Abstract: A semiconductor package includes a first semiconductor chip, a plurality of semiconductor chips disposed on a lower surface of the first semiconductor chip, a first encapsulation layer and a second encapsulation layer. The plurality of semiconductor chips include a substrate and through-silicon vias penetrating the substrate and the through-silicon vias protrude from a lower surface of the substrate. The first encapsulation layer includes a first material and covers side surfaces of the through-silicon vias and side surface of the substrate, and the second encapsulation layer includes a second material including an organic resin and an inorganic filler. The second encapsulation layer covers the first encapsulation layer and a portion of the first encapsulation layer and a portion of the second encapsulation layer are disposed between the through-silicon vias.

Abstract: A semiconductor package includes; a redistribution wiring layer, a controller chip centrally disposed on the redistribution wiring layer, a first sealant disposed on the redistribution wiring layer, wherein the controller chip is buried in the first sealant, through vias connected to the redistribution wiring layer through the first sealant, and a sub-package disposed on an upper surface of the first sealant. The sub-package may include a first stack structure disposed to one side of the controller chip on the upper surface of the first sealant and including vertically stacked chips, a second stack structure disposed to another side of the controller chip on the upper surface of the first sealant adjacent to the first stack structure in a first horizontal direction and including vertically stacked chips, and a second sealant sealing the first stack structure and the second stack structure.

Abstract: A method of manufacturing a semiconductor package includes: hybrid-bonding a semiconductor chip, including a through-silicon via, to an upper surface of a semiconductor wafer, wet-etching a surface of the semiconductor chip to expose the through-silicon via, covering the exposed through-silicon via with a material, including an organic resin and an inorganic filler, to form an encapsulation layer, removing an upper surface of the encapsulation layer to expose the through-silicon via, and forming a redistribution structure electrically connected to the through-silicon via.

Abstract: A semiconductor package includes a semiconductor chip including a plurality of through vias, a plurality of stacked structures located on a top surface of the semiconductor chip and including a plurality of core chips stacked in a vertical direction, the plurality of stacked structures spaced apart from one another in a horizontal direction, a stiffener located on the plurality of stacked structures, a first adhesive layer located on a bottom surface of the stiffener and including a top surface having the same area as a bottom surface of the stiffener, and a molding layer located on a top surface of the semiconductor chip and surrounding the plurality of stacked structures, the stiffener, and the first adhesive layer. A thermal expansion coefficient of the stiffener is the same as that of the semiconductor chip, and an uppermost surface of the molding layer is coplanar with a top surface of the stiffener.

Abstract: Disclosed is an air conditioner. The air conditioner includes: an outdoor unit having therein a compressor for compressing refrigerant; at least one indoor unit; a storage configured to store a database on a power quantity used by the air conditioner; and a controller. The controller is configured to: based on the database, calculate an estimated power quantity expected to be used by the air conditioner for at least a part of an entire period, based on a preset maximum power quantity for the entire period and the calculated estimated power quantity, determine a target power quantity for a specific unit time, which is expected to be used by the air conditioner for the specific unit time of the entire period; control the compressor for the specific unit time based on the target power quantity; and in response to arrival of a point in time to update the target power quantity, add, to the database, the power quantity used by the air conditioner for the specific unit time.

Abstract: A method of controlling an air conditioner including collecting indoor unit data of each of a plurality of indoor units connected to an outdoor unit; controlling a total flow rate of refrigerant supplied to the plurality of indoor units based on a total load of the indoor units, which is determined based on the indoor unit data of the respective indoor units; and controlling an individual flow rate of refrigerant flowing to the respective indoor units based on clusters of the respective indoor units which are matched based on the indoor unit data of the respective indoor units.

Abstract: A laundry treatment apparatus includes a cabinet, an inner case disposed in the cabinet and provided with walls defining an accommodation space in which clothes are accommodated, a supply unit configured to supply at least one of air or moisture to the accommodation space, a clothes hanger disposed in the accommodation space so as to support the accommodated clothes, and a sensor assembly installed between the cabinet and the inner case, and configured to sense at least one of a quantity of clothes accommodated in the accommodation space and a position of the accommodated clothes by emitting electromagnetic waves as a signal and receiving a reflected signal.

Abstract: The present invention relates to a cleaner with a lightweight structure by integrating a discharge circuit line of a power supply line connected from a battery to a cleaning nozzle with a charge circuit line for charging the battery. According to embodiments of the present invention, there is an advantage that the lightweight of the cleaner can be achieved by integrating a discharge path and a charge path to a power supply line without being structurally distinguished, and since a discharge function and a charge function can all be performed on a circuit line of some sections of the power supply line, there is an advantage that the cost can be saved compared to implementing the charge and discharge circuits in separate structures.

Abstract: An air conditioner and a method of controlling an air conditioner are provided. The air conditioner includes at least one outdoor unit and a plurality of indoor units, each having at least one vane for adjusting wind direction. The method includes classifying the plurality of indoor units by indoor space using air temperature distributions over time detected by first temperature sensors. Relative positions between indoor units in a same space are determined based on floor temperature distributions detected by second temperature sensors. A reference indoor unit is selected, and each individual vane of indoor units adjacent to the reference indoor unit is adjusted. Changes in the air temperature of the reference indoor unit are detected in response to an operation of each individual vane of the adjacent indoor units. A direction of each individual vane of the adjacent indoor units is then determined based on the resulting change in the air temperature of the reference indoor unit.

Abstract: Provided is a cleaner including: a suction nozzle configured to suck in outside air; a brush motor configured to rotate a brush installed in the suction nozzle and sweeping up dust; a suction motor configured to generate a suction force of the suction nozzle; an acceleration sensor installed on the suction nozzle and configured to sense accelerations along three axes that are orthogonal to each other in a spatial coordinate system; a power supply unit configured to supply power to the brush motor and the acceleration sensor; and a controller configured to control the brush motor, the suction motor, and the power supply unit based on a variation of an x-axis acceleration provided by the acceleration sensor and a sum of acceleration variations which is obtained by summing variations of x-, y-, and z-axis accelerations provided by the acceleration sensor.

Abstract: The present disclosure relates to a cleaner station and a cleaner system, and a method for controlling the cleaner system. According to an embodiment, by driving the suction motor of the cleaner after the drive of the dust collecting motor of the cleaner station is finished, it is possible to suck back, into the dust bin, foreign substances such as strands of hair etc. which stuck and remain in an open end of the dust bin even after collecting the dust in the dust bin so that the foreign substances can be removed.

Abstract: In a water purifier or other liquid dispenser, a sensor configured to transmit and receive a distance measuring signal is installed in a water discharge module moving vertically or disposed at the front of a main body, to sense a height of the inlet of a container accurately without a no-response duration of the sensor. Additionally, in the water purifier, the water discharge module discharges purified water at a point spaced a certain distance apart from the inlet of the container, to prevent the inlet of the container from contacting the lower surface of the water discharge module.

Abstract: The present disclosure relates to a cleaner system and a method of controlling the same, the cleaner system including a cleaner including a dust bin configured to collect dust, and a cleaner station to which the cleaner is coupled, in which the cleaner includes a suction motor configured to generate a suction force to the dust bin, a suction force of the suction motor is changed at least one or more times, and a flow direction of the dust in a flow path part connected to the dust bin is changed reversely at least one or more times, such that when debris firmly caught by the dust bin has strong resistance against an airflow in one direction, an airflow may be applied in the opposite direction to effectively remove the debris.

Abstract: A water purifier or other liquid dispenser may sense a height of the inlet of a container accurately through an infrared transmitter and an infrared receiver that are disposed at different positions of a water discharge module moving vertically. Additionally, in the water purifier, the water discharge module may discharge purified water at a point spaced a certain distance apart from the inlet of the container, based on infrared sensing, thereby preventing the inlet of the container from contacting the lower surface of the water discharge module.

Abstract: A semiconductor package, comprising: a first redistribution wiring layer including first and second surfaces opposite to each other, wherein the first redistribution wiring layer includes a first chip mounting region and a second chip mounting region adjacent to the first chip mounting region; a connection layer on the first surface of the first redistribution wiring layer; a first semiconductor chip on the first chip mounting region on the connection layer; a second semiconductor chip spaced apart from the first semiconductor chip on the second chip mounting region on the connection layer, wherein the second semiconductor chip includes through electrodes; a molding member on the first and second semiconductor chips on the connection layer; and a second redistribution wiring layer on the molding member, wherein the second redistribution wiring layer is electrically connected to the first redistribution wiring layer through the through electrodes.

Abstract: A water purifier or other liquid dispenser may sense a height of the inlet of a container accurately through an infrared transmitter and an infrared receiver that are disposed at different positions of a water discharge module moving vertically. Additionally, in the water purifier, the water discharge module may discharge purified water at a point spaced a certain distance apart from the inlet of the container, based on infrared sensing, thereby preventing the inlet of the container from contacting the lower surface of the water discharge module.

Abstract: In a water purifier or other liquid dispenser, a sensor configured to transmit and receive a distance measuring signal is installed in a water discharge module moving vertically or disposed at the front of a main body, to sense a height of the inlet of a container accurately without a no-response duration of the sensor. Additionally, in the water purifier, the water discharge module discharges purified water at a point spaced a certain distance apart from the inlet of the container, to prevent the inlet of the container from contacting the lower surface of the water discharge module.

Abstract: In a water purifier or other liquid dispenser, a sensor configured to transmit and receive a distance measuring signal is installed in a water discharge module moving vertically or disposed at the front of a main body, to sense a height of the inlet of a container accurately without a no-response duration of the sensor. Additionally, in the water purifier, the water discharge module discharges purified water at a point spaced a certain distance apart from the inlet of the container, to prevent the inlet of the container from contacting the lower surface of the water discharge module.

Abstract: A water purifier or other liquid dispenser may sense a height of the inlet of a container accurately through an infrared transmitter and an infrared receiver that are disposed at different positions of a water discharge module moving vertically. Additionally, in the water purifier, the water discharge module may discharge purified water at a point spaced a certain distance apart from the inlet of the container, based on infrared sensing, thereby preventing the inlet of the container from contacting the lower surface of the water discharge module.

Abstract: A water purifier or other liquid dispenser may sense a height of the inlet of a container accurately through an infrared transmitter and an infrared receiver that are disposed at different positions of a water discharge module moving vertically. Additionally, in the water purifier, the water discharge module may discharge purified water at a point spaced a certain distance apart from the inlet of the container, based on infrared sensing, thereby preventing the inlet of the container from contacting the lower surface of the water discharge module.