Abstract: The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

Abstract: A repairing apparatus for removal of metal residuals on a display substrate is provided. The apparatus includes a storage container, comprising at least a first container configured to store a metal etchant; an adsorption component, configured to be adsorbed on a surface to be repaired on the display substrate and to cooperate with the surface to be repaired to define collectively a closed chamber therebetween; and a circulating pipe assembly, arranged to be connected and in fluid communication between the storage container and the adsorption component. The repairing apparatus may include a first fluid circuit arranged to be connected and in fluid communication between the first container and the adsorption component and configured to guide the metal etchant within the first container to flow to the adsorption component and into the chamber and then back into the first container.

Abstract: The present disclosure provides a positioning foot, a positioning device and a method for correcting position of a glass substrate, and belongs to the technical field of automatic positioning. The positioning foot of the present disclosure comprises: a contact member for contacting a side of the glass substrate; an elastic member, a first end of which is connected with the contact member and receives a counterforce from the glass substrate delivered by the contact member so as to compress the elastic member, and a second end of which is fixed; and a sensor fixed on the second end of the elastic member. Wherein, the contact member is arranged to be displaced with a compression action of the elastic member, and after the contact member is displaced to a predetermined position, the sensor is triggered to be in an “ON” state such that the elastic member stops the compression action.

Abstract: A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

Abstract: The present disclosure provides a positioning foot, a positioning device and a method for correcting position of a glass substrate, and belongs to the technical field of automatic positioning. The positioning foot of the present disclosure comprises: a contact member for contacting a side of the glass substrate; an elastic member, a first end of which is connected with the contact member and receives a counterforce from the glass substrate delivered by the contact member so as to compress the elastic member, and a second end of which is fixed; and a sensor fixed on the second end of the elastic member. Wherein, the contact member is arranged to be displaced with a compression action of the elastic member, and after the contact member is displaced to a predetermined position, the sensor is triggered to be in an “ON” state such that the elastic member stops the compression action.

Abstract: A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

Abstract: The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.