Patents by Inventor Daeseop Byeon

Daeseop Byeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230361215
    Abstract: A semiconductor device including a substrate extending in a first direction and a second direction perpendicular to the first direction, a first active pattern protruding from a top surface of the substrate and extending in the first direction, an isolation pattern covering a sidewall of the first active pattern on the substrate, first silicon patterns spaced apart from each other in a third direction on the first active pattern, the third direction perpendicular to the first direction and second direction, a first source/drain layer extending in the third direction from a top surface of the first active pattern on the first active pattern, and in contact with sidewalls of the first silicon patterns, wherein a sidewall of the first source/drain layer in the second direction has a constant inclination with respect to the top surface of the substrate, and a gate structure extending in the second direction while filling a gap between the first silicon patterns on the substrate.
    Type: Application
    Filed: April 12, 2023
    Publication date: November 9, 2023
    Applicants: Samsung Electronics Co., Ltd., Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Gyeom Kim, Daehong Ko, Jinbum Kim, Sangmoon Lee, Daeseop Byeon, Seran Park, Hyunsu Shin, Kiseok Lee, Chunghee Jo