Patents by Inventor Dai Yui
Dai Yui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6345916Abstract: The present invention provides a fiber optic connector comprising a fiber pressing member and a substrate having a part A with multiple fiber arranging grooves in which bare portion of optical fibers are fixed, and a part B in which coated portion of optical fibers are fixed, and its manufacturing method. The connector enables to prevent an increase in transmission loss or breakage of the optical fibers by reducing the localized stress on the fibers from the rear end of the fiber pressing member and the rear end edge of the fiber arranging grooves.Type: GrantFiled: November 23, 1999Date of Patent: February 12, 2002Assignee: Sumitomo Electric Industries, Ltd.Inventors: Dai Yui, Kei Sunaga, Teruo Ikechi, Hidetoshi Ishida, Manabu Shiozaki, Takashi Sasaki, Kohei Kobayashi
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Patent number: 6299361Abstract: The invention has an object to provide a method of making an optical fiber array in which bare fibers obtained by removing a coating of an optical fiber ribbon can be certainly arrayed on a V-groove substrate. A first feature of the invention is to use a positioning guide, and the positioning guide is provided with a recess portion having inclined wall surfaces, and its bottom portion is made to have a width equal to the whole width of the bare fibers in an arrayed state. By using this positioning guide, the optical fiber array can be made in a process as follows. In a state where bare fibers exposed by removing part of coating of tip portions of two fiber ribbons are alternately arranged, the positioning guide is raised from below. The bare fibers with irregular gaps are moved by the positioning guide and are arranged. In this state, the bare fibers are pressed by a fiber pressing member from above, and the V-groove substrate is raised, so that they are put on V grooves and are fixed by an adhesive.Type: GrantFiled: September 8, 1999Date of Patent: October 9, 2001Assignee: Sumitomo Electric Industries, Ltd.Inventors: Takashi Sasaki, Teruaki Nishida, Hidetoshi Ishida, Dai Yui, Kei Sunaga
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Patent number: 5999674Abstract: The present invention relates to an optical waveguide module constructed in the structure that can reduce the number of package components for housing an optical waveguide device for optically interconnecting optical fibers and that can protect the optical waveguide device against stress caused by change of ambient temperature and against impact acting from the outside. This waveguide module comprises a reinforcing member directly adhered to a buffer protector covering the optical waveguide device. This reinforcing member is a plate member bent so that the both ends face each other, and it houses the whole of the optical waveguide device covered by the buffer protector in the internal space thereof.Type: GrantFiled: September 25, 1997Date of Patent: December 7, 1999Assignee: Sumitomo Electric Industries, Ltd.Inventors: Dai Yui, Masahide Saitou
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Patent number: 5696860Abstract: An optical device module comprises a module body including an optical device, a first fiber connector holding a first optical fiber, coupled to one end of the optical device, and a second fiber connector holding a second optical fiber, coupled to the other end of the optical device; and an enclosure body integrally molded with a resin such as an epoxy resin, an urethan resin to coat the module body. Almost the whole module body is coated with the integrally molded epoxy resin, so that the module body is protected efficiently from external heat, moisture, mechanical shock etc.Type: GrantFiled: December 28, 1994Date of Patent: December 9, 1997Assignee: Sumitomo Electric Industries, Ltd.Inventors: Shigeru Semura, Masahide Saito, Dai Yui, Shigeru Hirai, Shinji Ishikawa
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Patent number: 5673345Abstract: The present invention relates to a package in which an optical waveguide module is mounted, at least having such structure as to reduce influence of expansion or contraction (thermal stress) of a metal housing, caused with a temperature change of the external environment and applied on junction parts between an optical waveguide substrate and members for fixedly supporting tip portions of input and output optical fibers. This package comprises a cavity for housing the whole of the optical waveguide module as covered with a buffer protection material, and a metal housing having through holes for leading the above optical fibers to the outside. Particularly, the optical fibers and the through holes are bonded and secured with a filler having higher airtightness than the buffer protection material and having a lower tensile modulus than a metal material forming the housing.Type: GrantFiled: April 18, 1996Date of Patent: September 30, 1997Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masahide Saito, Shigeru Semura, Shinji Ishikawa, Dai Yui, Hiroo Kanamori
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Patent number: 5513290Abstract: There is disclosed a coupling structure of optical fibers and optical waveguides, comprising optical fibers; an optical fiber arranging connector having a first and second members, the optical fibers being sandwiched by the first and second members to be fixed in the optical fiber arranging connector; a waveguide device having a waveguide substrate, optical waveguides being formed on a surface of the waveguide device, ends of the waveguides and ends of being aligned with each other by abutting end faces thereof against each other; an adhesive interposed and set between said end faces, the adhesive being a photo-setting adhesive, the first member being made of a material preventing light having a wavelength capable of setting said adhesive from passing therethrough, and in at least part of a region where the end faces of the optical fiber arranging connector and the waveguide device oppose to each other, at least one of the optical fiber arranging connector and the waveguide device in the vicinity of the end fType: GrantFiled: February 6, 1995Date of Patent: April 30, 1996Assignee: Sumitomo Electric Industries, Ltd.Inventors: Shinji Ishikawa, Hiroshi Suganuma, Dai Yui, Shigeru Semura, Masahide Saito, Shigeru Hirai
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Patent number: 5481632Abstract: An optical waveguide module according to the present invention comprises an optical waveguide substrate having an optical waveguide formed therein, an optical waveguide holder for mounting the optical waveguide substrate thereon, an optical fiber connector supporting an optical fiber therein, and an optical fiber holder for mounting the optical fiber connector thereon, the end faces of the optical waveguide holder and the optical fiber holder are brought into contact with each other while aligning the optical waveguide and the optical fiber, the end faces of the optical waveguide substrate and the optical fiber connector are bonded at least partially through a gap, and a hardening matching agent having a refractive index matching with those of the optical waveguide and the optical fiber is filled in the gap.Type: GrantFiled: May 25, 1994Date of Patent: January 2, 1996Assignee: Sumitomo Electric Industries, Ltd.Inventors: Shigeru Hirai, Kazunori Kurima, Masahide Saito, Dai Yui, Tomoyuki Hattori, Hiroshi Suganuma
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Patent number: 5471306Abstract: A method for assembling an optical isolator comprises a step for constructing a measuring system in which a light source, a lens system, a polarizer, an analyzer, and a light receiver are arranged in this order, and light projected from the light source and then transmitted through the lens system, the polarizer, and the analyzer, is received by the light receiver; a step for arranging optical elements for constituting a main body of the optical isolator between the polarizer and the analyzer; a step for measuring a maximum value and a minimum value in levels of the light received by the light receiver while the analyzer is rotated, thereby calculating a ratio of the minimum value to the maximum value; and a step for adjusting rotation positions of the respective components for constituting the main body of the optical isolator in order that the ratio becomes minimal.Type: GrantFiled: August 26, 1994Date of Patent: November 28, 1995Assignee: Sumitomo Electric Industries, Ltd.Inventors: Dai Yui, Shigeru Hirai, Shigeru Semura
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Patent number: 5463708Abstract: The present invention is directed to an optical waveguide module which is arranged to be free from a breakage of a coupling part of an optical waveguide and optical fibers which are housed in a housing and deviation of an optical axis at this coupling part even though a tensile force is applied to optical fibers. A waveguide board having an optical waveguide is housed in a housing and an optical connector to which bare optical fibers are connected is bonded to an end face of the waveguide board to form a first holding part. An optical fiber conductor and an optical fiber tape are introduced into the housing through a side wall of the housing, and the covering parts of the optical fiber conductor and an optical fiber tape are bonded to the side wall of the housing with a bonding agent to form a second holding part. The bonding strength of the second holding part is determined to be larger than the bonding strength of the first holding part.Type: GrantFiled: June 22, 1994Date of Patent: October 31, 1995Assignee: Sumitomo Electric Industries, Ltd.Inventors: Dai Yui, Hiroshi Suganuma, Shinji Ishikawa, Shigeru Semura
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Patent number: 5444804Abstract: It is an object of the present invention to provide an optical waveguide module in which, under the high temperature and high humidity, degradation of characteristics does not occur and which has strength to the oscillation, simple structure, and high reliability. A module unit 30 is formed by bonding a connector 32 provided at one end of a single-optical fiber cable 22 and a connector 31 provided at one end of a ribbon optical fiber cable 21 at both ends of a waveguide substrate 35 having a 1.times.4 branch optical waveguide by an adhesive having light transmission properties. The module unit 30 is provided in a housing 10, and at least a connecting portion between the optical waveguide and the optical fiber cable is covered with the resin contained in the housing 10. The housing 10 is sealed with a cover unit 15, and the single-optical fiber cable 22 and the ribbon optical fiber cable 21 are tightly inserted into a respective hole at end walls of the housing 10 and led out to the outside.Type: GrantFiled: July 29, 1994Date of Patent: August 22, 1995Assignee: Sumitomo Electric Industries, Ltd.Inventors: Dai Yui, Shinji Ishikawa, Hiroshi Suganuma, Shigeru Semura
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Patent number: 5408491Abstract: An optical isolator comprising first through fourth plate-like birefringent substances. Each plate-like birefringent substance receives and transmits incident light, and has a corresponding optical axis which is inclined with respect to a direction of the incident light. The optical isolator also has first and second magneto-optical materials, each for rotating a plane of polarization of the incident light. The optical axis of the second plate-like birefringent substance is rotated by one of -45.degree. and 135.degree. about a first axis which is perpendicular to a surface of the first plate-like birefringent substance. The optical axis of the third plate-like birefringent substance is rotated by one of 45.degree. and 225.degree. about a second axis which is perpendicular to the surface of the first plate-like birefringent substance. The optical axis of the fourth plate-like birefringent substance is rotated by one of -90.degree. and 90.degree.Type: GrantFiled: February 17, 1994Date of Patent: April 18, 1995Assignee: Sumitomo Electric Industries, Ltd.Inventors: Shigeru Hirai, Shigeru Semura, Dai Yui