Abstract: Provided are a wafer level package and a manufacturing method thereof. A reconfigured substrate may be formed by disposing a first semiconductor die on a dummy wafer, and forming a molding layer and a mold covering layer. A second semiconductor die may be stacked on the first semiconductor die and a photosensitive dielectric layer may be formed. Conductive vias penetrating the photosensitive dielectric layer may be plated.

Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.

Abstract: Disclosed is a liquid crystal display, including: a first substrate and a second substrate, which face each other; a color filter disposed on the first substrate; a liquid crystal layer interposed between the first substrate and the second substrate; a first polarizing plate disposed outside the first substrate; a first compensation film disposed outside the first polarizing plate; a second compensation film disposed outside the second substrate; and a second polarizing plate disposed outside the second compensation film, in which the second compensation film includes a biaxial film, and the first substrate and the second substrate include a poly-amide (PA) having an optical characteristic of a negative C-plate.

Abstract: A light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes a first semiconductor layer and a second semiconductor layer, an active layer between the first and the second semiconductors, a conductive material on the second semiconductor layer, an inclined surface, a first insulation layer overlaps each light emitting cell, an electrically conductive material overlaps the first insulation layer to couple two of the plurality of light emitting cells, and a second insulation layer overlaps the electrically conductive material. A light-transmitting material is used in both the first insulation layer and the second insulation layer. The inclined surface is continuous and has a slope of approximately 20° to approximately 80° from a horizontal plane based on the substrate.

Abstract: Disclosed is a light emitting diode using light of a short wavelength band. The light emitting diode includes a first conductivity type semiconductor layer having a front side and a back side, a second conductivity type semiconductor layer having a front side and a back side, an active layer formed between the back side of the first conductivity type semiconductor layer and the front side of the second conductivity type semiconductor layer, a first electrode electrically connected to the first conductivity type semiconductor layer, a second conductivity type reflective layer formed on the back side of the second conductivity type semiconductor layer, and a reflective part formed on the second conductivity type reflective layer to reflect light of a short wavelength band and light of a blue wavelength band and electrically connected to the second conductivity type semiconductor layer. The second conductivity type reflective layer includes DBR unit layers.

Abstract: A polarizer includes a first laminated structure having a first layer with a first refractive index and a second layer with a second refractive index, wherein the first and second refractive indices are different from each other. A buffer layer is disposed on the first laminated structure. A second laminated structure in the polarizer has a third layer with a third refractive index and a fourth layer with a fourth refractive index, wherein the third and fourth refractive indices are different from each other.

Abstract: A testing apparatus for testing a display apparatus includes a base substrate, a plurality of fixing tools on the base substrate to affix the display apparatus to the base substrate, the plurality of fixing tools being movable in a z-axis direction independently of each other, the z-axis direction extending along a normal direction to the base substrate, and a controller that controls the fixing tools to bend the display apparatus in two or more test patterns different from each other.

Abstract: Disclosed herein are a method and apparatus for sensing as impact on a vehicle based on an acoustic sensor and an acceleration sensor. The method of sensing an impact on a vehicle may include obtaining information related to an impact sound generated in the vehicle of a user and around the vehicle of the user through an acoustic sensor, obtaining information related to an impact applied to the vehicle of the user through an impact detection sensor, and determining an impact sound directly generated in the vehicle of the user based on the information related to the impact sound and the information related to the impact.

Abstract: A light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes a first semiconductor layer and a second semiconductor layer, an active layer between the first and the second semiconductors, a conductive material on the second semiconductor layer, an inclined surface, a first insulation layer overlaps each light emitting cell, an electrically conductive material overlaps the first insulation layer to couple two of the plurality of light emitting cells, and a second insulation layer overlaps the electrically conductive material. A light-transmitting material is used in both the first insulation layer and the second insulation layer. The inclined surface is continuous and has a slope of approximately 20° to approximately 80° from a horizontal plane based on the substrate.

Abstract: Disclosed is a light emitting diode using light of a short wavelength band. The light emitting diode includes a first conductivity type semiconductor layer having a front side and a back side, a second conductivity type semiconductor layer having a front side and a back side, an active layer formed between the back side of the first conductivity type semiconductor layer and the front side of the second conductivity type semiconductor layer, a first electrode electrically connected to the first conductivity type semiconductor layer, a second conductivity type reflective layer formed on the back side of the second conductivity type semiconductor layer, and a reflective part formed on the second conductivity type reflective layer to reflect light of a short wavelength band and light of a blue wavelength band and electrically connected to the second conductivity type semiconductor layer. The second conductivity type reflective layer includes DBR unit layers.

Abstract: A pressure sensor including a first conductor located in a pressure sensing region including a first sensing region and a second sensing region; and a second conductor spaced apart from the first conductor, the second conductor forming capacitance with the first conductor. The first conductor includes a first conductive part located in the first sensing region and a second conductive part located in the second sensing region. The area ratio of the second conductive part with respect to the second sensing region is different from the area ratio of the first conductive part with respect to the first sensing region.

Abstract: A touch sensor includes first electrodes extending in a first direction, second electrodes spaced apart from the first electrodes and extending in a second direction to cross the first electrodes, at least one pressure sensor arranged at an intersection between at least one of the first electrodes and at least one of the second electrodes, and a sensor controller electrically connected to the first electrodes, the second electrodes, and the pressure sensor. The sensor controller is configured to detect a variation in capacitance between the first electrodes and the second electrodes to sense a touch position during a first period and detect a variation in capacitance between the at least one of the first electrodes or the at least one of the second electrodes and the pressure sensor to sense a touch pressure during a second period.

Abstract: Provided are a wafer level package and a manufacturing method thereof. A reconfigured substrate may be formed by disposing a first semiconductor die on a dummy wafer, and forming a molding layer and a mold covering layer. A second semiconductor die may be stacked on the first semiconductor die and a photosensitive dielectric layer may be formed. Conductive vias penetrating the photosensitive dielectric layer may be plated.

Abstract: Disclosed is a light emitting diode using light of a short wavelength band. The light emitting diode includes a first conductivity type semiconductor layer having a front side and a back side, a second conductivity type semiconductor layer having a front side and a back side, an active layer formed between the back side of the first conductivity type semiconductor layer and the front side of the second conductivity type semiconductor layer, a first electrode electrically connected to the first conductivity type semiconductor layer, a second conductivity type reflective layer formed on the back side of the second conductivity type semiconductor layer, and a reflective part formed on the second conductivity type reflective layer to reflect light of a short wavelength band and light of a blue wavelength band and electrically connected to the second conductivity type semiconductor layer. The second conductivity type reflective layer includes DBR unit layers.

Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.

Abstract: A light emitting diode is disclosed. The light emitting diode includes: a plurality of light emitting cells including a first light emitting cell and a second light emitting cell spaced apart from each other on a single substrate; a continuous passivation layer formed over the upper surface and one facet of the first light emitting cell, the upper surface and the other facet of the second light emitting cell, and the substrate; and an interconnection layer formed on the passivation layer to electrically connect the first light emitting cell to the second light emitting cell. The interconnection layer includes an edge lump portion formed around a first edge where the upper surface and the one facet of the first light emitting cell meet each other or a second edge where the upper surface and the other facet of the second light emitting cell meet each other. The edge lump portion protrudes in a direction away from the edge.

Abstract: Disclosed herein are a device and method for updating firmware and a firmware update system. The device for updating firmware include an update manager for receiving delta information about the latest version of firmware from an update server by checking information about a version of firmware installed in a terminal device and for updating the firmware installed in the terminal device using the delta information, and a bootloader for restoring the updated firmware using previously stored backup information when the updated firmware is not normally launched or when an error occurs during the update of the firmware.

Abstract: Semiconductor devices are provided including a substrate defining a gate trench. A buried gate structure is provided in the gate trench and at least fills the gate trench. The buried gate structure includes a gate insulation layer pattern, a gate electrode and a capping layer pattern. First and second impurity regions are provided at portions of the substrate adjacent to the buried gate structure, respectively. At least a portion of each of the first and second impurity regions face a sidewall of the buried gate structure. First and second buried contact structures are provided on the first and second impurity regions, respectively. Each of the first and second buried contact structures includes a metal silicide pattern and a metal pattern, and at least a portion of each of the first and second buried contact structures face to a sidewall of the buried gate structure.

Abstract: A system for performing an integrity verification based on a distributed delegator and verifying an integrity of a plurality of individual devices based on a network includes: a first individual device which is an integrity verification target of the plurality of individual devices; a second individual device configured to vicariously verify the verification target device of the plurality of individual devices; and a remote device management server configured to select the second individual device of the plurality of individual devices as a verification delegator, and to receive a result of integrity verification of the first individual device by the second individual device.

Abstract: An electronic device is provided. The electronic device includes a display, a memory that stores icon image associated with an application, and a processor. The processor selects a partial area of the icon image, determines whether a type of an image included in the selected area is a first image type or a second image type, displays, if the type of the image included in the selected area is the first image type, the image included in the selected area in the display at a first magnification, and displays, if the type of the image included in the selected area is the second image type, the image included in the selected area in the display at a second magnification.