Patents by Inventor Dai Heon LEE

Dai Heon LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition, adhesive comprising same, and manufacturing method therefor
    Patent number: 11613679
    Abstract: The present invention relates to an adhesive composition comprising a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive comprising the same, and to a manufacturing method therefor and, more specifically, to an adhesive composition, which has little toxicity, can adhere even without a curing process unlike a conventional adhesive, enables the manufacturing of a gel by hydrogen binding characteristics between the polyvinyl alcohol compound and the water-soluble polyphenol compound, and retains adhesive properties in water.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: March 28, 2023
    Inventors: Hong Gu Hwang, Ick Kyung Sung, Du Hwan Kim, Jung Seok Hahn, Haeshin Lee, Dai Heon Lee
  • ADHESIVE COMPOSITION, ADHESIVE COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR
    Publication number: 20200362208
    Abstract: The present disclosure relates to an adhesive composition including a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive containing the composition, and to a manufacturing method therefor. The adhesive composition has a low or no toxicity, can adhere even without a curing process unlike a conventional adhesive, enables the manufacturing of a gel by hydrogen binding characteristics between the polyvinyl alcohol compound and the water-soluble polyphenol compound, and retains adhesive properties in water.
    Type: Application
    Filed: August 22, 2018
    Publication date: November 19, 2020
    Applicants: KOLON INDUSTRIES, INC., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hong Gu HWANG, Ick Kyung SUNG, Du Hwan KIM, Jung Seok HAHN, Haeshin LEE, Dai Heon LEE