Abstract: A method for manufacturing a light emitting device includes: joining a light transmissive substrate and two or more light emitting elements; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces; mounting the one or more of the light emitting elements joined to the one of the light transmissive pieces on a mounting unit; removing a portion of the one of the light transmissive pieces such that a top surface of the one of the light transmissive pieces becomes a predetermined shape; and after the removing of the portion of the one of the light transmissive pieces, separating the mounting unit into a plurality of board pieces such that one or more of the light transmissive pieces remain on one of the board pieces.

Abstract: A method for manufacturing a light emitting device includes: joining a light transmissive substrate and light emitting elements with top surfaces of the light emitting elements facing a bottom surface of the light transmissive substrate; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces after separation; mounting the light emitting element joined to the light transmissive piece on a mounting unit, with a bottom surface of the light emitting element facing a top surface of the mounting unit; removing a portion of the light transmissive piece such that a top surface of the light transmissive piece becomes a predetermined shape; and providing a light reflective member around the top surface of the light transmissive piece that remains after the portion of the light transmissive piece is removed.

Abstract: A method for manufacturing a light emitting device includes: joining a light transmissive substrate and light emitting elements with top surfaces of the light emitting elements facing a bottom surface of the light transmissive substrate; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces after separation; mounting the light emitting element joined to the light transmissive piece on a mounting unit, with a bottom surface of the light emitting element facing a top surface of the mounting unit; removing a portion of the light transmissive piece such that a top surface of the light transmissive piece becomes a predetermined shape; and providing a light reflective member around the top surface of the light transmissive piece that remains after the portion of the light transmissive piece is removed.

Abstract: A light-emitting device includes a light-emitting element, a phosphor layer, a reflective film, and a light-transmissive member. The light emitting element emits first light. The phosphor layer is provided on a light-emitting surface of the light-emitting element, and contains a phosphor being excited by the first light to emit second light with a wavelength longer than a wavelength of the first light. The reflective film is provided on the phosphor layer, reflects the contact with the reflective film.

Abstract: A method for manufacturing a light distribution member has steps of providing a plurality of first light blocking film members, each of which including a first light blocking film covering a surface of a light-transmissive board, bonding a plurality of first light blocking film members, such that each first light blocking film is sandwiched between light-transmissive boards of adjacent first light blocking film members, to form a first bonded body, and cutting the first bonded body in a direction perpendicular to a lamination surface of the first light blocking film members so as to form a plurality of slices.

Abstract: An optical component includes a phosphor member, an optical filter arranged over the phosphor member at a light extraction side of the phosphor member, and a light scattering member arranged on over the optical filter. An excitation spectrum of the phosphor member has a first local maximum wavelength in the visible region and a second local maximum wavelength in the ultraviolet region. The optical filter is configured to reflect a portion of light at the first local maximum wavelength and a portion or all of light at the second local maximum wavelength.

Abstract: A method for manufacturing light distribution members includes: preparing a joined body in which a plurality of transmissive plates are joined with a light shield part being interposed between adjacent ones of the transmissive plates; fixing a light-shielding frame to the joined body so as to surround an outer periphery of the joined body as seen from one direction; and cutting the joined body and the light-shielding frame perpendicularly to a surface of the joined body to which the light-shielding frame is fixed, thereby obtaining a plurality of light distribution members each having a plurality of transmissive pieces.

Abstract: The light emitting device comprising a light emitting element; and a wavelength converting member having a first face and a second face, in which light emitted from the light emitting element enters in through the first face, and a part of the second face serves as a light emitting face, wherein the light emitting element further comprises a reflection control structure around the light emitting face of the second face, and the reflection control structure comprises a reflection film on the wavelength converting member and an anti-reflection film on the reflection film.

Abstract: A method for manufacturing a light distribution member has steps of providing a plurality of first light blocking film members, each of which including a first light blocking film covering a surface of a light-transmissive board, bonding a plurality of first light blocking film members, such that each first light blocking film is sandwiched between light-transmissive boards of adjacent first light blocking film members, to form a first bonded body, and cutting the first bonded body in a direction perpendicular to a lamination surface of the first light blocking film members so as to form a plurality of slices.

Abstract: The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer.

Abstract: The light emitting device comprising a light emitting element; and a wavelength converting member having a first face and a second face, in which light emitted from the light emitting element enters in through the first face, and a part of the second face serves as a light emitting face, wherein the light emitting element further comprises a reflection control structure around the light emitting face of the second face, and the reflection control structure comprises a reflection film on the wavelength converting member and an anti-reflection film on the reflection film.

Abstract: The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer.