Patents by Inventor Daesung Ju

Daesung Ju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY CONDUCTIVE ADHESIVES AND ADHESIVE TAPE USING THE SAME
    Publication number: 20100233926
    Abstract: Disclosed is a thermally conductive adhesive comprising an adhesive polymer resin, a thermally conductive filler and a microhollow filler. The adhesive comprising a microhollow filler that can form a porous structure, in addition to a thermally conductive filler, can provide an adhesive tape having excellent thermal conductivity and adhesive properties.
    Type: Application
    Filed: October 22, 2008
    Publication date: September 16, 2010
    Inventors: Ju-Young Shin, Sungpil Moon, Daesung Ju