Patents by Inventor Dag SONNTAG
Dag SONNTAG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11714357Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.Type: GrantFiled: June 30, 2021Date of Patent: August 1, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Alexander Ypma, Cyrus Emil Tabery, Simon Hendrik Celine Van Gorp, Chenxi Lin, Dag Sonntag, Hakki Ergün Cekli, Ruben Alvarez Sanchez, Shih-Chin Liu, Simon Philip Spencer Hastings, Boris Menchtchikov, Christiaan Theodoor De Ruiter, Peter Ten Berge, Michael James Lercel, Wei Duan, Pierre-Yves Jerome Yvan Guittet
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Publication number: 20220351075Abstract: A method of determining a contribution of a process feature to the performance of a process of patterning substrates. The method may include obtaining a first model trained on first process data and first performance data. One or more substrates may be identified based on a quality of prediction of the first model when applied to process data associated with the one or more substrates. A second model may be trained on second process data and second performance data associated with the identified one or more substrates. The second model may be used to determine the contribution of a process feature of the second process data to the second performance data associated with the one or more substrates.Type: ApplicationFiled: June 5, 2020Publication date: November 3, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Vahid BASTANI, Dag SONNTAG, Reza SAHRAEIAN, Dimitra GKOROU
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Publication number: 20210325788Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.Type: ApplicationFiled: June 30, 2021Publication date: October 21, 2021Applicant: ASML NETHERLANDS B.V.Inventors: Alexander YPMA, Cyrus Emil TABERY, Simon Hendrik Celine VAN GORP, Chenxi LIN, Dag SONNTAG, Hakki Ergün CEKLI, Ruben ALVAREZ SANCHEZ, Shih-Chin LIU, Simon Philip Spencer HASTINGS, Boris MENCHTCHIKOV, Christiaan Theodoor DE RUITER, Peter TEN BERGE, Michael James LERCEL, Wei DUAN, Pierre-Yves Jerome Yvan GUITTET
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Patent number: 11099485Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.Type: GrantFiled: April 9, 2018Date of Patent: August 24, 2021Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Vahid Bastani, Dag Sonntag, Jelle Nije, Hakki Ergün Cekli, Georgios Tsirogiannis, Robert Jan Van Wijk
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Patent number: 11086229Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.Type: GrantFiled: March 29, 2018Date of Patent: August 10, 2021Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Cyrus Emil Tabery, Simon Hendrik Celine Van Gorp, Chenxi Lin, Dag Sonntag, Hakki Ergün Cekli, Ruben Alvarez Sanchez, Shih-Chin Liu, Simon Philip Spencer Hastings, Boris Menchtchikov, Christiaan Theodoor De Ruiter, Peter Ten Berge, Michael James Lercel, Wei Duan, Pierre-Yves Jerome Yvan Guittet
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Publication number: 20210157247Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.Type: ApplicationFiled: April 9, 2018Publication date: May 27, 2021Applicant: ASML NETHERLANDS B.VInventors: Alexander YPMA, Vahid BASTANI, Dag SONNTAG, Jelle NIJE, Hakki Ergün CEKLI, Georgios TSIROGIANNIS, Robert Jan VAN WIJK
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Publication number: 20200356881Abstract: Substrates to be processed are partitioned based on pre-processing data that is associated with substrates before a process step. The data is partitioned using a partition rule and the substrates are partitioned into subsets in accordance with subsets of the data obtained by the partitioning. Corrections are applied, specific to each subset. The partition rule is obtained using decision tree analysis on a training set of substrates. The decision tree analysis uses pre-processing data associated with the training substrates before they were processed, and post-processing data associated with the training substrates after being subject to the process step. The partition rule that defines the decision tree is selected from a plurality of partition rules based on a characteristic of subsets of the post-processing data. The associated corrections are obtained implicitly at the same time.Type: ApplicationFiled: January 22, 2019Publication date: November 12, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Vahid BASTANI, Alexander YPMA, Dag SONNTAG, Everhardus Comelis MOS, Hakki Ergün CEKLI, Chenxi LIN
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Publication number: 20200103761Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.Type: ApplicationFiled: March 29, 2018Publication date: April 2, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Alexander YPMA, Cyrus Emil TABERY, Simon Hendrik Celine VAN GORP, Chenxi LIN, Dag SONNTAG, Hakki Ergün CEKLI, Ruben ALVAREZ SANCHEZ, Shih-Chin LIU, Simon Philip Spencer HASTINGS, Boris MENCHTCHIKOV, Christiaan Theodoor DE RUTTER, Peter TEN BERGE, Michael James LERCEL, Wei DUAN, Pierre-Yves Jerome Yvan GUITTET