Abstract: A radiation-sensitive composition containing a resist compound having a high sensitivity, a high resolution, a high etching resistance, and a low outgas which forms a resist pattern with a good shape is described.

Abstract: The epoxy resin curing agent of the present invention comprises a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.

Abstract: The present invention can provide a 1,3-bis(hydroxyphenyl)-5-ethyladamantane compound represented by Formula (1) below and a method for producing the same, as well as an aromatic polycarbonate resin comprising said compound and a method for producing the same. (wherein, R represents an alkyl group with a carbon number of 1-6, a cycloalkyl group with a carbon number of 3-6, or a phenyl group, and n represents an integer of 0-2).

Abstract: A polyester resin having a diol unit containing a unit derived from ethylene glycol and a unit derived from a diol represented by the following formula (I), and a dicarboxylic acid unit containing a unit derived from an aromatic dicarboxylic acid in an amount of 50 mol % or more; wherein the entire diol unit contains the unit derived from ethylene glycol in an amount of 40 to 99 mol %, and the unit derived from a diol represented by formula (I) in an amount of 1 to 60 mol %: wherein A represents an aromatic ring selected from the group consisting of benzene, naphthalene, anthracene, phenanthrene and pyrene; R1 represents a C1 to C12 alkyl group, a substituted or unsubstituted C6 to C12 aryl group or a halogen atom; n represents an integer of 0 to 4; and when plural R1 are present, R1 may be the same as or different from each other.

Abstract: The epoxy resin curing agent of the present invention comprises a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.

Abstract: A bicyclohexane derivative compound useful in the field of photoresist, the field of intermediate of drugs and pesticides, and the like, and a manufacturing method of the same are provided. A bicyclohexane derivative compound represented by the following general formula (II) is provided. (In formula (II), Y independently represents an alkyl group of 1 to 10 carbons, a halogen atom, an acyloxy group, an alkoxycarbonyl group or a hydroxyl group, X1 represents a halogen atom, m represents an integer of 0 to 11, and m represents an integer of 0 to 10.).

Abstract: A radiation-sensitive composition containing a resist compound having a high sensitivity, a high resolution, a high etching resistance, and a low outgas which forms a resist pattern with a good shape is described.

Abstract: Disclosed is a glycol compound which is useful as a raw material and an intermediate for synthetic resins, additives for synthetic resins, medicines, cosmetics, food additives, surfactants and the like, further disclosed is a method for producing the compound. The glycol compound is represented by the following Formula (1): wherein R represents an alkyl group having 1 to 12 carbon atoms, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms or a halogen atom; n represents an integer of 1 to 4; and when n represents an integer of 2 to 4, plural R may be the same or different from each other.

Abstract: Disclosed is a glycol compound which is useful as a raw material and an intermediate for synthetic resins, additives for synthetic resins, medicines, cosmetics, food additives, surfactants and the like, further disclosed is a method for producing the compound. The above glycol compound is represented by the following Formula (1): wherein A represents a divalent linkage group comprising a condensed aromatic ring selected from the group consisting of naphthalene, anthracene, phenanthrene and pyrene; R represents an alkyl group having 1 to 12 carbon atoms, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms or a halogen atom; n represents an integer of 0 to 4; and when n represents an integer of 2 to 4, plural R may be the same or different from each other.

Abstract: A radiation-sensitive composition containing a resist compound having a high sensitivity, a high resolution, a high etching resistance, and a low outgas which forms a resist pattern with good shape and a method of forming a resist pattern and novel compositions for forming a photoresist under coat film which is excellent in optical properties and etching resistance and contains substantially no sublimable substance and an under coat film formed by the composition. Radiation-sensitive composition containing a solvent and a cyclic compound having, e.g., a cyclic compound (A) having a molecular weight of 700 to 5000 which is synthesized by the condensation reaction of a compound having 2 to 59 carbon atoms and 1 to 4 formyl groups with a compound having 6 to 15 carbon atoms and 1 to 3 phenolic hydroxyl groups, and a cyclic compound for use in the radiation-sensitive composition.

Abstract: This invention addresses problems to provide a cyclic compound having a high solubility in safety solvents and a high sensitivity and being good in the shape of the resulting resist pattern, a method of producing the same, a radiation sensitive composition comprising the same, and a method of forming a resist pattern using the radiation sensitive composition. As means for solving the problem, there are provided a cyclic compound having a specific structure, a radiation sensitive composition comprising the compound, and a method of forming a resist pattern using the composition.

Abstract: A radiation-sensitive composition containing 1 to 80% by weight of a solid component and 20 to 99% by weight of a solvent. The solid component contains a compound B which has (a) a structure derived from a polyphenol compound A by introducing an acid-dissociating group to at least one phenolic hydroxyl group of the polyphenol compound A which is synthesized by a condensation between a di- to tetrafunctional aromatic ketone or aromatic aldehyde each having 5 to 36 carbon atoms with a compound having 1 to 3 phenolic hydroxyl groups and 6 to 15 carbon atoms, and (b) a molecular weight of 400 to 2000. The composition containing the compound B is useful as an acid-amplified, non-polymeric resist material, because it is highly sensitive to radiation such as KrF excimer lasers, extreme ultraviolet rays, electron beams, and X-rays, and provides resist patterns with a high resolution, high heat resistance, and high etching resistance.

Abstract: A cyclic compound represented by formula (1): wherein L, R1, R?, and m are as defined in the specification. The cyclic compound of formula (1) is highly soluble to a safety solvent, highly sensitive, and capable of forming resist patterns with good profile. Therefore, the cyclic compound is useful as a component of a radiation-sensitive composition.

Abstract: A polyester resin having a diol unit containing a unit derived from ethylene glycol and a unit derived from a diol represented by the following formula (I), and a dicarboxylic acid unit containing a unit derived from an aromatic dicarboxylic acid in an amount of 50 mol % or more; wherein the entire diol unit contains the unit derived from ethylene glycol in an amount of 40 to 99 mol %, and the unit derived from a diol represented by formula (I) in an amount of 1 to 60 mol %: wherein A represents an aromatic ring selected from the group consisting of benzene, naphthalene, anthracene, phenanthrene and pyrene; R1 represents a C1 to C12 alkyl group, a substituted or unsubstituted C6 to C12 aryl group or a halogen atom; n represents an integer of 0 to 4; and when plural R1s are present, R1s may be the same as or different from each other.

Abstract: A polyester resin having a diol unit containing a unit derived from ethylene glycol and a unit derived from a diol represented by the following formula (I), and a dicarboxylic acid unit containing a unit derived from an aromatic dicarboxylic acid in an amount of 50 mol % or more; wherein the entire diol unit contains the unit derived from ethylene glycol in an amount of 40 to 99 mol %, and the unit derived from a diol represented by formula (I) in an amount of 1 to 60 mol %: wherein A represents an aromatic ring selected from the group consisting of benzene, naphthalene, anthracene, phenanthrene and pyrene; R1 represents a C1 to C12 alkyl group, a substituted or unsubstituted C6 to C12 aryl group or a halogen atom; n represents an integer of 0 to 4; and when plural R1s are present, R1s may be the same as or different from each other.

Abstract: A composition for forming an underlayer film for lithography for imparting excellent optical characteristics and etching resistance to an underlayer film for lithography, an underlayer film being formed of the composition and having a high refractive index (n) and a low extinction coefficient (k), being transparent, having high etching resistance, containing a significantly small amount of a sublimable component, and a method for forming a pattern using the underlayer film are provided. The composition for forming an underlayer film contains a naphthalene formaldehyde polymer having a specific unit obtained by reacting naphthalene and/or alkylnaphthalene with formaldehyde, and an organic solvent.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4], provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included This resin is excellent in heat resistance and useful for thermosetting resins.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included.

Abstract: A bicyclohexane derivative compound useful in the field of photoresist, the field of intermediate of drugs and pesticides, and the like, and a manufacturing method of the same are provided. A bicyclohexane derivative compound represented by the following general formula (II) is provided. (In formula (II), Y independently represents an alkyl group of 1 to 10 carbons, a halogen atom, an acyloxy group, an alkoxycarbonyl group or a hydroxyl group, X1 represents a halogen atom, m represents an integer of 0 to 11, and m represents an integer of 0 to 10.