Patents by Inventor Daeyoon BAEK

Daeyoon BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing multilayer structure
    Patent number: 12692589
    Abstract: Provided is a method for manufacturing a multilayer structure. The method for manufacturing the multilayer structure includes providing a substrate in a chamber, providing a target in the chamber, and allowing a target material to be incident into the substrate so as to form a material layer. The target includes magnesium oxide or beryllium oxide. An incident angle of the target material to the substrate is about 9.14° or less.
    Type: Grant
    Filed: November 3, 2023
    Date of Patent: July 28, 2026
    Assignees: Korea Institute Of Science And Technology, Inha University Research And Business Foundation
    Inventors: Hyung-Jun Kim, Rino Choi, Seung-Hwan Kim, Daeyoon Baek
  • METHOD FOR MANUFACTURING MULTILAYER STRUCTURE
    Publication number: 20240200185
    Abstract: Provided is a method for manufacturing a multilayer structure. The method for manufacturing the multilayer structure includes providing a substrate in a chamber, providing a target in the chamber, and allowing a target material to be incident into the substrate so as to form a material layer. The target includes magnesium oxide or beryllium oxide. An incident angle of the target material to the substrate is about 9.14° or less.
    Type: Application
    Filed: November 3, 2023
    Publication date: June 20, 2024
    Applicants: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY, Inha University Research and Business Foundation
    Inventors: Hyung-jun KIM, Rino CHOI, Seung-Hwan KIM, Daeyoon BAEK
  • SEMICONDUCTOR DEVICE INCLUDING TRENCH WITH UNDERCUT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230142462
    Abstract: Embodiments relate to a semiconductor device including a trench with undercut structure including a substrate made of a first material; an insulation layer formed on an upper surface of the substrate; at least one trench penetrating the insulation layer toward the substrate; and at least one seed layer formed in the trench, the seed layer made of a second material which is different from the first material, and a method for manufacturing the same.
    Type: Application
    Filed: October 25, 2022
    Publication date: May 11, 2023
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyung-jun KIM, Seunghwan KIM, Daeyoon BAEK