Patents by Inventor Dai Nagatani

Dai Nagatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Exposure apparatus, calibration method, and method of manufacturing article
    Patent number: 8988656
    Abstract: The present invention provides an exposure apparatus which exposes a substrate to light, the apparatus comprising a substrate stage, a position measurement unit configured to measure a position of the substrate stage, a structure configured to support the position measurement unit, a force measurement unit configured to measure a force that acts on the structure, a correction unit configured to correct a command for controlling the position of the substrate stage, based on the measurement value obtained by the force measurement unit, and a correction coefficient, and a calculation unit configured to calculate the correction coefficient based on position deviation information between adjacent shot regions in an evaluation substrate including a plurality of shot regions exposed without correction by the correction unit, and the measurement value obtained by the force measurement unit in exposing each shot region.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: March 24, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomohiro Harayama, Dai Nagatani, Kouji Yoshida, Yuichi Ozawa
  • EXPOSURE APPARATUS, CALIBRATION METHOD, AND METHOD OF MANUFACTURING ARTICLE
    Publication number: 20140016111
    Abstract: The present invention provides an exposure apparatus which exposes a substrate to light, the apparatus comprising a substrate stage, a position measurement unit configured to measure a position of the substrate stage, a structure configured to support the position measurement unit, a force measurement unit configured to measure a force that acts on the structure, a correction unit configured to correct a command for controlling the position of the substrate stage, based on the measurement value obtained by the force measurement unit, and a correction coefficient, and a calculation unit configured to calculate the correction coefficient based on position deviation information between adjacent shot regions in an evaluation substrate including a plurality of shot regions exposed without correction by the correction unit, and the measurement value obtained by the force measurement unit in exposing each shot region.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 16, 2014
    Inventors: Tomohiro Harayama, Dai Nagatani, Kouji Yoshida, Yuichi Ozawa