Patents by Inventor Dae Kyu AHN

Dae Kyu AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fan-out semiconductor package
    Patent number: 10332855
    Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Doo Hwan Lee, Ju Hyeon Kim, Dae Kyu Ahn, Sung Won Jeong
  • FAN-OUT SEMICONDUCTOR PACKAGE
    Publication number: 20170365572
    Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.
    Type: Application
    Filed: March 7, 2017
    Publication date: December 21, 2017
    Inventors: Doo Hwan LEE, Ju Hyeon KIM, Dae Kyu AHN, Sung Won JEONG