Patents by Inventor Daehee NAM

Daehee NAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device including printed circuit board having shielding structure
    Patent number: 11848279
    Abstract: Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: December 19, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Daehee Nam, Yanghwan Kim, Dongkil Choi, Jeongho Kang
  • ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD HAVING SHIELDING STRUCTURE
    Publication number: 20220223538
    Abstract: Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 14, 2022
    Inventors: Daehee NAM, Yanghwan KIM, Dongkil CHOI, Jeongho KANG