Patents by Inventor Daerok OH
Daerok OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11863215Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.Type: GrantFiled: February 16, 2023Date of Patent: January 2, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Takayuki Nakamura, Daerok Oh
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Patent number: 11757478Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.Type: GrantFiled: September 29, 2022Date of Patent: September 12, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shigeru Tsuchida, Daerok Oh, Takahiro Katamata, Satoshi Goto, Mitsunori Samata, Yoshiki Yasutomo
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Publication number: 20230208452Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.Type: ApplicationFiled: February 16, 2023Publication date: June 29, 2023Inventors: Motoji TSUDA, Takayuki NAKAMURA, Daerok OH
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Patent number: 11621732Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.Type: GrantFiled: February 22, 2022Date of Patent: April 4, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Takayuki Nakamura, Daerok Oh
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Publication number: 20230020088Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.Type: ApplicationFiled: September 29, 2022Publication date: January 19, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Shigeru TSUCHIDA, Daerok OH, Takahiro KATAMATA, Satoshi GOTO, Mitsunori SAMATA, Yoshiki YASUTOMO
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Patent number: 11489547Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.Type: GrantFiled: October 9, 2020Date of Patent: November 1, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shigeru Tsuchida, Daerok Oh, Takahiro Katamata, Satoshi Goto, Mitsunori Samata, Yoshiki Yasutomo
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Patent number: 11411586Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.Type: GrantFiled: March 2, 2021Date of Patent: August 9, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hidetaka Takahashi, Satoshi Goto, Yoshiki Yasutomo, Daerok Oh, Yuuto Aoki, Yoshihiro Daimon, Naoya Matsumoto
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Publication number: 20220182081Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.Type: ApplicationFiled: February 22, 2022Publication date: June 9, 2022Inventors: Motoji TSUDA, Takayuki NAKAMURA, Daerok OH
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Patent number: 11329676Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.Type: GrantFiled: March 9, 2021Date of Patent: May 10, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kazuhito Nakai, Satoshi Goto, Hidetaka Takahashi, Daerok Oh
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Patent number: 11290135Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.Type: GrantFiled: April 5, 2021Date of Patent: March 29, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Takayuki Nakamura, Daerok Oh
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Publication number: 20210288680Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.Type: ApplicationFiled: March 2, 2021Publication date: September 16, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Hidetaka TAKAHASHI, Satoshi GOTO, Yoshiki YASUTOMO, Daerok OH, Yuuto AOKI, Yoshihiro DAIMON, Naoya MATSUMOTO
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Publication number: 20210288683Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.Type: ApplicationFiled: March 9, 2021Publication date: September 16, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Kazuhito NAKAI, Satoshi GOTO, Hidetaka TAKAHASHI, Daerok OH
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Publication number: 20210226651Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.Type: ApplicationFiled: April 5, 2021Publication date: July 22, 2021Inventors: Motoji TSUDA, Takayuki NAKAMURA, Daerok OH
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Patent number: 10998924Abstract: A high-frequency front end module includes a primary antenna and a secondary antenna, a first multiplexer and a second multiplexer, and a switch circuit, in which the first multiplexer has a transmission filter of a band A and a reception filter of the band A, and does not have a transmission filter of a band B, the second multiplexer has a transmission filter of the band B and a reception filter of the band B, and does not have a transmission filter of the band A, and the switch circuit exclusively switches connection between the primary antenna and the first multiplexer and connection between the primary antenna and the second multiplexer, and exclusively switches connection between the secondary antenna and the first multiplexer and connection between the secondary antenna and the second multiplexer.Type: GrantFiled: August 4, 2020Date of Patent: May 4, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Takayuki Nakamura, Daerok Oh
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Publication number: 20210111743Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.Type: ApplicationFiled: October 9, 2020Publication date: April 15, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Shigeru TSUCHIDA, Daerok OH, Takahiro KATAMATA, Satoshi GOTO, Mitsunori SAMATA, Yoshiki YASUTOMO
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Publication number: 20200366323Abstract: A high-frequency front end module includes a primary antenna and a secondary antenna, a first multiplexer and a second multiplexer, and a switch circuit, in which the first multiplexer has a transmission filter of a band A and a reception filter of the band A, and does not have a transmission filter of a band B, the second multiplexer has a transmission filter of the band B and a reception filter of the band B, and does not have a transmission filter of the band A, and the switch circuit exclusively switches connection between the primary antenna and the first multiplexer and connection between the primary antenna and the second multiplexer, and exclusively switches connection between the secondary antenna and the first multiplexer and connection between the secondary antenna and the second multiplexer.Type: ApplicationFiled: August 4, 2020Publication date: November 19, 2020Inventors: Motoji TSUDA, Takayuki NAKAMURA, Daerok OH