Patents by Inventor Dae Sung Seo

Dae Sung Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133642
    Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 25, 2024
    Inventors: Seung Hark SHIN, Woon Sik KIM, Dae Sung NOH, Hyunwoo CHO, Min Won SEO, Sung Hong SHIN, Jong Du LEE, Jung Hyun CHO, Uk HUH
  • Publication number: 20240135863
    Abstract: A display device includes a display unit including pixels connected to data lines and scan lines, first and second temperature sensors for sensing first and second temperatures of the display unit, a data driver configured to generate a data signal configured to be supplied to the data lines using output data, and attached to a first printed circuit board configured to be fixed to a rear surface of the display unit, a timing controller configured to generate the output data using input data, and attached to a second printed circuit board configured to be fixed to the rear surface of the display unit, and a storage having a temperature weight table including a weight corresponding to the first and second temperatures and a plurality of temperature tables including temperature information of the display unit corresponding to an attachment position of the second printed circuit board.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 25, 2024
    Inventors: Won Jin SEO, Tae Wan KIM, Hwa An SUNG, Hyun Sik YOON, Jeong Ah LEE, Dae Ho HWANG
  • Patent number: 8674945
    Abstract: The present invention relates to a touch screen apparatus and a method of inputting a user command through the apparatus. A touch screen apparatus of the present invention comprises an input unit 10 having a sensing unit 12 for recognizing user's touches and converting the touches into electrical signals; a storage unit 30 for storing execution commands corresponding to relative positions of the successive touches; and a control unit 20 for receiving the signals from the sensing unit 12 and executing an execution command retrieved from the storage unit. According to the present invention constructed as such, a variety of execution commands can be inputted without using a pattern of touches rather than an input area narrowly partitioned in a screen space.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: March 18, 2014
    Assignee: LG Electronics Inc.
    Inventor: Dae Sung Seo
  • Publication number: 20080143684
    Abstract: The present invention relates to a touch screen apparatus and a method of inputting a user command through the apparatus. A touch screen apparatus of the present invention comprises an input unit 10 having a sensing unit 12 for recognizing user's touches and converting the touches into electrical signals; a storage unit 30 for storing execution commands corresponding to relative positions of the successive touches; and a control unit 20 for receiving the signals from the sensing unit 12 and executing an execution command retrieved from the storage unit. According to the present invention constructed as such, a variety of execution commands can be inputted without using a pattern of touches rather than an input area narrowly partitioned in a screen space.
    Type: Application
    Filed: September 24, 2007
    Publication date: June 19, 2008
    Inventor: Dae Sung SEO
  • Publication number: 20040084757
    Abstract: A micro leadframe package employing an oblique etching method is disclosed. The micro leadframe package includes a semiconductor chip, an oblique-etched micro leadframe (MLF) having a die pad on which the semiconductor chip is mounted via adhesive means, leads formed along outer sides of the die pad, and tie bars for supporting four corners of the die pad, wires for connecting the semiconductor chip with the leads of the MLF, and an epoxy molding compound (EMC) for encapsulating the semiconductor chip, the MLF, and the wires.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 6, 2004
    Applicant: SIGNETICS KOREA CO., LTD.
    Inventor: Dae Sung Seo