Abstract: A display panel includes a first substrate including a display area, in which a plurality of pixel areas is arranged, and a non-display area around the display area, a second substrate disposed opposite to the first substrate, a light emitting array disposed on the first substrate and including a plurality of light emitting elements corresponding to the plurality of pixel areas, a sealing layer disposed in the non-display area between the first substrate and the second substrate and bonding the first substrate and the second substrate to each other, a vacuum layer sealed by the sealing layer and defined between the light emitting array and the second substrate, and a reflection adjustment layer disposed on the second substrate and absorbing a portion of external light, where the reflection adjustment layer includes a plurality of protrusions protruding toward the light emitting array and exposed to the vacuum layer.

Abstract: An organic light-emitting display apparatus includes a substrate; a display unit which defines an active area on the substrate and includes a thin film transistor and an organic light-emitting device electrically connected to each other; and an encapsulation layer disposed on a top surface and a side surface of the display unit, the encapsulation layer including at least a first inorganic layer, a first organic layer, and a second inorganic layer that are sequentially stacked, and the first organic layer covers the first inorganic layer.

Abstract: An organic light emitting display panel is disclosed. In one embodiment, the panel includes a pad portion includes: a protection film disposed on an encapsulation layer for encapsulating a pixel portion and extending to the pad portion, wherein the protection film has conductivity in an area corresponding to the pad portion.

Abstract: An organic light-emitting display apparatus includes a substrate; a display unit which defines an active area on the substrate and includes a thin film transistor and an organic light-emitting device electrically connected to each other; and an encapsulation layer disposed on a top surface and a side surface of the display unit, the encapsulation layer including at least a first inorganic layer, a first organic layer, and a second inorganic layer that are sequentially stacked, and the first organic layer covers the first inorganic layer.

Abstract: An organic light emitting diode display includes: a substrate; a display area including an organic light emitting element on the substrate; an organic encapsulation layer covering the organic light emitting element and having a second boundary spaced from a first boundary of the display area by a first distance; and an inorganic encapsulation layer having a peripheral area contacting the substrate and covering the organic encapsulation layer.

Abstract: A method of manufacturing an organic light emitting diode (OLED) display is disclosed. In one aspect, the method includes preparing a substrate, forming a spacer on the substrate along an edge of the substrate, forming a driving circuit and an organic light emitting diode on the substrate to be surrounded by the spacer and forming an encapsulation thin film so as to substantially cover the driving circuit and the organic light emitting diodel. The mask that is used in the forming of the driving circuit and the organic light emitting diode is supported by and contacts the spacer.

Abstract: In an organic light-emitting display apparatus and a method of manufacturing the same, the organic light-emitting display apparatus comprises: a substrate; a light-emitting unit formed on the substrate; and an encapsulation film, which covers the light-emitting unit on the substrate, and which includes a plurality of organic layers and a plurality of inorganic layers which are alternately stacked.

Abstract: In a flat panel display device and a method of manufacturing the same, the flat panel display device is manufactured by forming a display unit on a substrate, forming a hydrophobic barrier layer for preventing a material of an organic layer from flowing around the display unit, and forming a thin film sealing layer by alternately stacking an inorganic layer and the organic layer on the display unit. Accordingly, formation of an edge tail of the organic layer is prevented, thereby preventing penetration of external moisture.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the display includes i) a substrate, ii) a driving circuit formed on the substrate, iii) an organic light emitting diode formed on the substrate and electrically connected to the driving circuit, iv) an encapsulation thin film formed on the driving circuit and organic light emitting diode and v) a spacer formed on the substrate and surrounding the encapsulation thin film.

Abstract: A manufacturing method of an organic light emitting diode (OLED) display device includes forming a thin film transistor and an organic light emitting diode in a display area of a first substrate, forming a thin film encapsulation layer that has a layering structure of an organic film and an inorganic film on one substrate of the first substrate and a second substrate, forming a sealing member by coating a sealing material that includes an inorganic sealant and an organic compound on an edge of the second substrate, removing the organic compound of the sealing member by baking the sealing member, layering the second substrate on the first substrate so that the sealing member contacts the first substrate, dissolving the sealing member by using a laser beam, solidifying the sealing member, attaching the sealing member to the first substrate, and removing the second substrate from the sealing member.

Abstract: An organic light emitting diode display includes: a substrate; a display area including an organic light emitting element on the substrate; an organic encapsulation layer covering the organic light emitting element and having a second boundary spaced from a first boundary of the display area by a first distance; and an inorganic encapsulation layer having a peripheral area contacting the substrate and covering the organic encapsulation layer.

Abstract: An organic light emitting display panel is disclosed. In one embodiment, the panel includes a pad portion includes: a protection film disposed on an encapsulation layer for encapsulating a pixel portion and extending to the pad portion, wherein the protection film has conductivity in an area corresponding to the pad portion.

Abstract: In an organic light-emitting display apparatus and a method of manufacturing the same, the organic light-emitting display apparatus comprises: a substrate; a light-emitting unit formed on the substrate; and an encapsulation film, which covers the light-emitting unit on the substrate, and which includes a plurality of organic layers and a plurality of inorganic layers which are alternately stacked.

Abstract: In a flat panel display device and a method of manufacturing the same, the flat panel display device is manufactured by forming a display unit on a substrate, forming a hydrophobic barrier layer for preventing a material of an organic layer from flowing around the display unit, and forming a thin film sealing layer by alternately stacking an inorganic layer and the organic layer on the display unit. Accordingly, formation of an edge tail of the organic layer is prevented, thereby preventing penetration of external moisture.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the display includes i) a substrate, ii) a driving circuit formed on the substrate, iii) an organic light emitting diode formed on the substrate and electrically connected to the driving circuit, iv) an encapsulation thin film formed on the driving circuit and organic light emitting diode and v) a spacer formed on the substrate and surrounding the encapsulation thin film.

Abstract: A manufacturing method of an organic light emitting diode (OLED) display device includes forming a thin film transistor and an organic light emitting diode in a display area of a first substrate, forming a thin film encapsulation layer that has a layering structure of an organic film and an inorganic film on one substrate of the first substrate and a second substrate, forming a sealing member by coating a sealing material that includes an inorganic sealant and an organic compound on an edge of the second substrate, removing the organic compound of the sealing member by baking the sealing member, layering the second substrate on the first substrate so that the sealing member contacts the first substrate, dissolving the sealing member by using a laser beam, solidifying the sealing member, attaching the sealing member to the first substrate, and removing the second substrate from the sealing member.