Patents by Inventor Dai-Jin YEH

Dai-Jin YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer testing probe card
    Patent number: 9823272
    Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: November 21, 2017
    Assignee: MPI Corporation
    Inventors: Ming-Chi Chen, Tien-Chia Li, Dai-Jin Yeh, Tsung-Yi Chen, Chien-Kuei Wang
  • WAFER TESTING PROBE CARD
    Publication number: 20140210505
    Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 31, 2014
    Applicant: MPI Corporation
    Inventors: Ming-Chi CHEN, Tien-Chia LI, Dai-Jin YEH, Tsung-Yi CHEN, Chien-Kuei WANG