Patents by Inventor Dae Woong Lee

Dae Woong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210128660
    Abstract: The specification relates to a composition for enhancing immunity, comprising a ginseng berry polysaccharide as an active ingredient. The composition can increase the expression of cytokines such as IL-6, IL-12, and TNF-? by using ingredients derived from natural products. In addition, the composition can exhibit excellent immunity enhancement effects because of the unique components and structure of a ginseng berry polysaccharide.
    Type: Application
    Filed: January 26, 2018
    Publication date: May 6, 2021
    Inventors: Suhwan KIM, Juewon KIM, Chan-woong PARK, Dae Bang SEO, Donghyun CHO, Kwang Soon SHIN, Dae Young LEE
  • Patent number: 10991851
    Abstract: Provided are a light emitting diode (LED) in which a conductive barrier layer surrounding a reflective metal layer is defined by a protective insulating layer, and a method of manufacturing the same. A reflection pattern including a reflective metal layer and a conductive barrier layer is formed on an emission structure in which a first semiconductor layer, an active layer, and a second semiconductor layer are formed. The conductive barrier layer prevents diffusion of a reflective metal layer and extends to a protective insulating layer recessed under a photoresist pattern having an overhang structure during a forming process. Accordingly, a phenomenon where the conductive barrier layer is in contact with sidewalls of the photoresist pattern having an over-hang structure and the reflective metal layer forms points is prevented. Thus, LED modules having various shapes may be manufactured.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: April 27, 2021
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Hyeon Chae, Jong Min Jang, Won Young Roh, Dae Woong Suh, Min Woo Kang, Joon Sub Lee, Hyun A. Kim
  • Publication number: 20210095613
    Abstract: A cylinder block includes an extension portion that is shaped to extend toward the cylinder liner and is formed on an end portion of the cylinder block so as to form a surface contact with a head gasket. In particular, the cylinder liner includes an end portion forming an accommodation groove portion that is shaped to correspond to the extension portion, and a part of the end portion of the cylinder liner is supported on a circumferential surface of the extension portion and is linked to the accommodation groove portion. In addition, the part of the end portion of the cylinder liner forms a surface contact with the head gasket.
    Type: Application
    Filed: January 16, 2020
    Publication date: April 1, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young Gi KIM, Jong Beom SEO, Byung Hyun LEE, Myoung Ho LEE, Joong Hyun HWANG, Jin Woo CHO, Dae Woong LEE, Chang Min LEE
  • Patent number: 10714405
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: July 14, 2020
    Assignee: SK hynix Inc.
    Inventor: Dae Woong Lee
  • Publication number: 20190355645
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Application
    Filed: August 1, 2019
    Publication date: November 21, 2019
    Applicant: SK hynix Inc.
    Inventor: Dae Woong LEE
  • Patent number: 10451915
    Abstract: The present invention relates to a polarizing plate including a polyethylene terephthalate film and having an excellent optical property, and a method for manufacturing the same, and the polarizing plate of the present invention includes: a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin and a glyoxalate crosslinking agent at a weight ratio of 100:5 to 100:50, and the primer layer is formed by using a primer composition including a polyester-based compound and an acryl-based compound.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: October 22, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sung Hyun Nam, Seunghee Nam, Kyun Il Rah, Dae Woong Lee
  • Patent number: 10451916
    Abstract: The present invention relates to a polarizing plate including a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin, an amine-based metal compound, and a pH adjuster, and the pH adjuster includes epoxy (meth)acrylate, alcohol, and acid, and a method for manufacturing the same.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: October 22, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sung Hyun Nam, Seunghee Nam, Kyun II Rah, Dae Woong Lee
  • Patent number: 10410947
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 10, 2019
    Assignee: SK hynix Inc.
    Inventor: Dae Woong Lee
  • Patent number: 10353125
    Abstract: The present disclosure relates to a polarizing plate including an adhesive layer, a primer layer and a polyethylene terephthalate film which are sequentially formed on at least one side of a polarizer, wherein the adhesive layer in the present disclosure is formed by an active energy ray-curable adhesive including a first epoxy compound of which a homopolymer has a glass transition temperature of 120° C. or higher, a second epoxy compound of which a homopolymer has a glass transition temperature of 60° C. or lower, and a cationic photopolymerization initiator, and wherein the primer layer is formed by a primer composition including one or more binder resins selected from the group consisting of polyester and polyvinyl alcohol-based resins, and one or more cross-linking agents selected from the group consisting of acrylic cross-linking agents, epoxy-based cross-linking agents and polyvinyl alcohol-based cross-linking agents.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: July 16, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sung-Hyun Nam, Eun-Mi Seo, Seung-Hee Nam, Dae-Woong Lee, Kyun-Il Rah
  • Publication number: 20190148257
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Application
    Filed: July 16, 2018
    Publication date: May 16, 2019
    Applicant: SK hynix Inc.
    Inventor: Dae Woong LEE
  • Patent number: 10122156
    Abstract: The present invention relates to a device for fixing a pipe and an electric wire that fastenedly blocks a fastening hole formed on a vehicle roof by means of a first connection member adapted to pass the pipe therethrough and a second connection member adapted to pass the electric wire therethrough, thus reducing the number of fastening holes formed on the vehicle roof and achieving easy assembling. According to the present invention, the device includes: a first connection member having a first through hole adapted to pass the pipe therethrough and a hollow portion formed on a given region thereof; and a second connection member having a second through hole adapted to pass the electric wire therethrough, wherein the second connection member has the corresponding shape to the hollow portion in such a manner as to be integrally formed with the first connection member, so that the first connection member and the second connection member block a fastening hole formed on a given region of a vehicle.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: November 6, 2018
    Assignee: HANON SYSTEMS
    Inventors: Chan Joo Maeng, Dae Woong Lee
  • Publication number: 20180040829
    Abstract: The present specification provides an organoluminescent device including a capping layer on one surface of an electrode.
    Type: Application
    Filed: September 8, 2016
    Publication date: February 8, 2018
    Applicant: LG Chem, Ltd.
    Inventors: Dae Woong Lee, Yeon-Ho Cho, Sang Young Jeon, Hyoung Seok Kim, Sang Duk Suh
  • Publication number: 20170373476
    Abstract: The present invention relates to a device for fixing a pipe and an electric wire that fastenedly blocks a fastening hole formed on a vehicle roof by means of a first connection member adapted to pass the pipe therethrough and a second connection member adapted to pass the electric wire therethrough, thus reducing the number of fastening holes formed on the vehicle roof and achieving easy assembling. According to the present invention, the device includes: a first connection member having a first through hole adapted to pass the pipe therethrough and a hollow portion formed on a given region thereof; and a second connection member having a second through hole adapted to pass the electric wire therethrough, wherein the second connection member has the corresponding shape to the hollow portion in such a manner as to be integrally formed with the first connection member, so that the first connection member and the second connection member block a fastening hole formed on a given region of a vehicle.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 28, 2017
    Inventors: Chan Joo MAENG, Dae Woong LEE
  • Patent number: 9722188
    Abstract: The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: August 1, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Jae-Soon Bae, Ji-Eun Kim, Hye-Young Jang, Jeung-Gon Kim, Jun-Gi Jang, Sung-Kil Hong, Tae-Yoon Park, Dae-Woong Lee
  • Publication number: 20170190234
    Abstract: An air conditioning system for motor vehicles includes an air conditioner case having an external air introduction port and an internal air introduction port, an intake door rotatably installed in the air conditioner case so as to open the external air introduction port in an external air mode and open the internal air introduction port in an internal air mode, a blower configured to draw an internal air or an external air through the external air introduction port or the internal air introduction port and to blow the internal air or the external air into a vehicle room, and a control unit configured to control the intake door to move in such a direction as to close the external air introduction port and to restrain entry of rainwater into the external air introduction port, if a rotation speed level of the blower satisfies a predetermined condition in the external air mode.
    Type: Application
    Filed: September 22, 2015
    Publication date: July 6, 2017
    Applicant: HANON SYSTEMS
    Inventors: Chan Joo Maeng, Min Woong Kang, Dae Woong Lee, Jin Kuk Kim, Heon Hur
  • Patent number: 9659833
    Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 23, 2017
    Assignee: SK hynix Inc.
    Inventors: Dae Woong Lee, Tae Min Kang, Han Jun Bae
  • Publication number: 20170031073
    Abstract: The present invention relates to a polarizing plate including a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin, an amine-based metal compound, and a pH adjuster, and the pH adjuster includes epoxy (meth)acrylate, alcohol, and acid, and a method for manufacturing the same.
    Type: Application
    Filed: May 22, 2015
    Publication date: February 2, 2017
    Inventors: Sung Hyun NAM, Seunghee NAM, Kyun II RAH, Dae Woong LEE
  • Publication number: 20170010494
    Abstract: The present invention relates to a polarizing plate including a polyethylene terephthalate film and having an excellent optical property, and a method for manufacturing the same, and the polarizing plate of the present invention includes: a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin and a glyoxalate crosslinking agent at a weight ratio of 100:5 to 100:50, and the primer layer is formed by using a primer composition including a polyester-based compound and an acryl-based compound.
    Type: Application
    Filed: May 22, 2015
    Publication date: January 12, 2017
    Inventors: Sung Hyun NAM, Seunghee NAM, Kyun Il RAH, Dae Woong LEE
  • Patent number: 9543251
    Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: January 10, 2017
    Assignee: SK HYNIX INC.
    Inventors: Tae Min Kang, Dae Woong Lee, Jong Hoon Kim
  • Publication number: 20160211188
    Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.
    Type: Application
    Filed: July 24, 2015
    Publication date: July 21, 2016
    Inventors: Dae Woong LEE, Tae Min KANG, Han Jun BAE