Patents by Inventor Dae-sung Cho

Dae-sung Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210265326
    Abstract: A light emitting device includes a short wavelength light emitting portion, a long wavelength light emitting portion, and a coupling layer combining the short wavelength emitting portion and the long wavelength light emitting portion. Each of the short wavelength light emitting portion and the long wavelength light emitting portion includes a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The active layer of the long wavelength light emitting portion contains more Indium (In) than the active layer of the short wavelength light emitting portion, and the short wavelength light emitting portion emits light of a shorter wavelength than that of light emitted from the long wavelength light emitting portion.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 26, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Chung Hoon LEE, Dae Sung CHO, So Ra LEE
  • Publication number: 20210225929
    Abstract: A display apparatus includes a display substrate, first micro LED modules arranged on the display substrate, and at least one second micro LED module disposed between the first micro LED modules. Each of the first micro LED modules includes a first substrate and micro LEDs disposed on the first substrate. The second micro LED module includes a second substrate and micro LEDs disposed on the second substrate. The second substrate bridges two adjacent first substrates.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 22, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Dae Sung CHO, So Ra LEE
  • Publication number: 20210225930
    Abstract: A display apparatus is provided. The display apparatus includes a display substrate, a first micro LED module disposed on the display substrate, and a second micro LED module disposed on the display substrate and adjacent to the first micro LED module. The first micro LED module and the second micro LED module have side surfaces facing each other. The side surfaces facing each other of the first micro LED module and the second micro LED module are inclined in an identical direction with respect to an upper surface of the display substrate.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 22, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Dae Sung CHO, So Ra LEE
  • Publication number: 20210225821
    Abstract: A display apparatus includes a display substrate, first micro LED modules arranged on the display substrate, and at least one second micro LED module disposed between the first micro LED modules. Each of the first micro LED modules includes a first substrate, and micro LEDs disposed on the first substrate, the second micro LED module includes a second substrate, and micro LEDs disposed on the second substrate. The first substrate includes a lower body and a top plate located on the lower body. The lower body is recessed from an edge of the top plate, and the second micro LED module is disposed between recessed lower bodies of adjacent first micro LED modules.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 22, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Dae Sung CHO, So Ra LEE
  • Publication number: 20210126043
    Abstract: A display apparatus including a display substrate, a plurality of light emitting devices disposed on the display substrate, a light blocking layer disposed between the light emitting devices, and a transparent layer covering the light emitting devices and the light blocking layer, in which the light emitting device includes a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, and a third LED sub-unit disposed on the second LED sub-unit, and the third LED sub-unit is disposed closer to an upper surface of the light emitting device than the first LED sub-unit.
    Type: Application
    Filed: October 28, 2020
    Publication date: April 29, 2021
    Inventors: Chung Hoon LEE, Dae Sung CHO
  • Publication number: 20210098526
    Abstract: A display apparatus including a circuit board and a plurality of pixels arranged on the circuit board, in which at least one of the pixels includes a first light emitting device and a second light emitting device spaced apart from each other in a lateral direction, the first light emitting device includes a first LED stack configured to generate light having a first peak wavelength; and the second light emitting device includes a second LED stack configured to generate light having a second peak wavelength, and a third LED stack disposed on the second LED stack and configured to generate light having a third peak wavelength.
    Type: Application
    Filed: September 23, 2020
    Publication date: April 1, 2021
    Inventors: Dae Sung CHO, So Ra Lee, Chang Yeon Kim, Jong Min Jang
  • Publication number: 20210083155
    Abstract: Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.
    Type: Application
    Filed: November 24, 2020
    Publication date: March 18, 2021
    Inventors: Won Cheol SEO, Dae Sung CHO
  • Patent number: 10892386
    Abstract: Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: January 12, 2021
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Won Cheol Seo, Dae Sung Cho
  • Patent number: 10879437
    Abstract: Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: December 29, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Won Cheol Seo, Dae Sung Cho
  • Patent number: 10863557
    Abstract: A method includes: executing an application prepared by an application programming interface (API) of a platform; and providing a network setting information to be used in the executed application to a display. A network connection is performed by the platform based on the network setting information.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-hyun Yoon, Sang-su Nam, Jae-min Ahn, Dae-sung Cho, Hyun-gyoo Yook
  • Publication number: 20200359010
    Abstract: A video encoding method and apparatus and a video decoding method and apparatus are provided. The video encoding method includes: prediction encoding in units of a coding unit as a data unit for encoding a picture, by using partitions determined based on a first partition mode and a partition level, so as to select a partition for outputting an encoding result from among the determined partitions; and encoding and outputting partition information representing a first partition mode and a partition level of the selected partition. The first partition mode represents a shape and directionality of a partition as a data unit for performing the prediction encoding on the coding unit, and the partition level represents a degree to which the coding unit is split into partitions for detailed motion prediction.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Hyun LEE, Tammy Lee, Jianle Chen, Dae-sung Cho, Woo-jin Han, Il-koo Kim
  • Patent number: 10771779
    Abstract: A video encoding method and apparatus and a video decoding method and apparatus are provided. The video encoding method includes: prediction encoding in units of a coding unit as a data unit for encoding a picture, by using partitions determined based on a first partition mode and a partition level, so as to select a partition for outputting an encoding result from among the determined partitions; and encoding and outputting partition information representing a first partition mode and a partition level of the selected partition. The first partition mode represents a shape and directionality of a partition as a data unit for performing the prediction encoding on the coding unit, and the partition level represents a degree to which the coding unit is split into partitions for detailed motion prediction.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Hyun Lee, Tammy Lee, Jianle Chen, Dae-sung Cho, Woo-jin Han, Il-koo Kim
  • Patent number: 10756237
    Abstract: A light emitting diode including a first conductive type semiconductor layer, a mesa disposed on the first conductive type semiconductor layer, the mesa including an active layer and a second conductive type semiconductor layer, a reflective electrode disposed on the mesa and configured to be in ohmic-contact with the second conductive type semiconductor layer, a current spreading layer disposed on the mesa and the reflective electrode, the current spreading layer including a first portion configured to be in ohmic-contact with an upper surface of the first conductive type semiconductor layer, a first n-contact region spaced apart from a second n-contact region with the mesa disposed between the first and second n-contact regions, and an insulation layer including a first opening exposing the reflective electrode between the first and second n-contact regions. The first and second n-contact regions have a second opening that exposes the first conductive type semiconductor layer.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: August 25, 2020
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon Chae, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
  • Patent number: 10733767
    Abstract: A convolutional neural network-based image processing method is provided. The method includes: receiving, in a second layer, multi-channel feature map images generated by applying a convolution operation to an input image of a convolutional neural network having a plurality of layers with a plurality of filter kernels of a first layer; analyzing a dynamic range of the multi-channel feature map images; re-ordering the multi-channel feature map images, based on the dynamic range; and processing the re-ordered multi-channel feature map images in the second layer.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae-sung Cho, Won-jae Lee
  • Patent number: 10602172
    Abstract: An image encoding and decoding apparatus and method, the image encoding and decoding apparatus includes: an encoding unit adjusting at least one weight value adaptively to the number of bits expressing each pixel of a current image, predicting a pixel value of a block of interest by performing an operation on a pixel value of at least one block having a pixel value similar to the pixel value of the block of interest among blocks included in a previous image and the at least one adjusted weight value, and encoding the pixel value of the block of interest using the predicted pixel value of the block of interest; and a decoding unit adjusting the at least one weight value adaptively to the number of bits, restoring the predicted pixel value of the block of interest by performing an operation on the pixel value of the at least one block having the pixel value similar to the pixel value of the block of interest among blocks included in the restored previous image and the at least one adjusted weight value, and dec
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Mun Kim, Dae-sung Cho, Woo-shik Kim
  • Publication number: 20200066690
    Abstract: A light emitting device for a display including a plurality of pixel regions defined between at least one separation region disposed between the pixel regions, and a barrier disposed in the separation region, in which each of the pixel regions includes a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and electrode pads electrically connected to the first, second, and third LED stacks, the electrode pads comprising a common electrode pad, a first electrode pad, a second electrode pad, and a third electrode pad, the common electrode pad is connected to the first, second, and third LED stacks, the first, second, and third electrode pads are connected to the first, second, and third LED stacks, respectively, and the first, second, and third LED stacks are configured to be independently driven using the electrode pads.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventors: Jong Hyeon CHAE, Chang Yeon KIM, Seong Gyu JANG, Ho Joon LEE, Jong Min JANG, Dae Sung CHO
  • Publication number: 20200066691
    Abstract: A light emitting device for a display includes a pixel region including first, second, and third LED stacks, an adhesive layer disposed between the first and second LED stacks, or between the second and third LED stacks, a metal bonding layer at least partially surrounded by the adhesive layer, and disposed between and is electrically connected to the first and second LED stacks, or the second and third LED stacks, and a common electrode pad connected to the first, second, and third LED stacks, first, second, and third electrode pads connected to the first, second, and third LED stacks, respectively, and the first, second, and third LED stacks are configured to be independently driven using the electrode pads.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventors: Jong Hyeon CHAE, Chang Yeon KIM, Seong Gyu JANG, Ho Joon LEE, Jong Min JANG, Dae Sung CHO
  • Patent number: 10536697
    Abstract: Provided is a re-encoding method including obtaining a first quantization table from a bitstream including an image encoded using the first quantization table; obtaining a second quantization table based on a pattern representing a size distribution of values of elements of the first quantization table, the second quantization table including elements respectively corresponding to the elements of the first quantization table; and re-encoding a reconstructed image by using the second quantization table, the reconstructed image being obtained by decoding the encoded image by using the first quantization table.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: January 14, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Dai-woong Choi, Woong-il Choi, Dae-sung Cho
  • Publication number: 20200013928
    Abstract: A light emitting diode including a first conductive type semiconductor layer, a mesa disposed on the first conductive type semiconductor layer, the mesa including an active layer and a second conductive type semiconductor layer, a reflective electrode disposed on the mesa and configured to be in ohmic-contact with the second conductive type semiconductor layer, a current spreading layer disposed on the mesa and the reflective electrode, the current spreading layer including a first portion configured to be in ohmic-contact with an upper surface of the first conductive type semiconductor layer, a first n-contact region spaced apart from a second n-contact region with the mesa disposed between the first and second n-contact regions, and an insulation layer including a first opening exposing the reflective electrode between the first and second n-contact regions. The first and second n-contact regions have a second opening that exposes the first conductive type semiconductor layer.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Inventors: Jong Hyeon CHAE, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
  • Publication number: 20190364269
    Abstract: A video encoding method and apparatus and a video decoding method and apparatus are provided. The video encoding method includes: prediction encoding in units of a coding unit as a data unit for encoding a picture, by using partitions determined based on a first partition mode and a partition level, so as to select a partition for outputting an encoding result from among the determined partitions; and encoding and outputting partition information representing a first partition mode and a partition level of the selected partition. The first partition mode represents a shape and directionality of a partition as a data unit for performing the prediction encoding on the coding unit, and the partition level represents a degree to which the coding unit is split into partitions for detailed motion prediction.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Hyun LEE, Tammy LEE, Jianle CHEN, Dae-sung CHO, Woo-jin HAN, Il-koo KIM