Patents by Inventor Dae Woong Lee

Dae Woong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960271
    Abstract: The present invention relates to a power plant early warning device and method which employ a multiple prediction model, and includes: a plurality of prediction models which receive information about the operation states of equipment in a power plant, and output prediction values and the reliabilities of the prediction values; a reliability analysis module which quantizes and analyzes the reliabilities output from the plurality of prediction models to determine the ranks of the plurality of prediction models, and calculates a final prediction value; a comparison module which compares the final prediction value with an actual measurement value, and outputs a residual; and a determination module which analyzes the residual to determine whether there are defects in the operating states of the equipment in the power plant.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: April 16, 2024
    Assignee: KOREA HYDRO & NUCLEAR POWER CO., LTD
    Inventors: Ji Ho Min, Dae Woong Kim, Do Hwan Lee, Yun Goo Kim
  • Publication number: 20240119949
    Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 11, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
  • Patent number: 11949881
    Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: April 2, 2024
    Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong University
    Inventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim
  • Patent number: 11878569
    Abstract: An air circulator for a vehicle is provided. The air circulator includes a blower case and a connection duct that is connected to an outlet of the blower case. The connector duct includes a first path and a second path that are divided by a separation plate. Additionally, a filter is mounted in the outlet of the blower case and an inlet door is mounted in the blower case to selectively allow air to be blown into the first path and/or the second path.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 23, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Hanon Systems
    Inventors: Jae Woo Lee, Dae Woong Lee, In Keun Kang
  • Publication number: 20220251355
    Abstract: An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.5 to 2.3, (c) a melting temperature of 85° C. or less, and (d) a free volume proportional constant (C2) of 600 or less. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.
    Type: Application
    Filed: December 17, 2020
    Publication date: August 11, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Jin Sam Gong, Eun Jung Lee, Young Woo Lee, Jung Ho Jun, Dae Woong Lee, Jin Kuk Lee
  • Publication number: 20220195101
    Abstract: A polyolefin-polystyrene multi-block copolymer and method of making the same is disclosed herein. In some embodiments, a polyolefin-polystyrene multi-block copolymer having a ratio of a loss modulus (E?) to a storage modulus (E?) satisfying the following conditions (a) and (b) over a temperature range of ?80° C. to 40° C., wherein the ratio is represented by a loss tangent (tan ?) value and is obtained by dynamic mechanical analysis (DMA), (a) a maximum of the tan ? value in a peak present in the temperature range is 0.20 to 0.35, and (b) a half-width of the peak ranges from 32.0° C. to 50.0° C. The polyolefin-polystyrene multi-block copolymer has a structure in which polystyrene chains are attached to both ends of a polyolefin chain.
    Type: Application
    Filed: May 15, 2020
    Publication date: June 23, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Ji Hyun Park, Dae Woong Lee, Sung Hyun Park, Seok Pil Sa, Seul Ki Im, Hyun Mo Lee, Yun Kon Kim, Ki Soo Lee, Myung Han Lee, Eun Ji Shin
  • Patent number: 11362283
    Abstract: The present specification provides an organoluminescent device including a capping layer on one surface of an electrode, wherein the capping layer includes a compound represented by Chemical Formula 1: X, and R1 to R5 are defined therein.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 14, 2022
    Inventors: Dae Woong Lee, Yeon-Ho Cho, Sang Young Jeon, Hyoung Seok Kim, Sang Duk Suh
  • Publication number: 20220149317
    Abstract: A display device includes a substrate; a transistor disposed on the substrate; a first electrode connected to the transistor; an auxiliary electrode disposed on the same layer as the first electrode; an emission layer disposed on the first electrode; and a second electrode disposed on the emission layer, wherein the auxiliary electrode includes an opening, and a side surface of the auxiliary electrode and the second electrode are in direct contact at the opening of the auxiliary electrode.
    Type: Application
    Filed: August 31, 2021
    Publication date: May 12, 2022
    Inventors: Sang Gyun Kim, Dae Woong Lee, Ill Hun Cho
  • Publication number: 20220081501
    Abstract: The present invention relates to an ethylene/alpha-olefin copolymer having a high weight average molecular weight and narrow molecular weight distribution, and at the same time, a reduced characteristic relaxation time, thereby showing excellent physical properties, and a method for preparing the same. A resin composition having improved volume resistance and excellent light transmittance may be prepared by using such ethylene/alpha-olefin copolymer. Accordingly, the ethylene/alpha-olefin copolymer may be utilized in various uses in electrical and electronic industrial fields.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 17, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Young Woo Lee, Seul Ki Kim, Dae Woong Lee, Jin Kuk Lee, Eun Jung Lee, Jin Sam Gong, Jung Ho Jun, Jun Hyuk Lee
  • Publication number: 20210347229
    Abstract: An air circulator for a vehicle is provided. The air circulator includes a blower case and a connection duct that is connected to an outlet of the blower case. The connector duct includes a first path and a second path that are divided by a separation plate. Additionally, a filter is mounted in the outlet of the blower case and an inlet door is mounted in the blower case to selectively allow air to be blown into the first path and/or the second path.
    Type: Application
    Filed: October 28, 2020
    Publication date: November 11, 2021
    Inventors: Jae Woo Lee, Dae Woong Lee, In Keun Kang
  • Publication number: 20210095613
    Abstract: A cylinder block includes an extension portion that is shaped to extend toward the cylinder liner and is formed on an end portion of the cylinder block so as to form a surface contact with a head gasket. In particular, the cylinder liner includes an end portion forming an accommodation groove portion that is shaped to correspond to the extension portion, and a part of the end portion of the cylinder liner is supported on a circumferential surface of the extension portion and is linked to the accommodation groove portion. In addition, the part of the end portion of the cylinder liner forms a surface contact with the head gasket.
    Type: Application
    Filed: January 16, 2020
    Publication date: April 1, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young Gi KIM, Jong Beom SEO, Byung Hyun LEE, Myoung Ho LEE, Joong Hyun HWANG, Jin Woo CHO, Dae Woong LEE, Chang Min LEE
  • Patent number: 10714405
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: July 14, 2020
    Assignee: SK hynix Inc.
    Inventor: Dae Woong Lee
  • Publication number: 20190355645
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Application
    Filed: August 1, 2019
    Publication date: November 21, 2019
    Applicant: SK hynix Inc.
    Inventor: Dae Woong LEE
  • Patent number: 10451915
    Abstract: The present invention relates to a polarizing plate including a polyethylene terephthalate film and having an excellent optical property, and a method for manufacturing the same, and the polarizing plate of the present invention includes: a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin and a glyoxalate crosslinking agent at a weight ratio of 100:5 to 100:50, and the primer layer is formed by using a primer composition including a polyester-based compound and an acryl-based compound.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: October 22, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sung Hyun Nam, Seunghee Nam, Kyun Il Rah, Dae Woong Lee
  • Patent number: 10451916
    Abstract: The present invention relates to a polarizing plate including a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin, an amine-based metal compound, and a pH adjuster, and the pH adjuster includes epoxy (meth)acrylate, alcohol, and acid, and a method for manufacturing the same.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: October 22, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sung Hyun Nam, Seunghee Nam, Kyun II Rah, Dae Woong Lee
  • Patent number: 10410947
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 10, 2019
    Assignee: SK hynix Inc.
    Inventor: Dae Woong Lee
  • Patent number: 10353125
    Abstract: The present disclosure relates to a polarizing plate including an adhesive layer, a primer layer and a polyethylene terephthalate film which are sequentially formed on at least one side of a polarizer, wherein the adhesive layer in the present disclosure is formed by an active energy ray-curable adhesive including a first epoxy compound of which a homopolymer has a glass transition temperature of 120° C. or higher, a second epoxy compound of which a homopolymer has a glass transition temperature of 60° C. or lower, and a cationic photopolymerization initiator, and wherein the primer layer is formed by a primer composition including one or more binder resins selected from the group consisting of polyester and polyvinyl alcohol-based resins, and one or more cross-linking agents selected from the group consisting of acrylic cross-linking agents, epoxy-based cross-linking agents and polyvinyl alcohol-based cross-linking agents.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: July 16, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sung-Hyun Nam, Eun-Mi Seo, Seung-Hee Nam, Dae-Woong Lee, Kyun-Il Rah
  • Publication number: 20190148257
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
    Type: Application
    Filed: July 16, 2018
    Publication date: May 16, 2019
    Applicant: SK hynix Inc.
    Inventor: Dae Woong LEE
  • Patent number: 10122156
    Abstract: The present invention relates to a device for fixing a pipe and an electric wire that fastenedly blocks a fastening hole formed on a vehicle roof by means of a first connection member adapted to pass the pipe therethrough and a second connection member adapted to pass the electric wire therethrough, thus reducing the number of fastening holes formed on the vehicle roof and achieving easy assembling. According to the present invention, the device includes: a first connection member having a first through hole adapted to pass the pipe therethrough and a hollow portion formed on a given region thereof; and a second connection member having a second through hole adapted to pass the electric wire therethrough, wherein the second connection member has the corresponding shape to the hollow portion in such a manner as to be integrally formed with the first connection member, so that the first connection member and the second connection member block a fastening hole formed on a given region of a vehicle.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: November 6, 2018
    Assignee: HANON SYSTEMS
    Inventors: Chan Joo Maeng, Dae Woong Lee
  • Publication number: 20180040829
    Abstract: The present specification provides an organoluminescent device including a capping layer on one surface of an electrode.
    Type: Application
    Filed: September 8, 2016
    Publication date: February 8, 2018
    Applicant: LG Chem, Ltd.
    Inventors: Dae Woong Lee, Yeon-Ho Cho, Sang Young Jeon, Hyoung Seok Kim, Sang Duk Suh