Abstract: The present invention relates to aptamers that specifically bind to cancer stem cells. The aptamers according to the present invention specifically bind to cancer stem cells and reduce cell adhesion ability, cell proliferation, drug resistance and cell migration, which are characteristics of cancer stem cells, thus having excellent anticancer effects. Therefore, the aptamer may be used in various ways in the fields of cancer diagnosis, prognosis prediction, and treatment.

Abstract: The present disclosure relates to a large scale film containing quantum dots or a dye, a method of preparing the large scale film, including: forming quantum dots or a dye dispersed in a solvent in the form of fibers or beads; applying pressure to an adhesive film to make the fibers or the beads adhere thereto; and curing the adhesive film onto which the fibers or the beads have adhered, and fibers or beads of quantum dots or a dye which are prepared by electrospinning.

Abstract: The present disclosure relates to a large scale film containing quantum dots or a dye, a method of preparing the large scale film, including: forming quantum dots or a dye dispersed in a solvent in the form of fibers or beads; applying pressure to an adhesive film to make the fibers or the beads adhere thereto; and curing the adhesive film onto which the fibers or the beads have adhered, and fibers or beads of quantum dots or a dye which are prepared by electrospinning.

Abstract: A burn-in test system may include a burn-in test chamber, a heating chamber and a cooling chamber. The burn-in test chamber may receive an object thereon. The burn-in test chamber may perform a burn-in test at a burn-in test temperature. The heating chamber may be positioned at a first sidewall of the burn-in test chamber, and may preheat the object. The cooling chamber may be positioned at a second sidewall of the burn-in test chamber, and may cool the object.

Abstract: A burn-in test system may include a burn-in test chamber, a heating chamber and a cooling chamber. The burn-in test chamber may receive an object thereon. The burn-in test chamber may perform a burn-in test at a burn-in test temperature. The heating chamber may be positioned at a first sidewall of the burn-in test chamber, and may preheat the object. The cooling chamber may be positioned at a second sidewall of the burn-in test chamber, and may cool the object.

Abstract: Provided is a memory device performing an information transfer function during an idle period. The memory device includes a command decoder for receiving a command and detecting a transition to an idle period that is a data idle period from the command, and a mode register for storing an information selection signal for selecting internal information of the memory device and outputting the selected internal information during the idle period. The memory device selects at least one from among information about functions, characteristics and modes of the memory device set in the mode register, processing information of a self-refresh operation of the memory device, power-down mode information of the memory device, and internal temperature information of the memory device. The memory device transfers the selected internal information to a memory controller.

Abstract: The present invention relates to a semiconductor test interface for interfacing a DUT (Device Under Test) to a pin card using a cable comprising a DUT board including one or more first connectors for electrically connecting one or more test sockets for mounting the DUT to the one or more cables, and a circuit wiring for electrically connecting the one or more test sockets to the one or more first connectors; and the one more cable including a second connector for an electrical connection to the one or more first connectors, and a third connector for an electrical connection to the pin card, wherein the one or more first connectors correspond to the one or more cables by 1:1. In accordance with the present invention, the manufacturing cost is reduced by simplifying the manufacturing process and the semiconductor test interface may easily correspond to the test of the different DUTs.

Abstract: The present invention relates to a semiconductor test interface for interfacing a DUT (Device Under Test) to a pin card using a cable comprising a DUT board including one or more first connectors for electrically connecting one or more test sockets for mounting the DUT to the one or more cables, and a circuit wiring for electrically connecting the one or more test sockets to the one or more first connectors; and the one more cable including a second connector for an electrical connection to the one or more first connectors, and a third connector for an electrical connection to the pin card, wherein the one or more first connectors correspond to the one or more cables by 1:1. In accordance with the present invention, the manufacturing cost is reduced by simplifying the manufacturing process and the semiconductor test interface may easily correspond to the test of the different DUTs.