Abstract: A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

Abstract: A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.

Abstract: A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.