Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes: a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: A method of preparing a wholly aromatic liquid crystalline polyester amide resin and a method of preparing a wholly aromatic liquid crystalline polyester amide resin compound. The method of preparing a wholly aromatic liquid crystalline polyester amide resin is performed using a monomer having both a hydroxyl group and an acetylamino group or using a monomer having a hydroxyl group and a monomer having an acetylamino group. In addition, the method of preparing a wholly aromatic liquid crystalline polyester amide resin compound is performed using a wholly aromatic liquid crystalline polyester amide resin that is prepared using the method.

Abstract: Methods of preparing an aromatic liquid crystalline polyester resin and an aromatic liquid crystalline polyester resin compound are disclosed. A method of preparing an aromatic liquid crystalline polyester resin may include: acetylating a first monomer including an amino group by a reaction with a carboxylic acid anhydride; acetylating a second monomer including a hydroxyl group and not including an amino acid group with an additional carboxylic acid anhydride; and synthesizing an aromatic liquid crystalline polyester prepolymer by a condensation polymerization reaction of the acetylated first and second monomers with dicarboxylic acid. A method of preparing an aromatic liquid crystalline polyester resin compound may use the aromatic liquid crystalline polyester resin prepared according to the forgoing method.

Abstract: There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Abstract: The present invention discloses a refrigerator with a water tank for supplying water to an ice tray by closing of a door. A refrigerator includes a cooling chamber for storing an article at a low temperature, an ice tray positioned in the cooling chamber and filled with water, for making ice, a water tank with a water supply hole for storing water and supplying water to the ice tray, and a valve for selectively opening and closing the water supply hole. In addition, a refrigerator includes a cooling chamber for storing an article at a low temperature, a main body for defining the cooling chamber, a door for opening and closing the cooling chamber, an ice tray positioned inside the door and filled with water, for making ice, a water tank with a water supply hole for storing water and supplying water to the ice tray, and a valve for selectively opening and closing the water supply hole.

Abstract: The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.

Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.

Abstract: A wideband digitally-controlled oscillator (DCO) is provided. The wideband DCO includes an active element which is driven by a first digital control signal; a single inductor which is connected to the active element in parallel, and comprises fixed inductance; and a plurality of capacitors which are connected to the single inductor in parallel, and vary operating frequency by being selectively turned on or off by a second digital control signal. Accordingly, the wideband DCO capable of operating in a wideband frequency range using a single inductor is provided, and if the wideband DCO is implemented using a single integrated circuit (IC) chip, the size of chip is reduced as the single inductor is used.

Abstract: The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

Abstract: There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.

Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Abstract: There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Abstract: A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

Abstract: A backlight unit for a liquid crystal display (LCD) device, disposed under a liquid crystal panel to illuminate the liquid crystal panel. The backlight unit includes a light guide plate, first and second light emitting diode (LED) arrays, disposed on adjacent sides, perpendicular to each other, of the light guide plate, each array having a plurality of LED blocks, consisting of one or more LEDs, and a control unit that controls electric signals, respectively inputted to the LED blocks, to regulate luminance for the respective LED blocks, wherein light emitted from the first and second LED arrays is overlapped each other in the light guide plate.

Abstract: Disclosed is a data transmission system that transmits data by using a relay. The relay selects a transmission terminal from among a plurality of terminals accessing a base station. A base station transmits base station data to the relay during a first time slot, and the transmission terminal transmits terminal data to the relay. The relay transmits terminal data to the base station during a second time slot, and transmits base station data to the transmission terminal.

Abstract: A transceiver device capable of calibration, and a calibration method used by the transceiver device. The transceiver device includes a reference transceiver, a plurality of remaining transceivers, and a plurality of transmission calibration paths connecting the remaining transceivers to the reference transceiver for transmission calibration of the remaining transceivers. An envelope detector included in the reference transceiver is shared with the remaining transceivers. When implementing a multiple input multiple output (MIMO) transceiver in a single chip, the chip size and manufacturing cost of the MIMO transceiver device can be substantially reduced.

Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.

Abstract: A polarized semiconductor light emitting device includes a semiconductor structure having a first conductivity semiconductor layer, an active layer and a second conductivity semiconductor layer sequentially stacked. Also, the semiconductor structure further includes a plurality of light guide parts defined by a plurality of grooves arranged along a predetermined direction. The grooves extend from the second conductivity semiconductor layer with a depth reaching at least the active layer, and the light guide parts have a length greater than a width thereof to selectively emit a polarized component in a length direction thereof.