su Jin Choi, Dae-Kyoo Kim