Patents by Inventor Dae Kyoung Kim

Dae Kyoung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12065073
    Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: August 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park
  • Publication number: 20220251571
    Abstract: The present invention relates to aptamers that specifically bind to cancer stem cells. The aptamers according to the present invention specifically bind to cancer stem cells and reduce cell adhesion ability, cell proliferation, drug resistance and cell migration, which are characteristics of cancer stem cells, thus having excellent anticancer effects. Therefore, the aptamer may be used in various ways in the fields of cancer diagnosis, prognosis prediction, and treatment.
    Type: Application
    Filed: March 30, 2020
    Publication date: August 11, 2022
    Inventors: Jae Ho KIM, Dae Kyoung KIM
  • Patent number: 11024778
    Abstract: The present disclosure relates to a large scale film containing quantum dots or a dye, a method of preparing the large scale film, including: forming quantum dots or a dye dispersed in a solvent in the form of fibers or beads; applying pressure to an adhesive film to make the fibers or the beads adhere thereto; and curing the adhesive film onto which the fibers or the beads have adhered, and fibers or beads of quantum dots or a dye which are prepared by electrospinning.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: June 1, 2021
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Ho Kyoon Chung, Hee Yeop Chae, Sung Min Cho, Deok Su Jo, Subin Jung, Bokyoung Kim, Dae Kyoung Kim, Seunghwan Lee
  • Publication number: 20180175254
    Abstract: The present disclosure relates to a large scale film containing quantum dots or a dye, a method of preparing the large scale film, including: forming quantum dots or a dye dispersed in a solvent in the form of fibers or beads; applying pressure to an adhesive film to make the fibers or the beads adhere thereto; and curing the adhesive film onto which the fibers or the beads have adhered, and fibers or beads of quantum dots or a dye which are prepared by electrospinning.
    Type: Application
    Filed: June 10, 2016
    Publication date: June 21, 2018
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Ho Kyoon CHUNG, Hee Yeop CHAE, Sung Min CHO, Deok Su JO, Subin JUNG, Bokyoung KIM, Dae Kyoung KIM, Seunghwan LEE
  • Patent number: 9714977
    Abstract: A burn-in test system may include a burn-in test chamber, a heating chamber and a cooling chamber. The burn-in test chamber may receive an object thereon. The burn-in test chamber may perform a burn-in test at a burn-in test temperature. The heating chamber may be positioned at a first sidewall of the burn-in test chamber, and may preheat the object. The cooling chamber may be positioned at a second sidewall of the burn-in test chamber, and may cool the object.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: July 25, 2017
    Assignees: SK hynix Inc., UNITEST INC.
    Inventors: Woo Sik Jung, Dae Kyoung Kim
  • Publication number: 20160334462
    Abstract: A burn-in test system may include a burn-in test chamber, a heating chamber and a cooling chamber. The burn-in test chamber may receive an object thereon. The burn-in test chamber may perform a burn-in test at a burn-in test temperature. The heating chamber may be positioned at a first sidewall of the burn-in test chamber, and may preheat the object. The cooling chamber may be positioned at a second sidewall of the burn-in test chamber, and may cool the object.
    Type: Application
    Filed: September 16, 2015
    Publication date: November 17, 2016
    Inventors: Woo Sik JUNG, Dae Kyoung KIM
  • Publication number: 20160224272
    Abstract: Provided is a memory device performing an information transfer function during an idle period. The memory device includes a command decoder for receiving a command and detecting a transition to an idle period that is a data idle period from the command, and a mode register for storing an information selection signal for selecting internal information of the memory device and outputting the selected internal information during the idle period. The memory device selects at least one from among information about functions, characteristics and modes of the memory device set in the mode register, processing information of a self-refresh operation of the memory device, power-down mode information of the memory device, and internal temperature information of the memory device. The memory device transfers the selected internal information to a memory controller.
    Type: Application
    Filed: December 2, 2015
    Publication date: August 4, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Dae-kyoung KIM
  • Patent number: 7288949
    Abstract: The present invention relates to a semiconductor test interface for interfacing a DUT (Device Under Test) to a pin card using a cable comprising a DUT board including one or more first connectors for electrically connecting one or more test sockets for mounting the DUT to the one or more cables, and a circuit wiring for electrically connecting the one or more test sockets to the one or more first connectors; and the one more cable including a second connector for an electrical connection to the one or more first connectors, and a third connector for an electrical connection to the pin card, wherein the one or more first connectors correspond to the one or more cables by 1:1. In accordance with the present invention, the manufacturing cost is reduced by simplifying the manufacturing process and the semiconductor test interface may easily correspond to the test of the different DUTs.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: October 30, 2007
    Assignee: UniTest Inc.
    Inventors: Dae Kyoung Kim, Sun Whan Kim, Dal Jo Lee
  • Publication number: 20060279305
    Abstract: The present invention relates to a semiconductor test interface for interfacing a DUT (Device Under Test) to a pin card using a cable comprising a DUT board including one or more first connectors for electrically connecting one or more test sockets for mounting the DUT to the one or more cables, and a circuit wiring for electrically connecting the one or more test sockets to the one or more first connectors; and the one more cable including a second connector for an electrical connection to the one or more first connectors, and a third connector for an electrical connection to the pin card, wherein the one or more first connectors correspond to the one or more cables by 1:1. In accordance with the present invention, the manufacturing cost is reduced by simplifying the manufacturing process and the semiconductor test interface may easily correspond to the test of the different DUTs.
    Type: Application
    Filed: January 27, 2006
    Publication date: December 14, 2006
    Applicant: UNITEST INCORPORATION
    Inventors: Dae Kyoung KIM, Sun Whan KIM, Dal Jo LEE