Patents by Inventor Dai Ying Wu

Dai Ying Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11467637
    Abstract: A modular cooling system can include thermal bridges for separate modules of a computer system that passively transfer heat away from heat sources of the modules. The thermal bridges can be thermally connected to a cold plate having a fluid path for liquid coolant. The cold plate can be positioned in, or linked to, a cooling dock having a pump and at least one cooling element such as a radiator or fan system. Heat from separate modules can be passively transferred via thermal bridges to cold plates, where liquid pumped through the cold plates can transfer the heat to the cooling elements of the cooling dock to be dissipated.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: October 11, 2022
    Assignee: Wuxi Kalannipu Thermal Management Technology Co., Ltd.
    Inventors: Peng Cheng, Dai Ying Wu, Zhe Wen
  • Publication number: 20200042053
    Abstract: A modular cooling system can include thermal bridges for separate modules of a computer system that passively transfer heat away from heat sources of the modules. The thermal bridges can be thermally connected to a cold plate having a fluid path for liquid coolant. The cold plate can be positioned in, or linked to, a cooling dock having a pump and at least one cooling element such as a radiator or fan system. Heat from separate modules can be passively transferred via thermal bridges to cold plates, where liquid pumped through the cold plates can transfer the heat to the cooling elements of the cooling dock to be dissipated.
    Type: Application
    Filed: July 25, 2019
    Publication date: February 6, 2020
    Inventors: Peng Cheng, Dai Ying Wu, Zhe Wen
  • Patent number: 10191521
    Abstract: A cooling system for computer systems includes one or more cooling hubs and one or more heat spreading devices. The heat spreading devices have nodes and paths defining inner pathways that enclose a two-phase working fluid. The nodes and paths network acts as links for the two-phase working fluid to absorb and transfer thermal energy from the heat-generating components of the electronic device to the cooling hub. The hub-link structure decouples the direct geometrical relationship between heating components and cooling sources to enable a higher degree of design freedom, space management, and cooling redundancy.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: January 29, 2019
    Assignee: Coolanyp, LLC
    Inventors: Peng Cheng, Dai Ying Wu
  • Publication number: 20180341298
    Abstract: A cooling system for computer systems includes one or more cooling hubs and one or more heat spreading devices. The heat spreading devices have nodes and paths defining inner pathways that enclose a two-phase working fluid. The nodes and paths network acts as links for the two-phase working fluid to absorb and transfer thermal energy from the heat-generating components of the electronic device to the cooling hub. The hub-link structure decouples the direct geometrical relationship between heating components and cooling sources to enable a higher degree of design freedom, space management, and cooling redundancy.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 29, 2018
    Inventors: Peng Cheng, Dai Ying Wu