Patents by Inventor DAE MIN KIM

DAE MIN KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250105018
    Abstract: A method of manufacturing a semiconductor memory device includes alternately stacking sacrificial layers and interlayer insulating layers over a lower structure, forming a slit passing through the sacrificial layers and the interlayer insulating layers, removing the sacrificial layers through the slit through a wet etching process, and removing, through a dry etching process, a byproduct that is produced at ends of the interlayer insulating layers during the wet etching process.
    Type: Application
    Filed: December 6, 2024
    Publication date: March 27, 2025
    Applicant: SK hynix Inc.
    Inventors: Seung Cheol LEE, Dae Min KIM, Dae Sung KIM, Sang Seob LEE, Hyun Woo JIN
  • Patent number: 12191157
    Abstract: A method of manufacturing a semiconductor memory device includes alternately stacking sacrificial layers and interlayer insulating layers over a lower structure, forming a slit passing through the sacrificial layers and the interlayer insulating layers, removing the sacrificial layers through the slit through a wet etching process, and removing, through a dry etching process, a byproduct that is produced at ends of the interlayer insulating layers during the wet etching process.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: January 7, 2025
    Assignee: SK hynix Inc.
    Inventors: Seung Cheol Lee, Dae Min Kim, Dae Sung Kim, Sang Seob Lee, Hyun Woo Jin
  • Publication number: 20230129758
    Abstract: A method of manufacturing a semiconductor memory device includes alternately stacking sacrificial layers and interlayer insulating layers over a lower structure, forming a slit passing through the sacrificial layers and the interlayer insulating layers, removing the sacrificial layers through the slit through a wet etching process, and removing, through a dry etching process, a byproduct that is produced at ends of the interlayer insulating layers during the wet etching process.
    Type: Application
    Filed: March 3, 2022
    Publication date: April 27, 2023
    Applicant: SK hynix Inc.
    Inventors: Seung Cheol LEE, Dae Min KIM, Dae Sung KIM, Sang Seob LEE, Hyun Woo JIN
  • Patent number: 10211075
    Abstract: An apparatus and a method for treating a substrate with liquid are disclosed. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: February 19, 2019
    Assignee: Semes Co., Ltd.
    Inventors: Dae Min Kim, Soyoung Park, Muhyeon Lee
  • Patent number: 10079142
    Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: September 18, 2018
    Assignee: SEMES CO., LTD.
    Inventors: Dae Min Kim, Sul Lee, Bok Kyu Lee, Jae Myoung Lee
  • Publication number: 20170341113
    Abstract: Provided is a method for treating a substrate which removes particle within a concave portion on a substrate having a thin film on which a pattern having the concave portion on its upper surface is formed. The substrate treating method according the present invention comprises a penetration step for penetrating a treatment liquid containing supercritical organic chemical solution into the concave portion; and a heating step for heating the substrate after the penetration step.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 30, 2017
    Inventors: DAE MIN KIM, YOUNG HUN LEE
  • Publication number: 20170274415
    Abstract: The present invention relates to an apparatus and a method for treating a substrate with liquid. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.
    Type: Application
    Filed: February 23, 2017
    Publication date: September 28, 2017
    Applicant: SEMES CO., LTD.
    Inventors: Dae Min KIM, Soyoung Park, Muhyeon Lee
  • Publication number: 20160351385
    Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.
    Type: Application
    Filed: May 26, 2016
    Publication date: December 1, 2016
    Inventors: DAE MIN KIM, SUL LEE, BOK KYU LEE, JAE MYOUNG LEE