Patents by Inventor Dafu Lu

Dafu Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11657947
    Abstract: A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: May 23, 2023
    Assignee: Shenzhen Sunlord Electronics Co., Ltd.
    Inventors: Wenjie Wang, Dafu Lu
  • Publication number: 20220115176
    Abstract: A laminated electronic device includes a laminate wherein the laminate includes a plurality of laminated insulator layers, the laminate has a multi-layer coil pattern provided between the plurality of insulator layers in a laminated manner, adjacent layers of the coil pattern are electrically connected through conductive via holes to form an internal coil, a first external electrode and a second external electrode are disposed on a bottom surface of the laminate which is parallel to a direction of lamination. In surface-mounting of the laminated electronic device, it only needs to connect the external electrodes on the bottom surface of the laminate to a soldering board, and needs not to preserve a space for solder wicking in the surrounding, thereby significantly saving the occupied space of surface mount components to achieve high-density mounting; in addition, the Q value of the product is improved.
    Type: Application
    Filed: August 25, 2021
    Publication date: April 14, 2022
    Applicant: Shenzhen Sunlord Electronics Co., Ltd.
    Inventors: Dafu LU, Jieyong QIN, Zhenren LIANG, Shuyan LI
  • Publication number: 20200273616
    Abstract: A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.
    Type: Application
    Filed: May 14, 2020
    Publication date: August 27, 2020
    Inventors: Wenjie WANG, Dafu LU
  • Publication number: 20180130588
    Abstract: An inductor and a method for manufacturing the same are disclosed. The inductor includes a magnetic body and a conductor coil, where the conductor coil is inside the magnetic body; and further includes an inorganic insulation layer, where the inorganic insulation layer is wrapped on a surface of the conductor coil, and the inorganic insulation layer is inside the magnetic body. According to the present application, an inductor having a higher inductance or an inductor having a lower direct current resistance may be manufactured.
    Type: Application
    Filed: January 4, 2018
    Publication date: May 10, 2018
    Inventors: Youyun Li, Dafu Lu
  • Patent number: 9251952
    Abstract: A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to form external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: February 2, 2016
    Assignee: ShenZhen Sunlord Electronics Co., Ltd.
    Inventors: Youyun Li, Dafu Lu, Yang Zhang, Cong Yuan
  • Publication number: 20150020378
    Abstract: A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to fen external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.
    Type: Application
    Filed: March 23, 2012
    Publication date: January 22, 2015
    Applicant: Shenzhen Sunlord Electronics Co.,Ltd.
    Inventors: Youyun Li, Dafu Lu, Yang Zhang, Cong Yuan