Patents by Inventor Daesung SON

Daesung SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417787
    Abstract: A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a plurality of solar cells each including a semiconductor substrate and first and second electrodes, each of which has a different polarity and is extended in a first direction on a back surface of the semiconductor substrate, and a plurality of conductive lines extended in a second direction crossing the first direction on the back surface of the semiconductor substrate, connected to one of the first and second electrodes through a conductive adhesive, and insulated from the other electrode by an insulating layer. The conductive adhesive includes a first adhesive layer connected to the one electrode and a second adhesive layer positioned on the first adhesive layer and connected to the plurality of conductive lines.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 16, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyeyoung Yang, Chunghyun Lim, Taehee Shin, Bojoong Kim, Taeki Woo, Ayoung Bak, Daesung Son, Junhan Kwon
  • Publication number: 20170069776
    Abstract: A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a plurality of solar cells each including a semiconductor substrate and first and second electrodes, each of which has a different polarity and is extended in a first direction on a back surface of the semiconductor substrate, and a plurality of conductive lines extended in a second direction crossing the first direction on the back surface of the semiconductor substrate, connected to one of the first and second electrodes through a conductive adhesive, and insulated from the other electrode by an insulating layer. The conductive adhesive includes a first adhesive layer connected to the one electrode and a second adhesive layer positioned on the first adhesive layer and connected to the plurality of conductive lines.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 9, 2017
    Applicant: LG ELECTRONICS INC.
    Inventors: Hyeyoung YANG, Chunghyun LIM, Taehee SHIN, Bojoong KIM, Taeki WOO, Ayoung BAK, Daesung SON, Junhan KWON