Abstract: In a method of designing a semiconductor device, a first sub-block included in the semiconductor device is designed by a first EDA tool. A second sub-block included in the semiconductor device is designed by a second EDA tool different from the first EDA tool. A first sub-block model corresponding to the first sub-block and a second sub-block model corresponding to the second sub-block are generated by transforming logical information and physical information associated with one of a result of designing the first sub-block or a result of designing the second sub-block. The first and the second sub-block model have a same format. An integrated physical design for the semiconductor device is obtained by combining the first and the second sub-block based on the first and the second sub-block model. The first and the second EDA tool are configured to design different physical structures for a same logical block.

Abstract: A semiconductor device includes a substrate, input/output areas in a first direction and a second direction, parallel to an upper surface of the substrate and intersecting to each other, the input/output areas each including semiconductor elements providing an input/output circuit, lower wiring patterns connected to the semiconductor elements, and input/output pins connected to the lower wiring patterns, and bumps connected to the input/output pins by upper wiring patterns on the same layer as the input/output pins. The input/output areas include a first input/output area and a second input/output area, and each of the first input/output area and the second input/output area includes a first area and a second area sequentially in the first direction, and in the first input/output area, the input/output pin is in the first area, and in the second input/output area, the input/output pin is in the second area.

Abstract: In a method of designing a semiconductor device, a first sub-block included in the semiconductor device is designed by a first EDA tool. A second sub-block included in the semiconductor device is designed by a second EDA tool different from the first EDA tool. A first sub-block model corresponding to the first sub-block and a second sub-block model corresponding to the second sub-block are generated by transforming logical information and physical information associated with one of a result of designing the first sub-block or a result of designing the second sub-block. The first and the second sub-block model have a same format. An integrated physical design for the semiconductor device is obtained by combining the first and the second sub-block based on the first and the second sub-block model. The first and the second EDA tool are configured to design different physical structures for a same logical block.