Patents by Inventor Dae Woong Lee
Dae Woong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154272Abstract: A secondary battery according to an embodiment of the present disclosure includes an electrode assembly to which an electrode lead is attached; a case accommodating the electrode assembly so that a portion of the electrode lead is exposed to the outside; a sealing portion formed in the case to seal the electrode assembly; and a lead film covering a portion of an outer surface of the electrode lead and interposed between the electrode lead and the sealing portion, wherein the electrode lead includes a first region not corresponding to the lead film and exposed to the outside of the case, a second region corresponding to the lead film, and a third region not corresponding to the lead film and not exposed to the outside of the case, wherein a separation groove may be located in the third region.Type: ApplicationFiled: October 11, 2022Publication date: May 9, 2024Applicant: LG Energy Solution, Ltd.Inventors: Gyung-Soo Kang, Dae-Woong Song, Jae-Ho Lee, Ji-Young Hwang
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Patent number: 11960271Abstract: The present invention relates to a power plant early warning device and method which employ a multiple prediction model, and includes: a plurality of prediction models which receive information about the operation states of equipment in a power plant, and output prediction values and the reliabilities of the prediction values; a reliability analysis module which quantizes and analyzes the reliabilities output from the plurality of prediction models to determine the ranks of the plurality of prediction models, and calculates a final prediction value; a comparison module which compares the final prediction value with an actual measurement value, and outputs a residual; and a determination module which analyzes the residual to determine whether there are defects in the operating states of the equipment in the power plant.Type: GrantFiled: October 10, 2019Date of Patent: April 16, 2024Assignee: KOREA HYDRO & NUCLEAR POWER CO., LTDInventors: Ji Ho Min, Dae Woong Kim, Do Hwan Lee, Yun Goo Kim
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Publication number: 20240119949Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: ApplicationFiled: November 30, 2023Publication date: April 11, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
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Patent number: 11949881Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.Type: GrantFiled: April 1, 2021Date of Patent: April 2, 2024Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong UniversityInventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim
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Patent number: 11878569Abstract: An air circulator for a vehicle is provided. The air circulator includes a blower case and a connection duct that is connected to an outlet of the blower case. The connector duct includes a first path and a second path that are divided by a separation plate. Additionally, a filter is mounted in the outlet of the blower case and an inlet door is mounted in the blower case to selectively allow air to be blown into the first path and/or the second path.Type: GrantFiled: October 28, 2020Date of Patent: January 23, 2024Assignees: Hyundai Motor Company, Kia Motors Corporation, Hanon SystemsInventors: Jae Woo Lee, Dae Woong Lee, In Keun Kang
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Publication number: 20220251355Abstract: An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.5 to 2.3, (c) a melting temperature of 85° C. or less, and (d) a free volume proportional constant (C2) of 600 or less. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.Type: ApplicationFiled: December 17, 2020Publication date: August 11, 2022Applicant: LG Chem, Ltd.Inventors: Jin Sam Gong, Eun Jung Lee, Young Woo Lee, Jung Ho Jun, Dae Woong Lee, Jin Kuk Lee
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Publication number: 20220195101Abstract: A polyolefin-polystyrene multi-block copolymer and method of making the same is disclosed herein. In some embodiments, a polyolefin-polystyrene multi-block copolymer having a ratio of a loss modulus (E?) to a storage modulus (E?) satisfying the following conditions (a) and (b) over a temperature range of ?80° C. to 40° C., wherein the ratio is represented by a loss tangent (tan ?) value and is obtained by dynamic mechanical analysis (DMA), (a) a maximum of the tan ? value in a peak present in the temperature range is 0.20 to 0.35, and (b) a half-width of the peak ranges from 32.0° C. to 50.0° C. The polyolefin-polystyrene multi-block copolymer has a structure in which polystyrene chains are attached to both ends of a polyolefin chain.Type: ApplicationFiled: May 15, 2020Publication date: June 23, 2022Applicant: LG Chem, Ltd.Inventors: Ji Hyun Park, Dae Woong Lee, Sung Hyun Park, Seok Pil Sa, Seul Ki Im, Hyun Mo Lee, Yun Kon Kim, Ki Soo Lee, Myung Han Lee, Eun Ji Shin
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Patent number: 11362283Abstract: The present specification provides an organoluminescent device including a capping layer on one surface of an electrode, wherein the capping layer includes a compound represented by Chemical Formula 1: X, and R1 to R5 are defined therein.Type: GrantFiled: September 8, 2016Date of Patent: June 14, 2022Inventors: Dae Woong Lee, Yeon-Ho Cho, Sang Young Jeon, Hyoung Seok Kim, Sang Duk Suh
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Publication number: 20220149317Abstract: A display device includes a substrate; a transistor disposed on the substrate; a first electrode connected to the transistor; an auxiliary electrode disposed on the same layer as the first electrode; an emission layer disposed on the first electrode; and a second electrode disposed on the emission layer, wherein the auxiliary electrode includes an opening, and a side surface of the auxiliary electrode and the second electrode are in direct contact at the opening of the auxiliary electrode.Type: ApplicationFiled: August 31, 2021Publication date: May 12, 2022Inventors: Sang Gyun Kim, Dae Woong Lee, Ill Hun Cho
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Publication number: 20220081501Abstract: The present invention relates to an ethylene/alpha-olefin copolymer having a high weight average molecular weight and narrow molecular weight distribution, and at the same time, a reduced characteristic relaxation time, thereby showing excellent physical properties, and a method for preparing the same. A resin composition having improved volume resistance and excellent light transmittance may be prepared by using such ethylene/alpha-olefin copolymer. Accordingly, the ethylene/alpha-olefin copolymer may be utilized in various uses in electrical and electronic industrial fields.Type: ApplicationFiled: September 25, 2020Publication date: March 17, 2022Applicant: LG Chem, Ltd.Inventors: Young Woo Lee, Seul Ki Kim, Dae Woong Lee, Jin Kuk Lee, Eun Jung Lee, Jin Sam Gong, Jung Ho Jun, Jun Hyuk Lee
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Publication number: 20210347229Abstract: An air circulator for a vehicle is provided. The air circulator includes a blower case and a connection duct that is connected to an outlet of the blower case. The connector duct includes a first path and a second path that are divided by a separation plate. Additionally, a filter is mounted in the outlet of the blower case and an inlet door is mounted in the blower case to selectively allow air to be blown into the first path and/or the second path.Type: ApplicationFiled: October 28, 2020Publication date: November 11, 2021Inventors: Jae Woo Lee, Dae Woong Lee, In Keun Kang
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Publication number: 20210095613Abstract: A cylinder block includes an extension portion that is shaped to extend toward the cylinder liner and is formed on an end portion of the cylinder block so as to form a surface contact with a head gasket. In particular, the cylinder liner includes an end portion forming an accommodation groove portion that is shaped to correspond to the extension portion, and a part of the end portion of the cylinder liner is supported on a circumferential surface of the extension portion and is linked to the accommodation groove portion. In addition, the part of the end portion of the cylinder liner forms a surface contact with the head gasket.Type: ApplicationFiled: January 16, 2020Publication date: April 1, 2021Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Young Gi KIM, Jong Beom SEO, Byung Hyun LEE, Myoung Ho LEE, Joong Hyun HWANG, Jin Woo CHO, Dae Woong LEE, Chang Min LEE
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Patent number: 10714405Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.Type: GrantFiled: August 1, 2019Date of Patent: July 14, 2020Assignee: SK hynix Inc.Inventor: Dae Woong Lee
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Publication number: 20190355645Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.Type: ApplicationFiled: August 1, 2019Publication date: November 21, 2019Applicant: SK hynix Inc.Inventor: Dae Woong LEE
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Patent number: 10451915Abstract: The present invention relates to a polarizing plate including a polyethylene terephthalate film and having an excellent optical property, and a method for manufacturing the same, and the polarizing plate of the present invention includes: a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin and a glyoxalate crosslinking agent at a weight ratio of 100:5 to 100:50, and the primer layer is formed by using a primer composition including a polyester-based compound and an acryl-based compound.Type: GrantFiled: May 22, 2015Date of Patent: October 22, 2019Assignee: LG Chem, Ltd.Inventors: Sung Hyun Nam, Seunghee Nam, Kyun Il Rah, Dae Woong Lee
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Patent number: 10451916Abstract: The present invention relates to a polarizing plate including a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin, an amine-based metal compound, and a pH adjuster, and the pH adjuster includes epoxy (meth)acrylate, alcohol, and acid, and a method for manufacturing the same.Type: GrantFiled: May 22, 2015Date of Patent: October 22, 2019Assignee: LG Chem, Ltd.Inventors: Sung Hyun Nam, Seunghee Nam, Kyun II Rah, Dae Woong Lee
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Patent number: 10410947Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.Type: GrantFiled: July 16, 2018Date of Patent: September 10, 2019Assignee: SK hynix Inc.Inventor: Dae Woong Lee
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Patent number: 10353125Abstract: The present disclosure relates to a polarizing plate including an adhesive layer, a primer layer and a polyethylene terephthalate film which are sequentially formed on at least one side of a polarizer, wherein the adhesive layer in the present disclosure is formed by an active energy ray-curable adhesive including a first epoxy compound of which a homopolymer has a glass transition temperature of 120° C. or higher, a second epoxy compound of which a homopolymer has a glass transition temperature of 60° C. or lower, and a cationic photopolymerization initiator, and wherein the primer layer is formed by a primer composition including one or more binder resins selected from the group consisting of polyester and polyvinyl alcohol-based resins, and one or more cross-linking agents selected from the group consisting of acrylic cross-linking agents, epoxy-based cross-linking agents and polyvinyl alcohol-based cross-linking agents.Type: GrantFiled: June 18, 2014Date of Patent: July 16, 2019Assignee: LG Chem, Ltd.Inventors: Sung-Hyun Nam, Eun-Mi Seo, Seung-Hee Nam, Dae-Woong Lee, Kyun-Il Rah
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Publication number: 20190148257Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.Type: ApplicationFiled: July 16, 2018Publication date: May 16, 2019Applicant: SK hynix Inc.Inventor: Dae Woong LEE
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Patent number: 10122156Abstract: The present invention relates to a device for fixing a pipe and an electric wire that fastenedly blocks a fastening hole formed on a vehicle roof by means of a first connection member adapted to pass the pipe therethrough and a second connection member adapted to pass the electric wire therethrough, thus reducing the number of fastening holes formed on the vehicle roof and achieving easy assembling. According to the present invention, the device includes: a first connection member having a first through hole adapted to pass the pipe therethrough and a hollow portion formed on a given region thereof; and a second connection member having a second through hole adapted to pass the electric wire therethrough, wherein the second connection member has the corresponding shape to the hollow portion in such a manner as to be integrally formed with the first connection member, so that the first connection member and the second connection member block a fastening hole formed on a given region of a vehicle.Type: GrantFiled: August 26, 2015Date of Patent: November 6, 2018Assignee: HANON SYSTEMSInventors: Chan Joo Maeng, Dae Woong Lee