Patents by Inventor Dai YOSHII
Dai YOSHII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11710685Abstract: The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.Type: GrantFiled: October 27, 2020Date of Patent: July 25, 2023Assignee: Mitsubishi Electric CorporationInventors: Dai Yoshii, Hantaro Ozawa
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Patent number: 11569148Abstract: In this semiconductor device, a positioning protrusion is formed at a side surface of a sealing resin from which one end of a main electrode wire protrudes. Thus, the outer size of the sealing resin can be reduced as compared to a case where a positioning protrusion is formed at the bottom of the sealing resin. In addition, a thickness regulating protrusion is provided with a space from solder. Thus, it is possible to prevent interface separation or crack that would occur starting from a contact part between the thickness regulating protrusion and the solder, whereby the life of a joining part between a semiconductor module and a cooler can be ensured. Accordingly, a semiconductor device having enhanced heat dissipation property and reliability is obtained without increase in the outer size of the semiconductor module.Type: GrantFiled: August 2, 2021Date of Patent: January 31, 2023Assignee: Mitsubishi Electric CorporationInventors: Koki Hayakashi, Ryuichi Ishii, Dai Yoshii
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Publication number: 20220262761Abstract: The semiconductor device includes: a semiconductor element including a body portion formed in a plate shape, a protection film provided at an outer periphery on one surface of the body portion, and a metal thin film provided adjacently to an inner side of the protection film on the one surface of the body portion; a metal member joined to a surface of the metal thin film on a side opposite to the body portion, by solder; and a mold resin sealing the semiconductor element and the metal member, wherein the surface of the metal thin film on the side opposite to the body portion has, on at least a part of an outer periphery thereof, a projection portion projecting from the surface of the metal thin film, and the solder is not provided on an outer peripheral side from a top of the projection portion.Type: ApplicationFiled: July 29, 2021Publication date: August 18, 2022Applicant: Mitsubishi Electric CorporationInventors: Tatsuya KITAGAWA, Shin UEGAKI, Masao AKIYOSHI, Masaaki TARUYA, Dai YOSHII, Kazuhiro TADA
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Publication number: 20220139803Abstract: In this semiconductor device, a positioning protrusion is formed at a side surface of a sealing resin from which one end of a main electrode wire protrudes. Thus, the outer size of the sealing resin can be reduced as compared to a case where a positioning protrusion is formed at the bottom of the sealing resin. In addition, a thickness regulating protrusion is provided with a space from solder. Thus, it is possible to prevent interface separation or crack that would occur starting from a contact part between the thickness regulating protrusion and the solder, whereby the life of a joining part between a semiconductor module and a cooler can be ensured. Accordingly, a semiconductor device having enhanced heat dissipation property and reliability is obtained without increase in the outer size of the semiconductor module.Type: ApplicationFiled: August 2, 2021Publication date: May 5, 2022Applicant: Mitsubishi Electric CorporationInventors: Koki HAYAKASHI, Ryuichi Ishii, Dai Yoshii
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Publication number: 20210175158Abstract: The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.Type: ApplicationFiled: October 27, 2020Publication date: June 10, 2021Applicant: Mitsubishi Electric CorporationInventors: Dai YOSHII, Hantaro OZAWA
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Patent number: 10597069Abstract: A connector structure that is joined to a housing so as to form the control unit includes a connector main body in which a connector is formed, a terminal including a power supply system and a signal system, and a component mounting portion including at least one of a capacitor and a coil, wherein the component mounting portion is provided parallel to a motor output shaft on the exterior of a motor or the housing, and the at least one of the capacitor and the coil included in the component mounting portion is electrically connected directly to the connector of the connector main body via the terminal.Type: GrantFiled: November 14, 2014Date of Patent: March 24, 2020Assignee: Mitsubishi Electric CorporationInventors: Hisashi Koike, Masaaki Tanigawa, Dai Yoshii
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Patent number: 10217683Abstract: A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.Type: GrantFiled: May 13, 2015Date of Patent: February 26, 2019Assignee: Mitsubishi Electric CorporationInventors: Dai Yoshii, Masaaki Tanigawa, Kensuke Takeuchi
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Publication number: 20180053700Abstract: A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.Type: ApplicationFiled: May 13, 2015Publication date: February 22, 2018Applicant: Mitsubishi Electric CorporationInventors: Dai YOSHII, Masaaki TANIGAWA, Kensuke TAKEUCHI
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Publication number: 20170305457Abstract: A connector structure that is joined to a housing so as to form the control unit includes a connector main body in which a connector is formed, a terminal including a power supply system and a signal system, and a component mounting portion including at least one of a capacitor and a coil, wherein the component mounting portion is provided parallel to a motor output shaft on the exterior of a motor or the housing, and the at least one of the capacitor and the coil included in the component mounting portion is electrically connected directly to the connector of the connector main body via the terminal.Type: ApplicationFiled: November 14, 2014Publication date: October 26, 2017Applicant: Mitsubishi Electric CorporationInventors: Hisashi KOIKE, Masaaki TANIGAWA, Dai YOSHII