Patents by Inventor DAEKEON KIM

DAEKEON KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230215723
    Abstract: To manufacture an integrated circuit (IC) device, a structure in which a first material film including silicon atoms and nitrogen atoms and a second material film devoid of nitrogen atoms is formed on a substrate. A carbonyl compound having a functional group without an ?-hydrogen is applied to the structure, and thus, an inhibitor is selectively formed only on an exposed surface of the first material film from among the first material film and the second material film.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 6, 2023
    Applicant: ADEKA CORPORATION
    Inventors: EUNHYEA KO, Hoon Han, Soyoung Lee, Thanh Cuong Nguyen, Hiroyuki Uchiuzou, Kiyoshi Murata, Tomoharu Yoshino, Daekeon Kim, Younjoung Cho, Jiyu Choi, Byungkeun Hwang
  • Publication number: 20220415450
    Abstract: A method of estimating solubility includes obtaining input data representing a chemical structure of a target material; generating at least one descriptor based on the input data; obtaining at least one solubility parameter by providing the at least one descriptor to a machine learning model trained based on chemical structures and sample solubility parameters of sample materials; and calculating the solubility based on the at least one solubility parameter, wherein the at least one descriptor includes at least one of a zero-dimensional descriptor, a one-dimensional descriptor, a two-dimensional descriptor, or a three-dimensional descriptor, each representing the chemical structure of the target material.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 29, 2022
    Inventors: THANH CUONG NGUYEN, DAEKEON KIM, JIYOUNG PARK, HYUNWOO KIM, SEUNGMIN LEE, INKOOK JANG, SUKKOO HONG
  • Publication number: 20210181628
    Abstract: Disclosed are resist compositions and semiconductor device fabrication methods using the same. The resist composition comprises a hypervalent iodine compound of Chemical Formula 1 below. Wherein R1 to R7 are as defined herein.
    Type: Application
    Filed: August 5, 2020
    Publication date: June 17, 2021
    Inventors: THANH CUONG NGUYEN, DAEKEON KIM, TSUNEHIRO NISHI, NAOTO UMEZAWA, HYUNWOO KIM