Patents by Inventor Dae-Woo Suh

Dae-Woo Suh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9871180
    Abstract: A thermoelectric material includes a stack structure including alternately stacked first and second material layers. The first material layer may include a carbon nano-material. The second material layer may include a thermoelectric inorganic material. The first material layer may include a thermoelectric inorganic material in addition to the carbon nano-material. The carbon nano-material may include, for example, graphene. At least one of the first and second material layers may include a plurality of nanoparticles. The thermoelectric material may further include at least one conductor extending in an out-of-plane direction of the stack structure.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: January 16, 2018
    Assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Jae-young Choi, Seung-hyun Baik, Won-young Kim, Dae-woo Suh, Sang-hoon Lee, Seung-hyun Hong
  • Patent number: 9418769
    Abstract: An electrically conductive carbon nanotube-metal composite ink may include a carbon nanotube-metal composite in which metal nanoparticles are bound to a surface of a carbon nanotube by chemical self-assembly. The electrically conductive carbon nanotube-metal composite ink may have higher electrical conductivity than a commonly used metal nanoparticles-based conductive ink, and may also be used in deformable electronic devices that are flexible and stretchable, as well as commonly used electronic devices, due to the bending and stretching properties of the carbon nanotube itself.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: August 16, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-woo Chung, Seung-hyun Baik, Joong-hyuk Kim, Ru-jun Ma, Young-seok Oh, Dae-woo Suh
  • Publication number: 20140182646
    Abstract: A thermoelectric material includes a stack structure including alternately stacked first and second material layers. The first material layer may include a carbon nano-material. The second material layer may include a thermoelectric inorganic material. The first material layer may include a thermoelectric inorganic material in addition to the carbon nano-material. The carbon nano-material may include, for example, graphene. At least one of the first and second material layers may include a plurality of nanoparticles. The thermoelectric material may further include at least one conductor extending in an out-of-plane direction of the stack structure.
    Type: Application
    Filed: December 4, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-young CHOI, Seung-hyun BAIK, Won-young KIM, Dae-woo SUH, Sang-hoon LEE, Seung-hyun HONG
  • Publication number: 20110198542
    Abstract: An electrically conductive carbon nanotube-metal composite ink may include a carbon nanotube-metal composite in which metal nanoparticles are bound to a surface of a carbon nanotube by chemical self-assembly. The electrically conductive carbon nanotube-metal composite ink may have higher electrical conductivity than a commonly used metal nanoparticles-based conductive ink, and may also be used in deformable electronic devices that are flexible and stretchable, as well as commonly used electronic devices, due to the bending and stretching properties of the carbon nanotube itself.
    Type: Application
    Filed: October 28, 2010
    Publication date: August 18, 2011
    Inventors: Jae-woo Chung, Seung-hyun Baik, Joong-hyuk Kim, Ru-Jun Ma, Young-seok Oh, Dae-woo Suh
  • Publication number: 20090114425
    Abstract: A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.
    Type: Application
    Filed: July 23, 2008
    Publication date: May 7, 2009
    Inventors: Eung-Suek LEE, Seung-Hyun BAIK, Young-Jin KIM, Young-Seok OH, Jae-Boong CHOI, Dae-Woo SUH, Je-Gwang YOO, Chang-Sup RYU, Jun-Oh HWANG, Jee-Soo MOK
  • Publication number: 20090083975
    Abstract: A method of interconnecting layers of a printed circuit board is disclosed. The method includes: forming at least one bump on a first metal layer using a conductive paste containing carbon nanotubes, stacking an insulation layer on the first metal layer such that the bumps penetrate the insulation layer, and stacking a second metal layer on the insulation layer such that the second metal layer is electrically connected with the first metal layer by the bump.
    Type: Application
    Filed: April 8, 2008
    Publication date: April 2, 2009
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
    Inventors: Eung-Suek Lee, Young-Jin Kim, Seung-Hyun Baik, Jae-Boong Cho, Young-Seok Oh, Dae-Woo Suh, Je-Gwang Yoo, Jee-Soo Mok, Chang-Sup Ryu