Patents by Inventor Dae Seong OH

Dae Seong OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200407519
    Abstract: The polymer film according to an embodiment comprises at least one polymer resin selected from the group consisting of a polyamide-based resin, a polyimide-based resin, and a polyamide-imide-based resin, and has a haze of 0.6% or less and an in-plane retardation within a specific range for each wavelength band in the visible light region. The polymer film, which has an in-plane retardation within a specific range for each wavelength band in the visible light region, is excellent in transparency and optical properties, and it can remarkably reduce the rainbow phenomenon and improve the reflection appearance.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Jung Hee KI, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI, Han Jun KIM, Heung Sik KIM
  • Publication number: 20190389095
    Abstract: An embodiment can provide a method for producing a polyamide-imide film which is colorless and transparent and has excellent mechanical properties, the method comprising: a step of producing a polyamide-imide polymer solution by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound; a step of producing a gel sheet by extruding, casting and drying the polymer solution; and a step of producing a polyamide-imide film by heat-treating the gel sheet, wherein the viscosity of the polymer solution is 100,000 to 500,000 cps, and the polyamide-imide film has a yellowness index of 5 or lower, a haze of 2% or lower, a transmittance of 85% or above and a modulus of 5.0 GPa or above, at a thickness of 20 ?m to 75 ?m.
    Type: Application
    Filed: February 6, 2018
    Publication date: December 26, 2019
    Inventors: Dae Seong OH, Dawoo JEONG, Sunhwan KIM, Jin Woo LEE, Dong Jin LIM, Cheol Ho KIM
  • Publication number: 20190390014
    Abstract: One embodiment may provide a method for producing a polyimide film, the method comprising the steps of: polishing the surface of a casting body; producing a gel sheet by casting a precursor on the polished surface of the casting body, and drying same; and producing a polyimide film by heat-treating the gel sheet, wherein the roughness of the polished surface of the casting body is 0.1 nm to 160 nm, and when the area of the casting body onto which the precursor is casted is partitioned by 1 cm×1 cm, the area corresponding to a defect reduction region is at least 90%, and the polyimide film has a yellowness of at most 3, a haze of at most 1%, a permeability of at least 88%, a modulus of at least 5.0 GPa and a surface hardness of at least HB.
    Type: Application
    Filed: February 5, 2018
    Publication date: December 26, 2019
    Inventors: Sunhwan KIM, Jin Woo LEE, Dae Seong OH, Dawoo JEONG, Kyu-Hun KIM
  • Publication number: 20190367677
    Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.
    Type: Application
    Filed: February 6, 2018
    Publication date: December 5, 2019
    Inventors: Dae Seong OH, Dawoo JEONG, Sunhwan KIM, Jin Woo LEE, Dong Jin LIM, Kyungeun OH
  • Publication number: 20190359784
    Abstract: An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4?X/Y?12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
    Type: Application
    Filed: February 5, 2018
    Publication date: November 28, 2019
    Inventors: Dawoo JEONG, Sunhwan KIM, Jin Woo LEE, Dae Seong OH, Dong Jin LIM
  • Publication number: 20190359772
    Abstract: One embodiment may provide a polyamide-imide film which is colorless and transparent while having an adequate level of solubility and excellent mechanical properties, the polyamide-imide film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, for a square cross-section of 1 cm×1 cm and a thickness of 30 um to 100 mm, the polyamide-imide film has a dissolution time of 5-60 minutes in 10 ml of dimethylacetamide (DMAc), and for a thickness of 50 mm, the polyamide-imide film has a yellowness of at most 5, a haze of at most 2%, a permeability of at least 85% and a modulus of at least 5.0 GPa.
    Type: Application
    Filed: February 2, 2018
    Publication date: November 28, 2019
    Inventors: Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Dawoo JEONG, Dong Jin LIM
  • Publication number: 20190358865
    Abstract: One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.
    Type: Application
    Filed: February 6, 2018
    Publication date: November 28, 2019
    Inventors: Jin Woo LEE, Dae Seong OH, Dawoo JEONG, Dong Jin LIM, Cheol Ho KIM
  • Publication number: 20190233590
    Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.
    Type: Application
    Filed: January 30, 2019
    Publication date: August 1, 2019
    Inventors: Dawoo JEONG, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Dong Jin LIM
  • Publication number: 20190202990
    Abstract: Embodiments relate to a process for preparing a poly(amide-imide) film and a poly(amide-imide) film prepared thereby. The process is capable of preparing a poly(amide-imide) film that is excellent in optical properties and mechanical properties.
    Type: Application
    Filed: December 7, 2018
    Publication date: July 4, 2019
    Inventors: Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Dawoo JEONG, Dong Jin LIM, Kyung Won CHOI