Abstract: A display module is disclosed. The display module includes a pixel that includes: first to third self-luminescence elements that are configured to emit light of an ultraviolet wavelength range; first to third color conversion layers respectively corresponding to light emitting surfaces of the first to third self-luminescence elements; a first color filter and a second color filter respectively corresponding to the first color conversion layer and the second color conversion layer; a transparent resin layer corresponding to the third color conversion layer and disposed on a same plane as a plane at which the first color filter and the second color filter are positioned; a transparent cover layer that covers the first color filter, the second color filter, and the transparent resin layer; and an ultraviolet (UV) cutoff filter that covers the transparent cover layer.

Abstract: A display module is provided. The display module includes a substrate, a conductive light absorption layer provided on a surface of the substrate, and a plurality of pixels electrically coupled to the substrate through the conductive light absorption layer. Each of the plurality of pixels may include a first self-luminescence element, a second self-luminescence element and a third self-luminescence element, each emitting light of a same color, a first color conversion layer corresponding to a light emitting surface of the first self-luminescence element and a second color conversion layer corresponding to a light emitting surface of the second self-luminescence element, and a first color filter corresponding to the first color conversion layer and a second color filter corresponding to the second color conversion layer.

Abstract: Disclosed herein is a light emitting device and a display apparatus capable of improving design freedom. A package is provided with light extraction regions LR, LG, and LB and a partition region D provided on an outside of the light extraction regions LR, LG, and LB. The package includes an LED provided in the light extraction regions LR, LG, and LB and configured to emit light of a predetermined wavelength range and wavelength conversion layers 13R, 13G and 13B provided in the light extraction regions LR, LG, and LB and configured to convert the wavelength of light emitted from the LED. The package includes a wall portion provided in the partition region D and a first laminated portion provided in the partition region D and including a material different from a material forming the wall portion.

Abstract: A composition containing a solvent and a polyimide resin precursor and/or polyimide resin, wherein the polyimide resin precursor and/or polyimide resin includes a compound represented by Formula (0) below and/or a compound represented by Formula (0?) below, and a compound including a functional group that reacts with a terminally cyclized product of the compound represented by Formula (0) below and/or the compound represented by Formula (0?) below. In Formula (0) and Formula (0?) above, R? each independently represent a hydrogen atom or an alkyl group. Ra represents a tetracarboxylic acid residue. Rb represents a diamine residue. Ra and/or Rb includes one linking group including an active hydrogen and/or one or more and four or less substituents including an active hydrogen. p and q represent given integers.

Abstract: Disclosed herein is a light emitting device and a display apparatus capable of improving design freedom. A package is provided with light extraction regions LR, LG, and LB and a partition region D provided on an outside of the light extraction regions LR, LG, and LB. The package includes an LED provided in the light extraction regions LR, LG, and LB and configured to emit light of a predetermined wavelength range and wavelength conversion layers 13R, 13G and 13B provided in the light extraction regions LR, LG, and LB and configured to convert the wavelength of light emitted from the LED. The package includes a wall portion provided in the partition region D and a first laminated portion provided in the partition region D and including a material different from a material forming the wall portion.

Abstract: Provided are a light emitting diode capable of improving contrast, a method for manufacturing a light emitting diode, a light emitting diode display device, and a method for manufacturing a light emitting diode display device. The light emitting diode according to an embodiment comprises a package substrate having an electrode provided therein; a light emitting diode chip provided on the package substrate; a power line electrically connecting the light emitting diode chip to the electrode; and a black layer covering the electrode including a part connected to the power line.

Abstract: Provided are a light emitting diode capable of improving contrast, a method for manufacturing a light emitting diode, a light emitting diode display device, and a method for manufacturing a light emitting diode display device. The light emitting diode according to an embodiment comprises a package substrate having an electrode provided therein; a light emitting diode chip provided on the package substrate; a power line electrically connecting the light emitting diode chip to the electrode; and a black layer covering the electrode including a part connected to the power line.

Abstract: A frame body surrounding a perimeter of each light-emitting element is provided one surface of a substrate. Glass films having apertures are formed on the substrate by glass printing to form the frame body.

Abstract: A light-emitting device includes a substrate, a plurality of light-emitting elements mounted on one surface of the substrate, a first glass film provided to one surface of the substrate and having a plurality of apertures that form a light-reflecting frame surrounding the perimeter of each the light-emitting elements, and a second glass film provided to the other surface of the substrate. A coefficient of thermal expansion of the second glass film is greater than that of the substrate when a coefficient of thermal expansion of the first glass film is greater than that of the substrate, and a coefficient of thermal expansion of the second glass film is less than that of the substrate when a coefficient of thermal expansion of the first glass film is less than that of the substrate.

Abstract: A frame body surrounding a perimeter of each light-emitting element is provided one surface of a substrate. Glass films having apertures are formed on the substrate by glass printing to form the frame body.

Abstract: A light-emitting device includes a substrate, a plurality of light-emitting elements mounted on one surface of the substrate, a first glass film provided to one surface of the substrate and having a plurality of apertures that form a light-reflecting frame surrounding the perimeter of each the light-emitting elements, and a second glass film provided to the other surface of the substrate. A coefficient of thermal expansion of the second glass film is greater than that of the substrate when a coefficient of thermal expansion of the first glass film is greater than that of the substrate, and a coefficient of thermal expansion of the second glass film is less than that of the substrate when a coefficient of thermal expansion of the first glass film is less than that of the substrate.

Abstract: A semiconductor device can include a plurality of semiconductor elements. The characteristics of each of the semiconductor elements can be easily tested during the production of the semiconductor device or when a failure occurs after the semiconductor device is mounted on a substrate, so that the quality can be well managed and a failure can be reliably analyzed. When not mounted on the substrate, the semiconductor device can have a connection structure in which the plurality of semiconductor elements are electrically independent of each other, so that their characteristics can be tested and analyzed by independently energizing the semiconductor elements. In a semiconductor device module having the semiconductor device mounted thereon, the connection structure can include a parallel circuit of the plurality of semiconductor elements.

Abstract: A light emitting device is configured to prevent leakage of light but can be reduced in thickness as compared with conventional devices, and can effectively prevent degradation in luminous flux (luminous flux drop). The light emitting device can include a light emitting element, an optically transparent sealing resin having a pair of faces opposed to each other with an axis of light emitting direction of the light emitting device interposed therebetween. The sealing resin can cover the light emitting element and be mixed with a wavelength converting material. A reflective film can be provided on at least one of the pair of opposed faces of the sealing resin. The reflective film can be a white coating containing a white pigment in a concentration of 23 wt % to 54 wt % and formed to be 14 ?m to 50 ?m in thickness.

Abstract: A semiconductor device can include a plurality of semiconductor elements. The characteristics of each of the semiconductor elements can be easily tested during the production of the semiconductor device or when a failure occurs after the semiconductor device is mounted on a substrate, so that the quality can be well managed and a failure can be reliably analyzed. When not mounted on the substrate, the semiconductor device can have a connection structure in which the plurality of semiconductor elements are electrically independent of each other, so that their characteristics can be tested and analyzed by independently energizing the semiconductor elements. In a semiconductor device module having the semiconductor device mounted thereon, the connection structure can include a parallel circuit of the plurality of semiconductor elements.

Abstract: The disclosed subject matter relates to a light emitting semiconductor apparatus with reduced color unevenness and suppressed topical deterioration over time with regard to an amount and chromaticity of the illuminating light. The light emitting semiconductor apparatus of the disclosed subject matter can include three separate bonding pads. Among those, the centrally located bonding pad is die bonded to two types of light emitting devices which have an identical material and structure and almost equal sizes, but are different in orientation and direction characteristic of PN-electrodes. The bonding pad located in an outermost location is die-bonded to the light emitting device. In this case, the direction characteristic of a central light emitting device exhibits a substantial reverse conical form while the direction characteristic of the light emitting device exhibits a substantial conical form.

Abstract: A light emitting device is configured to prevent leakage of light but can be reduced in thickness as compared with conventional devices, and can effectively prevent degradation in luminous flux (luminous flux drop). The light emitting device can include a light emitting element, an optically transparent sealing resin having a pair of faces opposed to each other with an axis of light emitting direction of the light emitting device interposed therebetween. The sealing resin can cover the light emitting element and be mixed with a wavelength converting material. A reflective film can be provided on at least one of the pair of opposed faces of the sealing resin. The reflective film can be a white coating containing a white pigment in a concentration of 23 wt % to 54 wt % and formed to be 14 ?m to 50 ?m in thickness.

Abstract: A surface mount type light-emitting unit includes a light-emitting device. A first lead is connected electrically to a first electrode of the light-emitting device. A second lead is connected electrically to a second electrodc of the light-emitting device. A clear insulator seals the light-emitting device, a section connecting the first electrode to the first lead and a section connecting the second electrode to the second lead. An end of the first lead, forming a reflecting section, is molded into a cup-shaped portion having a flat bottom. The light-emitting device is bonded to the flat bottom. A surface of the reflecting section opposed to the flat bottom is exposed to a surface of thc insulator.

Abstract: The disclosed subject matter relates to a light emitting semiconductor apparatus with reduced color unevenness and suppressed topical deterioration over time with regard to an amount and chromaticity of the illuminating light. The light emitting semiconductor apparatus of the disclosed subject matter can include three separate bonding pads. Among those, the centrally located bonding pad is die bonded to two types of light emitting devices which have an identical material and structure and almost equal sizes, but are different in orientation and direction characteristic of PN-electrodes. The bonding pad located in an outermost location is die-bonded to the light emitting device. In this case, the direction characteristic of a central light emitting device exhibits a substantial reverse conical form while the direction characteristic of the light emitting device exhibits a substantial conical form.

Abstract: A surface mount type light-emitting unit composed of a light-emitting device, a first lead connected electrically with a first electrode of the light-emitting device, a second lead connected electrically with a second electrode of the light-emitting device, and a clear insulator for sealing the light-emitting device, a connecting section of the first electrode of the light-emitting device and the first lead, and a connecting section of the second electrode of the light-emitting device and the second lead wherein connecting terminal sections of the first and second leads for connecting them with external devices, respectively, are placed on a surface of the insulator, comprises an end of the first lead being molded into a cup-shaped portion having a flat bottom; the light-emitting device being bonded to the bottom inside a reflecting section corresponding to the molded cup-shaped portion of the first lead; and a surface opposed to that of the reflecting, section on which the light-emitting device has been bond

Abstract: A surface mount type light-emitting unit composed of a light-emitting device, a first lead connected electrically with a first electrode of the light-emitting device, a second lead connected electrically with a second electrode of the light-emitting device, and a clear insulator for sealing the light-emitting device, a connecting section of the first electrode of the light-emitting device and the first lead, and a connecting section of the second electrode of the light-emitting device and the second lead wherein connecting terminal sections of the first and second leads for connecting them with external devices, respectively, are placed on a surface of the insulator, comprises an end of the first lead being molded into a cup-shaped portion having a flat bottom; the light-emitting device being bonded to the bottom inside a reflecting section corresponding to the molded cup-shaped portion of the first lead; and a surface opposed to that of the reflecting section on which the light-emitting device has been bonde