Patents by Inventor Dae-Wook Yang

Dae-Wook Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit underfill package system
    Patent number: 7741726
    Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: June 22, 2010
    Assignee: Stats Chippac Ltd.
    Inventors: Hyung Jun Jeon, Ki Youn Jang, Dae-Wook Yang
  • INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM
    Publication number: 20090096112
    Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
    Type: Application
    Filed: December 16, 2008
    Publication date: April 16, 2009
    Inventors: Hyung Jun Jeon, Ki Youn Jang, Dae-Wook Yang
  • Integrated circuit underfill package system
    Patent number: 7485502
    Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: February 3, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Hyung Jun Jeon, Ki Youn Jang, Dae-Wook Yang
  • INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM
    Publication number: 20070176285
    Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
    Type: Application
    Filed: January 31, 2006
    Publication date: August 2, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Hyung Jun Jeon, Ki Youn Jang, Dae-Wook Yang