Abstract: The present invention relates to a composition for improving memory, improving cognition, preventing or treating cerebral neurological disease, comprising porcine brain enzyme hydrolysate. The composition can exhibit neuroprotective activity, brain-derived neurotrophic factor (BDNF) production activity, acetylcholinesterase inhibitory activity and reactive oxygen species (ROS) inhibitory activity.

Abstract: A display device including: a base layer; a backplane structure provided on the base layer, the backplane structure including pixel circuits and a sensor circuit; a pixel layer provided on the backplane structure, the pixel layer including light emitting elements respectively connected to the pixel circuits and a light receiving element connected to the sensor circuit; an encapsulation layer covering the pixel layer; a black matrix provided on the encapsulation layer, wherein the black matrix includes openings overlapping the light emitting elements and the light receiving element; and a color filter provided on the encapsulation layer and covering the black matrix, wherein the light emitting elements include light emitting layers, the light receiving element includes a light receiving layer, and at least one of the openings of the black matrix overlaps one of the light emitting layers and the light receiving layer.

Abstract: The present invention relates to a pharmaceutical composition for prevention or treatment of an allergic disease comprising a mixed extract of two or more selected from the group consisting of Asiasarum root, Platycodon root, and Cinnamomi ramulus as an active ingredient; a method for prevention or treatment of an allergic disease using the pharmaceutical composition; and a health functional food and a feed composition for improvement of an allergic disease. The composition and method of the invention can specifically inhibit the differentiation of Th2 cells and thus can be effectively used as a composition for prevention or treatment of an allergic disease.

Abstract: A semiconductor device is made by providing a substrate having an interconnect structure, providing a plurality of semiconductor die each having a through silicon via (TSV), mounting the semiconductor die to the substrate to electrically connect the TSV to the interconnect structure, depositing an encapsulant between the semiconductor die, and forming a shielding layer over the encapsulant and semiconductor die. The shielding layer is electrically connected to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor die from interference. The shielding layer is electrically connected to a ground potential through the TSV and interconnect structure. The semiconductor die includes solder bumps which are electrically connected to contact pads on the substrate. The substrate also includes solder bumps electrically connected to a conductive channel in the interconnect structure which is electrically connected to the TSV.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

Abstract: A semiconductor device is made by providing a substrate having an interconnect structure, providing a plurality of semiconductor die each having a through silicon via (TSV), mounting the semiconductor die to the substrate to electrically connect the TSV to the interconnect structure, depositing an encapsulant between the semiconductor die, and forming a shielding layer over the encapsulant and semiconductor die. The shielding layer is electrically connected to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor die from interference. The shielding layer is electrically connected to a ground potential through the TSV and interconnect structure. The semiconductor die includes solder bumps which are electrically connected to contact pads on the substrate. The substrate also includes solder bumps electrically connected to a conductive channel in the interconnect structure which is electrically connected to the TSV.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.