Abstract: The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal-clad and has thermal expansion coefficient of 20 ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5 ppm/K and a glass transition temperature Tg of resin of the first polyimide layer is 300° C.<Tg<350° C., which is lower than a maximum curing temperature.

Abstract: Provided are a flexible metal clad laminate and a method for manufacturing the same. The flexible metal clad laminate is obtained by applying a polyimide precursor resin convertible into a polyimide resin many times onto a metal clad, followed by drying, and by converting the polyimide precursor resin into a polyimide resin through infrared ray (IR) heat treatment. The polyimide resin layer that is in direct contact with the metal clad has a glass transition temperature of 300° C. or higher, and the polyimide resin layer has an overall linear thermal expansion coefficient of 20 ppm/K or lower. It is possible to obtain a flexible metal clad laminate for flexible printed circuit boards that causes no curling before and after etching, shows a small change in dimension caused by heat treatment, and has high adhesion to a metal clad and excellent appearance after completing imidization.

Abstract: The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal-clad and has thermal expansion coefficient of 20 ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5 ppm/K and a glass transition temperature Tg of resin of the first polyimide layer is 300° C.<Tg<350° C., which is lower than a maximum curing temperature.