Abstract: A gel having improved thermal stability is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a heated reaction product of iron acetylacetonate. The iron acetylacetonate is present prior to heating in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel is formed using a method that includes the steps of (I) heating the iron acetylacetonate to form the (D) heated reaction product of the iron acetylacetonate and (II) combining (A), (B), (C) and (D) to effect the hydrosilylation reaction of (A) and (B) in the presence of (C) and (D) to form the gel.

Abstract: A gel has improved thermal stability and is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a phthalocyanine. The (D) phthalocyanine is present in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel has a hardness of less than about 1500 grams as measured after heat ageing at 225° C. for 1000 hours that is calculated as a weight required to insert a TA-23 probe into the gel to a depth of 3 mm.

Abstract: A curable and patternable ink, a method of using this ink as part of a structure that performs a function in an electronic device, and a soft lithographic method for forming said structure on a substrate for use within the electronic device is disclosed. The curable and patternable ink generally comprises a first portion defined by structural units of (R)SiO3/2; a second portion defined by structural units of (R)2SiO2/2; and an organic solvent. Alternatively, the ink further comprises structural units (R)3SiO1/2 or SiO4/2. The R group is independently selected to be an aryl group, a methyl group, or a cross-linkable group with the number of aryl groups being present in an amount that ranges from at least one aryl group up to 20 mole %. The patternable ink may be applied to a substrate using a soft lithographic process with good reproducibility of the applied pattern.

Abstract: A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form.

Abstract: A gel having improved thermal stability is the hydro silylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a heated reaction product of iron acetylacetonate. The iron acetylacetonate is present prior to heating in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel is formed using a method that includes the steps of (I) heating the iron acetylacetonate to form the (D) heated reaction product of the iron acetylacetonate and (II) combining (A), (B), (C) and (D) to effect the hydrosilylation reaction of (A) and (B) in the presence of (C) and (D) to form the gel.

Abstract: A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction action catalyst, (D) a hydrosilylation reaction inhibitor, and (E) an organic solvent that can dissolve components (A), (B), and (D), that is liquid, and that has a boiling point of 180° C. to 400° C. Also, the preceding liquid die bonding agent that additionally comprises (F) an organosilicon compound-based adhesion promoter.