Patents by Inventor Dae Yung Yun

Dae Yung Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Imaging device module package
    Publication number: 20030048378
    Abstract: Disclosed is an imaging device package, in particular, comprising: a circuit board electrically connected to an image sensor chip through wire bonding; a housing adhered to the circuit board except for an area wire bonded with the sensor chip and having an opening at the top and steps with rounded sides around the opening; and a holder at the bottom having a ring-shaped opening corresponding to the steps around the opening of the housing for interference fitting around the steps and an lens internally fitted to the holder.
    Type: Application
    Filed: November 19, 2001
    Publication date: March 13, 2003
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Jun Kim, Dae Yung Yun