Patents by Inventor Dai-Wen TANG

Dai-Wen TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for manufacturing a spacer with desired profile in an advanced patterning process
    Patent number: 9741566
    Abstract: Embodiments herein provide apparatus and methods for performing an etching process on a spacer layer with good profile control in multiple patterning processes. In one embodiment, a method for patterning a spacer layer during a multiple patterning process includes conformally forming a spacer layer on an outer surface of a patterned structure disposed on a substrate, wherein the patterned structure has having a first group of openings defined therebetween and etching the spacer layer disposed on the substrate while forming an oxidation layer on the spacer layer.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: August 22, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Dai-Wen Tang, Hui Sun, Chung Liu, Benjamin Schwarz
  • METHODS FOR MANUFACTURING A SPACER WITH DESIRED PROFILE IN AN ADVANCED PATTERNING PROCESS
    Publication number: 20160293420
    Abstract: Embodiments herein provide apparatus and methods for performing an etching process on a spacer layer with good profile control in multiple patterning processes. In one embodiment, a method for patterning a spacer layer during a multiple patterning process includes conformally forming a spacer layer on an outer surface of a patterned structure disposed on a substrate, wherein the patterned structure has having a first group of openings defined therebetween and etching the spacer layer disposed on the substrate while forming an oxidation layer on the spacer layer.
    Type: Application
    Filed: February 12, 2016
    Publication date: October 6, 2016
    Inventors: Dai-Wen TANG, Hui SUN, Chung LIU, Benjamin SCHWARZ