Abstract: A positive electrode active material for a lithium secondary battery has secondary micro particles having an average particle size (D50) of 1 to 10 ?m formed by agglomeration of primary macro particles having an average particle size (D50) of 0.5 to 3 ?m and a lithium-M oxide coating layer on all or part of a surface, wherein M is at least one selected from the group consisting of boron, cobalt, manganese and magnesium. The secondary macro particles have an average particle size (D50) of 5 to 20 ?m formed by agglomeration of primary micro particles having a smaller average particle size (D50) than the primary macro particles. The primary macro particles and the primary micro particles are represented by LiaNi1?b?c?dCobMncQdO2+?, wherein 1.0?a?1.5, 0<b<0.2, 0<c<0.2, 0?d?0.1, 0<b+c+d?0.2, ?0.1???1.0, and Q is at least one type of metal selected from the group consisting of Al, Mg, V, Ti and Zr.

Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.

Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.

Abstract: In one embodiment, a light emitting device package includes a light emitting device including a substrate and a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, stacked on the substrate; a reflective conductive layer provided on the light emitting structure; and a first electrode and a second electrode overlying the reflective conductive layer separated from each other in a first region. The first electrode and the second electrode are electrically insulated from the reflective metal layer and penetrate through the reflective metal layer to be electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively.