Patents by Inventor Daesuck HWANG
Daesuck HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230253388Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.Type: ApplicationFiled: April 14, 2023Publication date: August 10, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu CHUNG, Gyun HEO, Tackmo LEE, Kyungwoon JANG, Soonmin HONG, Daesuck HWANG
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Publication number: 20230223388Abstract: A display module including a plurality of pixels, according to an embodiment, may include: a first substrate: a plurality of inorganic light-emitting elements disposed on the upper surface of the first substrate; a plurality of micro pixel controllers disposed on the lower surface of the first substrate; and a driver IC which transmits driving signals to the plurality of micro pixel controllers, wherein each of the plurality of pixels includes two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and each of the plurality of micro pixel controllers controls two or more pixels among the plurality of pixels.Type: ApplicationFiled: March 15, 2023Publication date: July 13, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu CHUNG, Tackmo LEE, Kyungwoon JANG, Gyun HEO, Soonmin HONG, Daesuck HWANG
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Publication number: 20220415873Abstract: A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.Type: ApplicationFiled: September 2, 2022Publication date: December 29, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu CHUNG, Changsun KANG, Huigyeong AHN, Kyungwoon JANG, Sangtae HAN, Daesuck HWANG
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Patent number: 11362249Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.Type: GrantFiled: August 12, 2020Date of Patent: June 14, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu Chung, Changjoon Lee, Kwangrae Jo, Sungyong Min, Wonsoon Park, Kyungwoon Jang, Daesuck Hwang
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Publication number: 20220149112Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.Type: ApplicationFiled: November 11, 2021Publication date: May 12, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Daesuck HWANG, Kyungwoon JANG, Changkyu CHUNG, Gyun HEO, Soonmin HONG
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Patent number: 11189675Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.Type: GrantFiled: November 12, 2019Date of Patent: November 30, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu Chung, Changjoon Lee, Kyungwoon Jang, Gyun Heo, Youngjun Moon, Kwangrae Jo, Soonmin Hong, Daesuck Hwang
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Publication number: 20210111324Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.Type: ApplicationFiled: August 12, 2020Publication date: April 15, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu CHUNG, Changjoon Lee, Kwangrae Jo, Sungyong Min, Wonsoon Park, Kyungwoon Jang, Daesuck Hwang
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Publication number: 20200403123Abstract: Various embodiments comprise: a substrate; a plurality of unit electric elements arranged on the substrate at regular intervals; and at least one conductive path electrically connected to each of the plurality of unit electric elements nearby and having an energized inspection area formed at an end thereof. It is possible to determine whether each of the plurality of unit electric elements is electrically good or defective by using an energized inspection area of the conductive path. Other various embodiments may be possible.Type: ApplicationFiled: March 5, 2019Publication date: December 24, 2020Inventors: Kyungwoon JANG, Changjoon LEE, Daesuck HWANG
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Publication number: 20200152721Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.Type: ApplicationFiled: November 12, 2019Publication date: May 14, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Changkyu CHUNG, Changjoon LEE, Kyungwoon JANG, Gyun HEO, Youngjun MOON, Kwangrae JO, Soonmin HONG, Daesuck HWANG