Abstract: Provided are a scalable analog passive intermodulation (PIM) module, a method of controlling analog PIM, a signal processing circuit, and a sensor device. The scalable analog PIM module includes a first plural number of digital-to-analog converters (DACs), a first plural number of static random access memory (SRAM) calculators connected to the first plural number of DACs, at least one analog-to-digital converter (ADC) connected to the first plural number of SRAM calculators and configured to convert an analog convolution result signal into digital convolution data, and an analog PIM controller configured to output an enable control signal for enabling a second number, which is equal to or less than first plural number, of SRAM calculators among the first plural number of SRAM calculators to the first plural number of SRAM calculators on the basis of the convolution data output from the ADC.

Abstract: Disclosed is a method of diagnosing a vehicle including an electric motor performed in the vehicle. The method includes acquiring first to third measurement values for a temperature, a voltage, and a current associated with the electric motor from one or more sensors installed for the electric motor, calculating first to third scores for a predetermined diagnostic factor based on each of the first to third measurement values, reading a weight for each of the temperature, the voltage, and the current with regard to the predetermined diagnostic factor from a database installed in the vehicle, and calculating a comprehensive diagnostic score for the predetermined diagnostic factor based on the weight for each of the first to third scores and the predetermined diagnostic factor.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: Provided are a scalable analog passive intermodulation (PIM) module, a method of controlling analog PIM, a signal processing circuit, and a sensor device. The scalable analog PIM module includes a first plural number of digital-to-analog converters (DACs), a first plural number of static random access memory (SRAM) calculators connected to the first plural number of DACs, at least one analog-to-digital converter (ADC) connected to the first plural number of SRAM calculators and configured to convert an analog convolution result signal into digital convolution data, and an analog PIM controller configured to output an enable control signal for enabling a second number, which is equal to or less than first plural number, of SRAM calculators among the first plural number of SRAM calculators to the first plural number of SRAM calculators on the basis of the convolution data output from the ADC.

Abstract: A door opening and closing apparatus for a vehicle that prevents door opening during a collision includes an operation member configured to operate to open a door; and a blocking lever engaged to the operation member and configured to limit the operating of the operation member during a collision of a vehicle, wherein the blocking lever includes an operation slot formed along a tracking path along which a linkage member operating the operation member and the blocking lever by linkage to each other is moved from a locking position to an unlocking position; and a blocking slot formed to branch off from the operation slot, wherein during the collision of the vehicle, the blocking lever is rotated or moved, and thus the linkage member is moved from the operation slot to the blocking slot, being blocked from reaching the unlocking position.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: According to various embodiment of the present invention, in a diagnosis system including a sensing module that senses the state of a motor is installed in a car, disclosed are a method for determining failure of a motor in a car comprising the steps of: (a) acquiring sensed values by sensing the state variables of the motor by the sensing module; (b) extracting two or more feature values by converting the sensed values acquired by the sensing module; (c) converting the two or more feature values into scaled feature values based on at least one scaling algorithm; and (d) determining a state of the motor based on a learned labeling algorithm and the scaled feature value, and setting a label representing the state of the motor to the scaled feature value corresponding to the state of the motor.

Abstract: According to various embodiment of the present invention, in a diagnosis system including a sensing module that senses the state of a motor is installed in a car, disclosed are a method for determining failure of a motor in a car comprising the steps of: (a) acquiring sensed values by sensing the state variables of the motor by the sensing module; (b) extracting two or more feature values by converting the sensed values acquired by the sensing module; (c) generating two clusters which classify and include the two or more feature values based on the two or more feature values and determining a normal cluster among the two clusters; and (d) determining the state of the motor as a failure-expected state or a safe state by applying at least one classifier to the feature values included in the normal cluster.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: Provided are a scalable analog passive intermodulation (PIM) module, a method of controlling analog PIM, a signal processing circuit, and a sensor device. The scalable analog PIM module includes a first plural number of digital-to-analog converters (DACs), a first plural number of static random access memory (SRAM) calculators connected to the first plural number of DACs, at least one analog-to-digital converter (ADC) connected to the first plural number of SRAM calculators and configured to convert an analog convolution result signal into digital convolution data, and an analog PIM controller configured to output an enable control signal for enabling a second number, which is equal to or less than first plural number, of SRAM calculators among the first plural number of SRAM calculators to the first plural number of SRAM calculators on the basis of the convolution data output from the ADC.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.