Patents by Inventor Dai Xin Peng

Dai Xin Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper clad laminate, prepreg and method of reducing signal loss
    Patent number: 8119225
    Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: February 21, 2012
    Assignee: Ventec Electronics (Suzhou) Company Limited
    Inventors: Dai Xin Peng, Zhuo Wang
  • COPPER CLAD LAMINATE, PREPREG AND METHOD OF REDUCING SIGNAL LOSS
    Publication number: 20100248569
    Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
    Type: Application
    Filed: February 5, 2010
    Publication date: September 30, 2010
    Applicant: Ventec Electronics (Suzhou) company limited
    Inventors: Dai Xin PENG, Zhuo Wang